DB2X41100L [PANASONIC]

For rectification DB2J411 in Mini2 type package; 对于MINI2型包整改DB2J411
DB2X41100L
型号: DB2X41100L
厂家: PANASONIC    PANASONIC
描述:

For rectification DB2J411 in Mini2 type package
对于MINI2型包整改DB2J411

文件: 总5页 (文件大小:318K)
中文:  中文翻译
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Doc No. TT4-EA-13670  
Revision. 3  
Schottky Barrier Diode  
DB2X41100L  
DB2X41100L  
Silicon epitaxial planar type  
Unit: mm  
For rectification  
DB2J411 in Mini2 type package  
1.6  
0.13  
2
Features  
Low forward voltage and low reverse leakage current  
Short reverse recovery time trr  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)  
Marking Symbol:  
Packaging  
4R  
1
0.55  
0.8  
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)  
1. Cathode  
2. Anode  
Panasonic  
JEITA  
Mini2-F4-B  
SC-109D  
SOD-123  
Code  
Absolute Maximum Ratings Ta = 25 C  
Parameter  
Reverse voltage  
Forward current (average) *1  
Symbol  
VR  
IF(AV)  
IFSM  
Tj  
Rating  
40  
1
7
150  
Unit  
V
A
Internal Connection  
2
*2  
A
Non-repetitive peak forward surge current  
*1  
°C  
°C  
°C  
Junction temperature  
Operating ambient temperature  
Storage temperature  
Topr  
Tstg  
-40 to +85  
-55 to +150  
Note: *1 Tl = 80 °C  
*2 50 Hz sine wave 1 cycle (Non-repetitive peak current)  
1
Page 1 of 4  
Established : 2011-06-30  
Revised : 2013-04-24  
Doc No. TT4-EA-13670  
Revision. 3  
Schottky Barrier Diode  
DB2X41100L  
Electrical Characteristics Ta = 25 C 3 C  
Parameter  
Forward voltage  
Symbol  
Conditions  
Min Typ Max  
0.50 0.58  
Unit  
V
μA  
pF  
ns  
VF  
IR  
Ct  
trr  
IF = 1 A  
VR = 40 V  
Reverse current  
15  
21  
100  
Terminal capacitance  
VR = 10 V, f = 1 MHz  
IF = IR = 100 mA, Irr = 0.1 × IR  
Reverse recovery time *1  
6.8  
Note)1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.  
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on  
the charge of a human body and the leakage of current from the operating equipment.  
3. *1 trr test circuit  
Input Pulse  
Output Pulse  
trr  
Bias Application Unit (N-50BU)  
tp  
tr  
t
10%  
IF  
t
A
90%  
VR  
Irr = 0.1 × IR  
IF = 100 mA  
IR = 100 mA  
tp = 2 μs  
tr = 0.35 ns  
δ = 0.05  
Pulse Generator  
Wave Form Analyzer  
(SAS-8130)  
Ri = 50 Ω  
(PG-10N)  
Rs = 50 Ω  
Page 2 of 4  
Established : 2011-06-30  
Revised  
: 2013-04-24  
Doc No. TT4-EA-13670  
Revision. 3  
Schottky Barrier Diode  
DB2X41100L  
Technical Data ( reference )  
IR - VR  
IF - VF  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E+01  
1.E+00  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
85 °C  
Ta = 125 °C  
Ta = 125 °C  
85 °C  
25 °C  
25 °C  
-40 °C  
1.E-06  
1.E-07  
1.E-08  
-40 °C  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0
10  
20  
30  
40  
1000  
1.2  
Forward voltage VF (V)  
Reverse voltage VR (V)  
Rth - t  
Ct - VR  
1000  
100  
10  
140  
120  
100  
80  
(1)  
(2)  
Ta = 25 °C  
f = 1 MHz  
(3)  
Rth(j-l) = 40 °C/W  
60  
(1) Non-heat sink  
40  
(2) Mounted on glass epoxy print board.  
(3) Mounted on alumina print board.  
Board size : 50 mm × 50 mm x 0.8 mm  
Solder in : 2 mm x 2 mm  
20  
0
1
0
5
10  
15  
20  
25  
30  
35  
40  
0.001 0.01  
0.1  
1
10  
100  
Reverse voltage VR (V)  
Time t (s)  
IF(AV) - Tl  
PF(AV) - IF(AV)  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1.25  
1
IF  
tp/T  
IF  
tp  
tp  
DC  
Sine Wave  
1/2  
T
T
DC  
1/2  
VR = 20 V  
Tj = 125 °C  
1/4  
0.75  
0.5  
0.25  
0
1/4  
Sine Wave  
0
25  
50  
75  
100 125 150 175  
0
0.2  
0.4  
0.6  
0.8  
1
Lead temperature Tl (°C)  
Forward current (Average) IF(AV) (A)  
Page 3 of 4  
Established : 2011-06-30  
Revised : 2013-04-24  
Doc No. TT4-EA-13670  
Revision. 3  
Schottky Barrier Diode  
DB2X41100L  
Mini2-F4-B  
Unit: mm  
1.6±0.1  
2
0.13+-0.052  
1
0.55±0.10  
(7°)  
Land Pattern (Reference) (Unit: mm)  
1.1  
Page 4 of 4  
Established : 2011-06-30  
Revised : 2013-04-24  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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