LNJC24X4ARA [PANASONIC]
Hight Bright Surface Mounting Chip LED; 海特明亮的表面贴装LED芯片
| 型号： | LNJC24X4ARA |
| 厂家： | 
PANASONIC |
| 描述： | Hight Bright Surface Mounting Chip LED |
| 文件： | 总3页 (文件大小：378K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product complies with the RoHS Directive (EU 2002/95/EC).
ꢀ
LNJC24X4ARA
HightꢀBrightꢀSurfaceꢀMountingꢀChipꢀLED
3528ꢀ(PLCC2)ꢀType
ꢀAbsoluteꢀMaximumꢀRatingsꢀꢀT = 25°C
a
ꢀLightingꢀColor
ꢀIce Blue
Parameter
Power dissipation
Symbol
PD
Rating
Unit
mW
mA
mA
V
80
Forward current
IF
20
70
Pulse forward current *
Reverse voltage
IFP
VR
5
Operating ambient temperature
Storage temperature
Topr
–40 to +100
–40 to +100
°C
T
stg
°C
Note) : The condition of IFP is duty 10%, Pulse width 1 msec.
*
ꢀElectro-OpticalꢀCharacteristicsꢀꢀT = 25°C±3°C
a
Parameter
Luminous intensity *
Symbol
Conditions
Min
Typ
Max
390
Unit
mcd
µA
V
IO
IR
VF
x
IF = 10 mA
VR = 5 V
100
230
Reverse current
Forward voltage
100
IF = 10 mA
IF = 10 mA
IF = 10 mA
3.0
3.7
0.122
0.182
0.175
0.245
0.234
0.305
Chromaticity coordinates
y
Note) : Measurement tolerance: ±15%
*
I
O IF
IF VF
Relative luminous intensity Ta
103
103
102
10
1
102
102
10
1
10
−40
1
10
102
2.0
2.5
3.0
3.5
4.0
−20
0
20
40
60
80
100
Forward current IF (mA)
Forward voltage VF (V)
Ambient temperature Ta (°C)
IF Ta
40
35
Directive characteristics
30
0°
10°
10°
20°
20°
25
20
30°
30°
40°
50°
40°
80°
60°
40°
20°
50°
15
10
60°
60°
70°
80°
90°
70°
80°
90°
5
0
20
0
20
40
60
80
100
120
100 80
60
40
0
20
40
60
80 100
Relative luminous intensity (%)
Ambient temperature Ta (°C)
Publicationꢀdate:ꢀAugustꢀ2011
Ver.ꢀAEK
1
This product complies with the RoHS Directive (EU 2002/95/EC).
LNJC24X4ARA
ꢀPackageꢀ(Unit:ꢀmm)
ꢀ LLDFTR4J2400
ꢀPin name
1:Anode
2: Cathode
Ver.ꢀAEK
2ꢀ
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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