SFH-4735 [OSRAM]
SMD epoxy package;2017-02-21
OSLON Black Flat (IR broad band emitter) - 120°
Version 1.1
SFH 4735
Features:
•
•
•
•
•
SMD epoxy package
ThinGaN (UX:3)
Wide viewing angle of 120°
Improved Corrosion Robustness
Low thermal resistance (Max. 9 K/W)
Applications
Illumination source for spectroscopy
•
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Ordering Information
Type:
Total Radiant Flux
Φe [mW]
Ordering Code
IF = 350 mA, tp = 20 ms
200
SFH 4735
Q65111A9885
Note:
Measured with integrating sphere.
2017-02-21
1
Version 1.1
SFH 4735
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Top; Tstg
Tj
Values
-40 ... 85
125
Unit
°C
Operation and storage temperature range
Junction temperature
°C
Forward current
IF
500
mA
A
Surge current
(tp ≤ 1 ms, D = 0)
IFSM
1
Power consumption
Ptot
1900
2
mW
kV
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
Thermal resistance junction - soldering point
RthJS
9
K / W
Note:
For the forward current and power consumption please see "maximum permissible forward current" diagram
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
Half angle
(typ)
ϕ
± 60
°
Forward voltage
(typ (max)) VF
(typ (max)) VF
IR
2.95 (≤ 3.5)
V
(IF = 350 mA, tp = 20 ms)
Forward voltage
(IF = 500 mA, tp = 100 µs)
3 (≤ 3.8)
V
Reverse current
(VR = 5 V)
not designed for ꢀA
reverse operation
Radiant intensity
Ie, typ
Ie, typ
Φe
59
mW/sr
(IF = 350 mA, tp=20 ms, λ = 350 - 600nm)
Radiant intensity
(IF = 350 mA, tp=20 ms, λ = 600 - 1050nm)
5
mW/sr
mW
Total radiant flux
(IF = 350 mA, tp=20 ms, λ = 350 - 600nm)
(typ)
(typ)
(typ)
(typ)
(typ)
184
16
60
45
45
Total radiant flux
(IF = 350 mA, tp=20 ms, λ = 600 - 1050nm)
Φe
mW
Spectral flux
(IF = 350 mA, tp = 20 ms, λ = 750 nm)
Φe, λ
Φe, λ
Φe, λ
ꢀW/nm
ꢀW/nm
ꢀW/nm
Spectral flux
(IF = 350 mA, tp = 20 ms, λ = 850 nm)
Spectral flux
(IF = 350 mA, tp = 20 ms, λ = 950 nm)
2017-02-21
2
Version 1.1
SFH 4735
Relative Spectral Emission 1) page 12
Irel = f (λ), TA = 25 °C, IF = 350 mA, tp = 10 ms
Relative Total Radiant Flux 1) page 12
Φe/Φe(350mA) = f (IF), TA = 25 °C, Single pulse,
tp = 100 μs
Forward Current 1) page 12
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current
IF = f (TS), RthJS = 9 K/W
600
[ ]
400
200
0
0
20
40
60
80
100
]
[
2017-02-21
3
Version 1.1
SFH 4735
Permissible Pulse Handling Capability
IF = f(tp), TA = 85 °C, duty cycle D = parameter
[ ]
1,0
0,8
0,6
0,4
: D = 1
: D = 0,5
: D =0,2
: D =0,1
: D =0,05
0,2
: D =0,02
: D =0,01
: D =0,005
0,0
10-5 10-4 10-3 0,01 0,1
1
10 100
[ ]
Radiation Characteristics 1) page 12
Irel = f(ϕ), TA= 25°C
OHL01660
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
2017-02-21
4
Version 1.1
SFH 4735
Package Outline
Dimensions in mm.
Type:
SFH 4735
Package
OSLON Black Flat
Approximate Weight:
0.2 g
Package marking
see drawing
Note:
IRED is protected by ESD device which is connected in parallel to chip.
2017-02-21
5
Version 1.1
SFH 4735
Recommended Solder Pad
For superior solder joint connectivity results we recommend soldering under standard nitrogen
atmosphere.
Recommended Solder Pad
2017-02-21
6
Version 1.1
SFH 4735
Note:
For superior solder joint connectivity results we recommend soldering under standard nitrogen
atmosphere.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
217 ˚C
tP
tL
200
150
100
50
tS
25 ˚C
0
0
50
100
150
200
250
s
300
t
OHA04612
Pb-Free (SnAgCu) Assembly
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Unit
Einheit
Minimum
Recommendation
Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2
3
K/s
Time tS
TSmin to TSmax
tS
60
100
2
120
3
s
Ramp-up rate to peak*)
K/s
TSmax to TP
TL
tL
Liquidus temperature
217
80
°C
s
Time above liquidus temperature
Peak temperature
100
TP
tP
245
20
260
30
°C
s
Time within 5 °C of the specified peak
temperature TP - 5 K
10
3
6
K/s
s
Ramp-down rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2017-02-21
7
Version 1.1
SFH 4735
Taping
Dimensions in mm.
Tape and Reel
12 mm tape with 2000 pcs. on ∅ 180 mm reel
W1
D0
P0
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min0 4±± mm *
Trailer: min0 16± mm *
*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D
OHAY0324
2017-02-21
8
Version 1.1
SFH 4735
Tape dimensions [mm]
Tape dimensions in mm
W
E
F
P0
P1
P2
D0
12 + 0.3 / - 0.1 4 ± 0.1
4 ± 0.1
or
8 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
Reel dimensions [mm]
Reel dimensions in mm
A
W
Nmin
60
W1
W2max
18.4
180
12
12.4 + 2
Barcode-Product-Label (BPL)
OSRAM Opto
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
ML Temp ST
XXX °C X
X
(9D) D/C: 1234
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP: XX-XX-X-X
OHA04563
Dry Packing Process and Materials
Moisture-sensitive label or print
Barcode label
OSRAM
Humidity indicator
Barcode label
D o n o t e a t .
A v o i d m e t a l c o n t a c t .
D i s c a r d i f c i r c l e s o v e r r u n .
b a g o p e n i n g .
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r
c h e c k d o t
C o m p a r a t o r
W E T
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 5 %
I f w e t ,
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 0 %
I f w e t ,
c h a n g e d e s i c c a n t
p a r t s s t i l l a d e q a t e l y d r y .
I f w e t ,
u
5 %
M I L - I - 8 8 3 5
H u m i d i t y I n d i c a t o r
OSRAM
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
2017-02-21
9
Version 1.1
SFH 4735
Transportation Packing and Materials
Barcode label
Barcode label
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240 C R
260
C
R
DEMY
R18
ML
2
C
RT
LSY T676
Multi T
2a
3
Additional TEXT
R077
PACKVAR:
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
(X) PROD NO:
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240
260
C
R
C
DEMY
R18
ML
R
C RT
2
LSY T676
2a
3
Additional TEXT
R077
PACKVAR:
Multi TOP
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
OSRAM
(X) PROD NO:
Packing
Sealing label
OHA02044
Dimensions of transportation box in mm
Width
Length
Height
195 ± 5
195 ± 5
30 ± 5
2017-02-21
10
Version 1.1
SFH 4735
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2017-02-21
11
Version 1.1
SFH 4735
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2017-02-21
12
Version 1.1
SFH 4735
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2017-02-21
13
相关型号:
©2020 ICPDF网 联系我们和版权申明