SFH-4786S_技术文档

2017-10-23

IR OSLUX (810nm) - 30° / 8° tilted

Version 1.0

SFH 4786S

Features:

•

IR lightsource with high efficiency

Double stack emitter

Low thermal resistance (Max. 25 K/W)

Centroid wavelength 810 nm

Small package dimensions (LxWxH): 3.5mm x 3.5mm x 1.6mm

Narrow half angle (+/- 15°) / 8° tilted

Applications

Infrared Illumination

•

Notes

Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which

can be hazardous to the human eye. Products which incorporate these devices have to follow the safety

precautions given in IEC 60825-1 and IEC 62471.

Ordering Information

Type:

Radiant Intensity

I_e[mW/sr]

Ordering Code

I_F= 1 A, t_p= 10 ms

1800 (≥ 1330)

SFH 4786S

Q65111A8571

Note:

measured at a solid angle of Ω = 0.001 sr / the optical axis is tilted by 8°

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SFH 4786S

Maximum Ratings (T_A= 25 °C)

Parameter

Symbol

T_op

Values

Unit

°C

V

Operating temperature range

Storage temperature range

Junction temperature

Reverse voltage

-40 ... 85

T_stg

T_j

-40 ... 85

145

1

V_R

Forward current

I_F

500

2

mA

A

Surge current

(t_p≤ 200 µs, D = 0)

I_FSM

Power consumption

P_tot

1.8

2

W

ESD withstand voltage

(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

V_ESD

kV

Thermal resistance junction - soldering point

R_thJS

25

K / W

Note:

For the forward current and power consumption please see "maximum permissible forward current"

diagram

Characteristics (T_A= 25 °C)

Parameter

Symbol

Values

Unit

Peak wavelength

(typ)

λ_peak

820

nm

(I_F= 1 A, t_p= 10 ms)

Centroid wavelength

(I_F= 1 A, t_p= 10 ms)

λ_centroid

∆λ

810

30

nm

°

Spectral bandwidth at 50% of I_max

(I_F= 1 A, t_p= 10 ms)

Half angle

(typ)

ϕ

± 15

Dimensions of active chip area

L x W

0.75 x 0.75

mm x

mm

Rise and fall times of I_e( 10% and 90% of I_{e max}

(I_F= 1 A, R_L= 50 Ω)

)

(typ)

t_r/ t_f

8/ 14

3.3 (≤ 3.6)

3.55 (≤ 4)

780

ns

Forward voltage

(I_F= 0.5 A, t_p= 100 µs)

(typ (max)) V_F

V

Forward voltage

(I_F= 1 A, t_p= 100 μs)

V

Total radiant flux

(I_F= 1 A, t_p= 100 µs)

(typ)

Φ_e

mW

Total radiant flux

(I_F= 1 A, t_p= 10 ms)

700

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Parameter

Symbol

Values

Unit

Temperature coefficient of I_eor Φ_e

(I_F= 1 A, t_p= 10 ms)

(typ)

TC_I

-0.3

% / K

Temperature coefficient of V_F

(I_F= 1 A, t_p= 10 ms)

TC_V

TC_λ

-2

mV / K

nm / K

Temperature coefficient of wavelength

(I_F= 1 A, t_p= 10 ms)

0.3

Grouping (T_A= 25 °C)

Group

Min Radiant Intensity

Max Radiant Intensity Typ Radiant Intensity

I_F= 1 A, t_p= 10 ms

I_{e, min}[mW / sr]

1330

I_F= 1 A, t_p= 10 ms

I_{e, max}[mW / sr]

2500

I_F= 1 A, t_p= 10 ms

I_{e, typ}[mW / sr]

1800

SFH 4786S

Note:

measured at a solid angle of Ω = 0.001 sr / the optical axis is tilted by 8°

Only one group in one packing unit (variation lower 2:1).

Relative Spectral Emission ^{1) page 11}

I_rel= f (λ), T_A= 25 °C, I_F=1A, Single pulse, t_p= 10

ms

Radiant Intensity ^{1) page 11}

I_e/ I_e(1 A) = f(I_F), single pulse, t_p= 100 µs,

T_A= 25°C

OHF05651

OHF05650

10¹

100

%

I_e

_e(1 A)

I_rel

I

80

60

40

20

0

10⁰

5

10^-1

5

10^-2

5

10^-1

5

10⁰

A

10¹

700 750

800

850

nm 950

I_F

λ

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SFH 4786S

Forward Current ^{1) page 11}

I_F= f(V_F), T_A= 25°C, Single pulse, t_p= 100 µs,

Max. Permissible Forward Current

I_F= f (T_S), R_thJS= 25 K/W

OHF05649

OHF05652

550

10¹

A

mA

I_F

450

400

350

300

250

200

150

100

50

10⁰

5

10^-1

5

10^-2

0

20

40

60

80 ˚C 100

2.5

3

3.5

4

V 4.5

T_S

V_F

Permissible Pulse Handling Capability

I_F= f (t_p), T_S= 85 °C, Duty cycle D = parameter

OHF05648

2.5

t_P

A

t_P

I_F

D

⁼T

T

2.0

D

=

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1.5

1.0

0.5

0

1

10^-510^-410^-310^-210^-110⁰10¹s 10²

t_p

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SFH 4786S

Radiation Characteristics ^{1) page 11}

I_rel= f(ϕ), T_A= 25°C

Package Outline

Dimensions in mm.

Approximate Weight:

20 mg

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SFH 4786S

Recommended Solder Pad

Dimensions in mm [inch].

Reflow Soldering Profile

Product complies to MSL Level 3 acc. to JEDEC J-STD-020E

OHA04525

300

˚C

T

250

T

245 ˚C

p

240 ˚C

t_P

t_L

217 ˚C

200

150

t_S

100

50

25 ˚C

0

50

100

150

200

250

s

300

t

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SFH 4786S

OHA04612

Pb-Free (SnAgCu) Assembly

Profile Feature

Profil-Charakteristik

Symbol

Unit

Einheit

Minimum

Recommendation

Maximum

Ramp-up rate to preheat*⁾

25 °C to 150 °C

2

3

120

3

K/s

Time t_S

T_Sminto T_Smax

t_S

60

100

2

s

Ramp-up rate to peak*⁾

K/s

T_Smaxto T_P

T_L

t_L

Liquidus temperature

217

80

°C

s

Time above liquidus temperature

100

T_P

t_P

Peak temperature

245

20

260

30

°C

s

Time within 5 °C of the specified peak

temperature T_P- 5 K

10

3

6

K/s

s

Ramp-down rate*

T_Pto 100 °C

480

Time

25 °C to T_P

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Taping

Dimensions in mm.

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Version 1.0

SFH 4786S

Tape and Reel

12 mm tape with 2500 pcs. on ∅ 330 mm reel

W₁

D₀

P₀

P₂

Label

P₁

Direction of unreeling

W₂

Leader: min0 4±± mm *

Trailer: min0 16± mm *

*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D

OHAY0324

Tape dimensions [mm]

Tape dimensions in mm

W

E

F

P₀

P₁

P₂

2 ± 0.05

D₀

12 + 0.3 / - 0.1 4 ± 0.1

4 ± 0.1

or

8 ± 0.1

1.5 ± 0.1

1.75 ± 0.1

5.5 ± 0.05

Reel dimensions [mm]

Reel dimensions in mm

A

W

N_min

60

W₁

W_2max

18.4

330

12

12.4 + 2

Barcode-Product-Label (BPL)

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SFH 4786S

Dry Packing Process and Materials

Moisture-sensitive label or print

Barcode label

OSRAM

Humidity indicator

Barcode label

D o n o t e a t .

A v o i d m e t a l c o n t a c t .

D i s c a r d i f c i r c l e s o v e r r u n .

b a g o p e n i n g .

P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r

c h e c k d o t

C o m p a r a t o r

W E T

b a k e u n i t s

e x a m i n e u n i t s , i f n e c e s s a r y

1 5 %

I f w e t ,

b a k e u n i t s

e x a m i n e u n i t s , i f n e c e s s a r y

1 0 %

I f w e t ,

c h a n g e d e s i c c a n t

p a r t s s t i l l a d e q a t e l y d r y .

I f w e t ,

u

5 %

M I L - I - 8 8 3 5

H u m i d i t y I n d i c a t o r

OSRAM

Desiccant

OHA00539

Note:

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.

Regarding dry pack you will find further information in the internet. Here you will also find the normative

references like JEDEC.

Transportation Packing and Materials

Barcode label

Bin1: P-1-20

Bin2: Q-1-20

Bin3:

Temp ST

220

240 C R

260

C

R

DEMY

R18

ML

2

C

RT

LSY T676

Multi TOPLED

2a

3

Additional TEXT

R077

PACKVAR:

P-1+Q-1

(G) GROUP:

0144

(9D) D/C:

210021998

2000

OSRAM Opto

Semiconductors

(Q)QTY:

123GH1234

(6P) BATCH NO:

5

2

4

1

0

1

(1T) LOT NO:

1

(X) PROD NO:

Bin1: P-1-20

Bin2: Q-1-20

Bin3:

Temp ST

220

240 C R

260

C

R

DEMY

R18

ML

2

C

RT

LSY T676

Multi TOPLED

2a

3

Additional TEXT

R077

PACKVAR:

P-1+Q-1

(G) GROUP:

0144

(9D) D/C:

210021998

2000

OSRAM Opto

Semiconductors

(Q)QTY:

123GH1234

(6P) BATCH NO:

5

2

4

1

0

1

(1T) LOT NO:

1

OSRAM

(X) PROD NO:

Packing

Sealing label

OHA02044

Dimensions of transportation box in mm

Width

Length

Height

349 ± 5

33 ± 5

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SFH 4786S

Disclaimer

Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any

costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components* may only be used in life-support devices** or systems with the express written approval of

OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be

expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that

device or system.

**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or

maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be

endangered.

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SFH 4786S

Glossary

1)

Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or

calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily

correspond to the actual parameters of each single product, which could differ from the typical data and calculated

correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data

will be changed without any further notice.

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Version 1.0

SFH 4786S

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg

2017-10-23

12


型号：	SFH-4786S
厂家：	OSRAM GMBH
描述：	IR lightsource with high efficiency
文件：	总12页 (文件大小：594K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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