BD6025GU-E2 [ROHM]
Power Management Circuit, PBGA64,;
| 型号： | BD6025GU-E2 |
| 厂家： | 
ROHM |
| 描述： | Power Management Circuit, PBGA64, |
| 文件： | 总5页 (文件大小：154K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Structure
Silicon Monolithic Integrated Circuit
Product Name
Power supply for CCD camera / White LED driver / RGB LED driver
for mobile phone
Type
BD6025GU
Features
A system power supply for the CCD camera module
Built-in white LED driver and RGB LED driver
○Absolute Maximum Ratings (Ta=25 oC)
Parameter
Symbol
VMAX1
VMAX2
VMAX3
VMAX4
VMAX5
Pd
Rating
20(*1)
16(*2)
15(*3)
-13.5(*4)
6(*5)
2413(*6)
-30 to 85
-55 to 150
Unit
V
V
V
V
V
Condition
Maximum Applied Voltage 1
Maximum Applied Voltage 2
Maximum Applied Voltage 3
Maximum Applied Voltage 4
Maximum Applied Voltage 5
Power Dissipation
mW
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
oC
oC
(*1) VPLUS11, VPLUS12, SBD, SBDSENS, VPLUS2 pin
(*2) CAMP, CAMPS pin
(*3) LEDR, LEDG, LEDB, BKLED, FLED1 pin (*4) VNEG, CAMN, CAMNS pin
(*6) Power dissipation deleting is 19.3mW/ oC, when it’s used in over 25 oC.
(It’s deleting is on the board that is ROHM’s standard)）
(*5) Except Note1~Note4 pin
○Recommended operating conditions (VBAT≥VIO, Ta=-30 to 85 oC)
Rating
Parameter
Symbol
Unit
Condition
Min.
2.7
1.62
Typ.
3.6
-
Max.
4.5
3.3
VBAT input voltage
VIO input voltage
VBAT
VIO
V
V
This product isn’t designed to protect itself against radioactive rays.
REV. C
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○Electrical Characteristics
Unless otherwise specified, Ta=25 oC, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V
Spec
Typ.
Parameter
Circuit Current
Symbol
Unit
Condition
Min.
Max.
VBAT Circuit current 1
VBAT Circuit current 2
VBAT Circuit current 3
IQ1
IQ2
IQ3
-
-
-
0.5
0.1
6.2
3.0
3.0
9.3
µA
µA
µA
RSTB=0V
RSTB=0V, VIO=0V
REGVCC ON (Energy save mode)
REGVCC ON (Energy save mode)
REG1 ON (Energy save mode)
REG2 ON (Energy save mode)
REGVCC ON (Nomal Mode)
SWREG1 ON (Vo=14V, Io=1mA)
(Add 30h=01h, Add 80h=01h)
REGCP ON, REGCN ON
VBAT Circuit current 5
IQ5
-
11
16
µA
VBAT Circuit current 8
IQ8
-
17
26
mA
SWREG1
( DC/DC for White LED and Power supply for Camera )
FLED1 drive current 3
BKLED drive current 3
IFLED13
IBKLED3
27.0
27.0
30.0
30.0
33.0
33.0
mA
mA
Add=80h Data=1Eh
Add=90h Data=1Eh
SWREG2
( DC/DC for RGB LED )
LEDR Drive current
(Large current)
LEDG Drive current
(Large current)
LEDB Drive current
(Large current)
Add=A0h Data=0Ch
Add=50h Data=1Eh
Add=A0h Data=0Ah
Add=60h Data=1Eh
Add=A0h Data=09h
Add=70h Data=1Eh
ILEDR22
ILEDG22
ILEDB22
135
135
135
150
150
150
165
165
165
mA
mA
mA
REGCP
(15V/13V/12V LDO)
Io=60mA, VPLUS12=16V
Output voltage 1
VO151
VO152
VO153
14.5
12.5
11.5
15.0
13.0
12.0
15.5
13.5
12.5
V
V
V
REGCPVSEL1=0, REGCPVSEL2=0
Io=60mA, VPLUS12=15V
Output voltage 2
Output voltage 3
REGCPVSEL1=1, REGCPVSEL2=0
Io=60mA, VPLUS12=15V
REGCPVSEL1=1, REGCPVSEL2=1
REGCN
(-8V/-7.5/-7V LDO)
Io=50mA, VNEG=-10V
Output voltage 1
VO81
VO82
VO83
-8.5
-8.0
-7.5
-8.0
-7.5
-7.0
-7.5
-7.0
-6.5
V
V
V
REGCNVSEL1=0, REGCNVSEL2=0
Io=50mA, VNEG=-10V
Output voltage 2
Output voltage 3
REGCNVSEL1=1/0, REGCNVSEL2=1
Io=50mA, VNEG=-9V
REGCNVSEL1=1, REGCNVSEL2=0
REG1
(3.0V/3.1V LDO)
Output voltage 2
VO12
VO22
3.04
1.74
3.1
1.8
3.16
1.86
V
V
Io=150mA, REG1VSEL=1,REG1MD=1
Io=100mA, REG2VSEL=H,REG2MD=1
REG2
(1.2V/1.8V LDO)
Output voltage 3
REV. C
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○External dimensions
○Terminals
PIN
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
C1
C2
PIN Name
PIN
C9
PIN Name
CAMPS
PIN
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
-
PIN Name
T1
VIO
TESTI
Type
GND2
VBAT1
LEDR
C10
D1
CAMP
REG2CNT
SENSN2
TESTO
REG2O
VBAT8
TESTVCC
VBAT4
VBAT3
LEDCTL
REG1CNT
VREF
REG2VSEL
VCC
BD6025GU
D2
GND3
LEDB
D9
GND12
FLED1
TRSW1
SENSP1
GND9
SBD
D10
E1
LOT No.
CAMN
VNEG
GND6
T2
E2
E9
E10
F1
VPLUS2
GND1
VBAT2
TRSW2
LEDG
T4
F2
GND13
VBAT7
BKLED
GND11
VBAT6
GND10
VPLUS11
SENSN1
T3
F9
F10
G1
G2
G9
G10
H1
REG1O
RSTB
GND4
CAMNS
GND5
GND7
VPLUS12
SENSP2
GND14
CLK
SBDSENS
IREF
(Ф0.15) INDEX POST
DATA
H2
STRB
H9
GND8
-
H10
VBAT5
-
-
VCSP85H5 (64PIN) (Unit : mm)
○Block diagram
VBAT1～8
SWREG1
SWREG2
Driver
TRSW1
PWM
Comp
TRSW2
PWM
Comp
Driver
SENSP1
SENSN1
+
-
+
-
SENSP2
Current
Limiter
-
+
Current
Limiter
+
-
OSC
SENSN2
VPLUS2
Over Voltage
DET
OSC
+
-
Over Voltage
DET
-
+
ERR
Amp
-
+
ERR
Amp
VPLUS11
-
+
SEL
LEDB
LEDG
LEDR
SEL
BKLED
FLED1
TESTO
VREF
Reference
Voltage
VREF
IREF
VPLUS12
Reference
Current
IREF
VCC
LDO
2.45V
VPLUS11
CPU I/F
Clamp
LDO
SBD
SBDSENS
Power
Supply
RSTB
VNEG
VIO
REG1CNT
REGCP
LDO
15V/13V/12V
VPLUS12
CPU I/F
REG2CNT
CAMP
CAMPS
REG2VSEL
REGCN
VNEG
LDO
-8V/-7.5V/-7V
CAMN
CPU I/F
Level
Shift
CAMNS
REG1
CLK
LDO
3.0V/3.1V
REG1O
REG2O
CPU I/F
CPU I/F
DATA
STRB
REG2
Control
Logic
LDO
1.2V/1.8V
LEDCTL
T1
T2
T3
TESTI
TESTVCC
T4
GND1～14
REV. C
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○Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and GND lines.
Especially, when there are GND pattern for small signal and GND pattern for large current included the external
circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor
between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be
sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a
low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD)circuit. A thermal shutdown circuit works when the junction temperature
is beyond detection temperature. Then, a part of the LSI or all is made a state of off. The thermal shutdown circuit,
which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or
guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming
its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd)
in actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited
because it has the possibility that a operation becomes unstable.
(11) DC/DC converter
Please select the low DCR inductors to decrease power loss for DC/DC converter. Please choose the external parts
not to exceed "Maximum Ratings" of the coil, the switching transistor, the diode and the resistance for the electric
current detection".
(12) Other cautions on use
Please consult supplementary documents such as technical notebook, function manual and application notebook of
this LSI.
REV. C
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
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may result in a direct threat to human life or create a risk of human injury (such as a medical
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