2SJ559-T1 [RENESAS]

2SJ559-T1;
2SJ559-T1
型号: 2SJ559-T1
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

2SJ559-T1

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April 1st, 2010  
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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SJ559  
P-CHANNEL MOS FIELD EFFECT TRANSISTOR  
FOR HIGH SPEED SWITCHING  
DESCRIPTION  
PACKAGE DRAWING (Unit: mm)  
The 2SJ559 is a switching device which can be driven directly by a  
2.5 V power source.  
+0.1  
–0  
+0.1  
0.3  
0.15  
–0.05  
The 2SJ559 has excellent switching characteristics, and is suitable  
for use as a high-speed switching device in digital circuits.  
0 to 0.1  
FEATURES  
1
Can be driven by a 2.5 V power source.  
Low gate cut-off voltage.  
+0.1  
–0  
0.2  
0.5  
0.6  
0.5  
0.75 0.05  
ORDERING INFORMATION  
1.0  
1.6 0.1  
PART NUMBER  
2SJ559  
PACKAGE  
1: Source  
2: Gate  
SC-75 (USM)  
3: Drain  
Marking: C1  
ABSOLUTE MAXIMUM RATINGS (TA = 25°
EQUIVALENT CIRCUIT  
30  
m20  
m0.1  
m0.4  
200  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current (DC)  
SS  
ID(DC)  
ID(pulse)  
PT  
V
V
A
Drain  
Body  
Drain Current (pulse) Note1  
Total Power Dissipation Note2  
Channel Temperature  
A
Diode  
Gate  
mW  
°C  
°C  
Gate  
Tch  
150  
55 to +150  
Protection  
Diode  
Storage Temperature  
Tstg  
Source  
Notes 1. PW 10 µs, Dty Cycle 1%  
2. Mounted on ceramic substrate of 3.0 cm2 x 0.64 mm  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage exceeding  
the rated voltage may be applied to this device.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. D13801EJ2V0DS00 (2nd edition)  
The mark shows major revised points.  
Date Published November 2004 NS CP(K)  
Printed in Japan  
1999  
2SJ559  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 30 V, VGS = 0 V  
MIN. TYP. MAX. UNIT  
1.0  
µA  
µA  
V
IGSS  
VGS = m20 V, VDS = 0 V  
VDS = 3.0 V, ID = 10 µA  
VDS = 3.0 V, ID = 10 mA  
VGS = 2.5 V, ID = 1.0 mA  
VGS = 4.0 V, ID = 10 mA  
VGS = 10 V, ID = 10 mA  
VDS = 3.0 V  
m10  
1.0  
1.4 1.7  
Gate Cut-off Voltage  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
RDS(on)3  
Ciss  
Note  
Forward Transfer Admittance  
20  
mS  
Note  
Drain to Source On-state Resistance  
23  
11  
60  
23  
13  
6.0  
5.0  
15  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
Coss  
VGS = 0 V  
Crss  
f = 1 MHz  
1.3  
140  
330  
220  
320  
VDD = 3.0 V  
ID = 10 mA  
VGS = 4.0 V  
RG = 10  
td(on)  
tr  
Turn-off Delay Time  
Fall Time  
td(off)  
tf  
Note Plused  
TEST CIRCUIT SWITCHING TIME  
D.U.T.  
V
GS()  
R
L
90%  
V
GS  
V
GS  
Wave Form  
RG  
PG.  
V
DD  
90%  
90%  
10%  
I
D
V
0
GS()  
10%  
0
orm  
t
d(on)  
t
r
t
d(off)  
t
f
τ
t
on  
t
off  
τ = 1  
µ
s
Duty Cycle 1%  
2
Data Sheet D13801EJ2V0DS  
2SJ559  
TYPICAL CHARACTERISTICS (TA = 25°C)  
TOTAL POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
240  
–100  
–80  
Pulsed  
Mounted on ceramic substrate  
of 3.0 cm2 x 0.64 mm  
200  
V
GS = –10 V  
GS = –6 V  
GS = –4 V  
160  
120  
80  
40  
0
V
–60  
V
V
GS = –3 V  
–40  
–20  
0
V
GS = –2.5 V  
0
30  
60  
90  
120  
150  
180  
210  
0
–1  
–2  
–3  
–4  
–5  
TA  
- Ambient Temperature - ˚C  
VDS - Drairce Voltage - V  
RD TRANSFER ADMITTANCE vs.  
N CURRENT  
TRANSFER CHARACTERISTICS  
100
100  
–100  
= –3 V  
V
DS = –3 V  
lsed  
Pulsed  
–10  
–1  
TA  
= 125˚C  
A = 75˚C  
T
TA  
= –25˚C  
TA  
= 25˚C  
TA = 25˚C  
TA  
= –25˚C  
–0.1  
10  
1
TA = 75˚C  
–0.01  
TA  
= 125˚C  
–0.001  
–0.1  
–1  
–10  
–100  
–1000  
0
–0.8  
–1.6  
–2.4  
–4.0  
ID - Drain Current - mA  
VGS - Gate to Source V
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
DRAIN TO SOUON-STATE RESISTANCE vs.  
DRAIN CURRENT  
60  
60  
V
GS = –4 V  
V
GS = –2.5 V  
Pulsed  
Pulsed  
50  
40  
50  
40  
TA  
= 125˚C  
TA = 75˚C  
30  
30  
TA  
= 125˚C  
T
A = 75˚C  
20  
10  
20  
10  
0
T
A
= 25˚C  
TA  
= –25˚C  
T
A
= 25˚C  
TA  
= –25˚C  
0
–0.1  
–1  
I
–10  
–100  
–1000  
–0.1  
–1  
I
–10  
–100  
–1000  
D - Drain Current - mA  
D - Drain Current - mA  
3
Data Sheet D13801EJ2V0DS  
2SJ559  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
60  
50  
60  
50  
40  
30  
20  
10  
0
V
GS  
Pulesd  
=
–10 V  
Pulsed  
I
D
=
=
=
–1 mA  
40  
30  
ID  
–10 mA  
–100 mA  
ID  
T
A
=
75˚C  
TA  
=
25˚C  
20  
10  
0
TA = –25˚C  
TA  
=
125˚C  
–0.1  
–1  
–10  
–100  
–1000  
0
–2  
–4  
–6  
–8  
–10  
I
D - Drain Current - mA  
VGS - Gate to Source Voltage - V  
CAPACITANCE vs.  
DRAIN TO SOURCE VOLTAGE  
HING CHARACTERISTICS  
100  
10  
1
1000  
V
GS = 0 V  
f = 1 MHz  
tr  
tf  
C
oss  
iss  
td(on)  
100  
C
td(off)  
V
V
= –3 V  
GDDS = –4 V  
C
rss  
R
G
= 10  
10  
–10  
–100  
D - Drain Current - mA  
–1000  
–1  
–10  
V
DS - Drain to Source Voltag
I
SOURAIN DIODE  
FOROLTAGE  
–1000  
V
GS = 0 V  
Pulsed  
–100  
–10  
–1  
–0.1  
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–1.2  
VSD - Source to Drain Voltage - V  
4
Data Sheet D13801EJ2V0DS  
2SJ559  
The information in this document is current as of November, 2004. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data  
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not  
all products and/or types are available in every country. Please check with an NElectronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by ans without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsor any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patpyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Elecproducts listed in this document  
or any other liability arising from the use of such products. No , express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual propertof NEC Electronics or others.  
Descriptions of circuits, software and other related informatiis document are provided for illustrative  
purposes in semiconductor product operation and apn examples. The incorporation of these  
circuits, software and information in the design of a er's equipment shall be done under the full  
responsibility of the customer. NEC Electronics ano responsibility for any losses incurred by  
customers or third parties arising from the use of tcuits, software and information.  
While NEC Electronics endeavors to enhance lity, reliability and safety of NEC Electronics products,  
customers agree and acknowledge that the ty of defects thereof cannot be eliminated entirely. To  
minimize risks of damage to property o(including death) to persons arising from defects in NEC  
Electronics products, customers muporate sufficient safety measures in their design, such as  
redundancy, fire-containment and ae features.  
NEC Electronics products are cinto the following three quality grades: "Standard", "Special" and  
"Specific".  
The "Specific" quality grades only to NEC Electronics products developed based on a customer-  
designated "quality assuogram" for a specific application. The recommended applications of an NEC  
Electronics product deits quality grade, as indicated below. Customers must check the quality grade of  
each NEC Electronuct before using it in a particular application.  
"Standard": Com, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots.  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support).  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC  
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications  
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to  
determine NEC Electronics' willingness to support a given application.  
(Note)  
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its  
majority-owned subsidiaries.  
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as  
defined above).  
M8E 02. 11-1  

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