2SJ567_09 [TOSHIBA]

TOSHIBA Field Effect Transistor Silicon P-Channel MOS Type (MOSV); 东芝场效应晶体管的硅P沟道MOS类型( MOSV )
2SJ567_09
型号: 2SJ567_09
厂家: TOSHIBA    TOSHIBA
描述:

TOSHIBA Field Effect Transistor Silicon P-Channel MOS Type (MOSV)
东芝场效应晶体管的硅P沟道MOS类型( MOSV )

晶体 晶体管 场效应晶体管
文件: 总6页 (文件大小:184K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SJ567  
TOSHIBA Field Effect Transistor Silicon P-Channel MOS Type (π-MOSV)  
2SJ567  
Switching Applications  
Unit: mm  
Chopper Regulator, DC/DC Converter and  
Motor Drive Applications  
6.8 MAX.  
5.2 ± 0.2  
0.6 MAX.  
Low drain-source ON-resistance: R  
= 1.6 (typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 2.0 S (typ.)  
fs  
Low leakage current: I  
= 100 μA (max) (V  
= 200 V)  
DS  
DSS  
0.95 MAX.  
Enhancement model: V = 1.5 to 3.5 V (V  
= 10 V, I = 1 mA)  
D
0.6 ± 0.15  
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
2.3 2.3  
0.6 MAX.  
1
2
3
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
200  
200  
±20  
2.5  
10  
20  
V
V
V
DSS  
2
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
1. GATE  
GS  
DGR  
1
2. DRAIN  
HEAT SINK)  
3. SOURSE  
V
GSS  
3
DC  
(Note 1)  
I
D
Drain current  
A
JEDEC  
Pulse (Note 1)  
I
DP  
JEITA  
SC-64  
Drain power dissipation (Tc = 25°C)  
P
W
D
AS  
AR  
TOSHIBA  
2-7B1B  
Single-pulse avalanche energy  
E
97.5  
mJ  
(Note 2)  
Weight: 0.36 g (typ.)  
Avalanche current  
I
2.5  
2.0  
A
6.5 ± 0.2  
5.2 ± 0.2  
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
0.6 MAX.  
T
150  
ch  
Storage temperature range  
T
55 to 150  
stg  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature,  
etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage,  
etc.) are within the absolute maximum ratings. Please design the  
appropriate reliability upon reviewing the Toshiba Semiconductor  
Reliability Handbook (“Handling Precautions”/“Derating Concept and  
Methods”) and individual reliability data (i.e. reliability test report and  
estimated failure rate, etc).  
1.1 ± 0.2  
0.8 MAX.  
0.6 MAX.  
1.05 MAX.  
0.6 ± 0.15  
1
2
3
2
3
Thermal Characteristics  
2.3 ± 0.15  
2.3 ± 0.15  
1
1. GATE  
2. DRAIN  
HEAT SINK)  
Characteristic  
Symbol  
Max  
Unit  
3. SOURSE  
Thermal resistance, channel to case  
Thermal resistance, channel to ambient  
R
R
6.25  
125  
°C/W  
°C/W  
th (ch-c)  
th (ch-a)  
JEDEC  
Note 1: Ensure that the channel temperature does not exceed 150°C.  
JEITA  
Note 2:  
V
R
= −50 V, Tch = 25°C (initial), L = −25.2 mH, I  
= 25 Ω  
= −2.5 A  
AR  
DD  
TOSHIBA  
2-7J1B  
G
Weight: 0.36 g (typ.)  
Note 3: Repetitive rating: pulse width limited by maximum channel  
temperature  
This transistor is an electrostatic-sensitive device. Handle with care.  
1
2009-07-13  
2SJ567  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
V
= ±16 V, V  
= 0 V  
±10  
100  
μA  
μA  
V
GSS  
GS  
DS  
DS  
Drain cutoff current  
I
= −200 V, V = 0 V  
DSS  
(BR) DSS  
GS  
= 0 V  
Drain-source breakdown voltage  
Gate threshold voltage  
Drain-source ON-resistance  
Forward transfer admittance  
Input capacitance  
V
I
= −10 mA, V  
200  
1.5  
D
GS  
V
V
V
V
= −10 V, I = −1 mA  
3.5  
2.0  
V
th  
DS  
GS  
DS  
D
R
= −10 V, I = −1.5 A  
1.6  
2.0  
410  
40  
Ω
DS (ON)  
Y ⎪  
D
= −10 V, I = −1.5 A  
1.0  
S
fs  
D
C
C
iss  
V
= −10 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
C
145  
oss  
Rise time  
t
r
20  
45  
15  
0 V  
I = −1.5 A V  
D OUT  
V
GS  
10 V  
Turn-on time  
Switching time  
t
on  
R
L
= 66.7 Ω  
ns  
Fall time  
t
f
V
≈ −100 V  
DD  
Duty 1%, t = 10 μs  
w
Turn-off time  
t
85  
10  
off  
Total gate charge  
Q
g
(Gate source plus gate-drain)  
V
≈ −160 V, V  
= −10 V,  
GS  
DD  
nC  
Gate-source charge  
Q
6
4
gs  
I
= −2.5 A  
D
Gate-drain (“Miller”) charge  
Q
gd  
Source-Drain Ratings and Characteristics (Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Continuous drain reverse current (Note 1)  
I
2.5  
10  
2.0  
A
A
DR  
Pulse drain reverse current  
Forward voltage (diode)  
Reverse recovery time  
Reverse recovery charge  
(Note 1)  
I
DRP  
V
I
I
= −2.5 A, V  
= −2.5 A, V  
= 0 V  
V
DSF  
DR  
DR  
GS  
GS  
t
= 0 V,  
135  
0.81  
ns  
μC  
rr  
dI /dt = 100 A/μs  
DR  
Q
rr  
Marking  
Note 4: A line under a Lot No. identifies the indication of product Labels  
[[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]  
J567  
Part No.  
Please contact your TOSHIBA sales representative for details as to  
environmental matters such as the RoHS compatibility of Product.  
The RoHS is Directive 2002/95/EC of the European Parliament and  
of the Council of 27 January 2003 on the restriction of the use of certain  
hazardous substances in electrical and electronic equipment.  
Lot No.  
Note 4  
2
2009-07-13  
2SJ567  
I
– V  
I – V  
D DS  
D
DS  
2.0  
1.6  
1.2  
0.8  
0.4  
0
5  
4  
3  
2  
1  
0
Common source  
Tc = 25°C  
8  
6  
5  
4.8  
4.6  
4.4  
6  
8  
Common source  
Tc = 25°C  
Pulse test  
10  
15  
Pulse test  
10  
5.75  
15  
5.5  
5.25  
5  
4.2  
4.8  
4.6  
4.4  
4.2  
V
= −4 V  
GS  
V
= −4 V  
GS  
0
1  
2  
3  
4  
5  
0
10  
20  
30  
40  
50  
Drain-source voltage  
V
DS  
(V)  
Drain-source voltage  
V
DS  
(V)  
I
D
– V  
V
– V  
DS GS  
GS  
10  
8  
6  
4  
2  
0
10  
8  
6  
4  
2  
0
Common source  
= −10 V  
Common source  
Tc = 25°C  
Tc = −55°C  
V
DS  
Pulse test  
Pulse test  
25  
I
= −2.5 A  
D
100  
1.5  
0.8  
0
2  
4  
6  
8  
10  
0
4  
8  
12  
16  
20  
Gate-source voltage  
V
GS  
(V)  
Gate-source voltage  
V
GS  
(V)  
Y – I  
fs  
R
– I  
DS (ON)  
D
D
10  
10  
Common source  
= −10 V  
Common source  
Tc = 25°C  
V
DS  
Pulse test  
Pulse test  
Tc = −55°C  
25  
100  
V
= −10 V  
15  
GS  
1
1
0.1  
0.1  
0.1  
0.1  
1  
10  
1  
10  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
3
2009-07-13  
2SJ567  
R
Tc  
I
– V  
DR DS  
DS (ON)  
6
5
4
3
2
1
10  
Common source  
= −10 V  
Common source  
Tc = 25°C  
V
I
= −1.5 A  
GS  
D
Pulse test  
Pulse test  
1.2  
1  
1.0  
5  
3  
1  
0.6  
V
= 0 V  
GS  
0.8  
0
80  
0.1  
40  
0
40  
80  
120  
160  
0
0.2  
0.4  
1
Case temperature Tc (°C)  
Drain-source voltage  
V
DS  
(V)  
Capacitance – V  
V
Tc  
th  
DS  
1000  
-5  
-4  
-3  
-2  
-1  
0
Common source  
= 10 V  
C
iss  
V
DS  
= 1 mA  
I
D
Pulse test  
100  
10  
1
C
oss  
C
rss  
Common source  
V
= 0 V  
GS  
f = 1 MHz  
Tc = 25°C  
80  
40  
0
40  
80  
120  
160  
Case temperature Tc (°C)  
0.1  
1  
10  
100  
Drain-source voltage  
V
DS  
(V)  
P
Tc  
Dynamic input/output characteristics  
D
40  
30  
20  
10  
0
V
DS  
160  
120  
80  
40  
0
16  
12  
8  
V
= −40 V  
DS  
Common source  
= −2.5 A  
160  
I
D
Tc = 25°C  
Pulse test  
80  
4  
V
GS  
0
40  
80  
120  
160  
0
4
8
12  
16  
20  
Case temperature Tc (°C)  
Total gate charge  
Q
(nC)  
g
4
2009-07-13  
2SJ567  
r
th  
– t  
w
3
1
Duty = 0.5  
0.5  
0.3  
0.2  
0.1  
0.1  
0.05  
0.02  
0.05  
0.03  
Single pulse  
P
DM  
t
0.01  
0.01  
T
0.005  
0.003  
Duty = t/T  
R
= 6.25°C/W  
th (ch-c)  
0.001  
10 μ  
100 μ  
1 m  
10 m  
100 m  
1
10  
100  
Pulse width  
t
(S)  
w
Safe operating area  
E
– T  
ch  
AS  
30  
10  
100  
80  
60  
40  
20  
0
I
max (pulse) *  
100 μs*  
D
5  
3  
1 ms*  
1  
0.5  
0.3  
DC  
operation  
0.1  
* Single nonrepetitive pulse  
Tc = 25°C  
0.05  
0.03  
Curves must be derated  
linearly with increase in  
temperature.  
25  
50  
75  
100  
125  
150  
V
max  
DSS  
0.01  
Channel temperature  
T
(°C)  
ch  
0.005  
0.1  
0.3  
1  
3  
10  
30  
100 300  
Drain-source voltage  
V
DS  
(V)  
B
VDSS  
15 V  
I
AR  
15 V  
V
V
DD  
DS  
B
Test circuit  
Waveform  
1
2
2
R
= 25 Ω  
= −50 V, L = 25.2 mH  
VDSS  
G
=
LI ⋅  
Ε
AS  
V
DD  
V
B
VDSS  
DD  
5
2009-07-13  
2SJ567  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must  
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,  
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA  
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are  
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the  
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any  
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other  
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO  
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
6
2009-07-13  

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