SFH-4281 [OSRAM]
Emissionswellenlänge 880nm;
| 型号： | SFH-4281 |
| 厂家： | 
OSRAM GMBH |
| 描述： | Emissionswellenlänge 880nm |
| 文件： | 总7页 (文件大小：71K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Infrarot-LED
Infrared-LED
SFH 4281
Wesentliche Merkmale
Features
• Emissionswellenlänge 880nm
• Homogene Abstrahlcharakteristik
• IR Reflow und TTW Löten geeignet
• Feuchte-Empfindlichkeitsstufe 2 nach JEDEC
Standard J-STD-020A
• Typical peak wavelength 880nm
• Homogeneous Radiation Pattern
• Suitable for IR reflow and TTW soldering
• Moisture Sensitivity Level 2 according to
JEDEC Standard J-STD-020A
Anwendungen
Applications
• Miniaturlichtschranken für Gleich- und
Wechsellichtbetrieb
• Miniature photointerrupters
• Industrial electronics
• Industrieelektronik
• „Messen/Steuern/Regeln“
• Automobiltechnik
• For drive and control circuits
• Automotive technology
• Sensor technology
• Sensorik
• Alarm- und Sicherungssysteme
• IR-Freiraumübertragung
• Alarm and safety equipment
• IR free air transmission
Typ
Type
Bestellnummer Strahlstärkegruppierung 1) (IF = 100 mA, tp = 20 ms)
Ordering Code
Radiant intensity grouping 1), Ie (mW/sr)
-P
-Q
SFH 4281
Q62702P5000
4 ... 8
6.3 ... 12.5
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
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1
SFH 4281
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top; Tstg
– 40 … + 100
°C
Operating and storage temperature range
Sperrspannung
Reverse voltage
VR
5
V
Durchlaßstrom
Forward current
IF
100
2.5
180
450
mA
A
Stoßstrom, τ = 10 µs, D = 0
Surge current
IFSM
Ptot
Verlustleistung
Power dissipation
mW
K/W
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
RthJC
≈ 200
K/W
Thermal resistance junction - soldering point,
mounted on metal block
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak
880
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
∆λ
80
nm
Abstrahlwinkel
Half angle
ϕ
± 60
Grad
deg.
Aktive Chipfläche
Active chip area
0.09
mm2
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3
mm
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SFH 4281
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf
auf 10%, bei IF = 100 mA, RL = 50 Ω
0.5
µs
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
Kapazität,
Co
15
pF
Capacitance
VR = 0 V, f = 1 MHz
Durchlaßspannung,
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.5 (≤ 1.8)
3.0 (≤ 3.8)
V
V
Sperrstrom,
Reverse current
VR = 5 V
IR
0.01 (≤ 1)
µA
Gesamtstrahlungsfluß,
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe
TCI
23
mW
%/K
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
– 0.5
Temperature coefficient of Ie or Φe, IF = 100 mA
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV
TCλ
– 2
mV/K
nm/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
+ 0.25
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SFH 4281
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
-P
-Q
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
4
8
6.3
12.5
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ.
50
60
mW/sr
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SFH 4281
Ιe
= f (IF)
Relative Spectral Emission
Irel = f (λ)
Radiant Intensity
Max. Permissible Forward Current
IF = f (TA)
Ιe 100 mA
Single pulse, tp = 20 µs
OHR00877
OHR00878
10 2
100
%
OHR00883
120
Ι e
mA
Ι e (100mA)
Ι F
Ι rel
10 1
10 0
80
100
80
60
40
20
0
RthjA = 450 K/W
60
40
20
0
10 -1
10 -2
10 -3
10 0
10 1
10 2
10 3 mA 10 4
Ι F
0
20
40
60
80
100 ˚C 120
750
800
850
900
950 nm 1000
λ
TA
Forward Current
IF = f (VF), single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (tp), TA = 25 °C
duty cycle D = Parameter
OHR00886
104
OHR00881
10 1
mA
A
Ι F
Ι F
D
= 0.005
0.01
0.02
0.05
10 0
10 -1
10 -2
10 -3
103
102
101
0.1
0.2
0.5
DC
t p
t p
D =
Ι F
T
T
10-5 10-4 10-3 10-2 10-1 100 101 s 102
0
1
2
3
4
5
6
V
8
VF
t p
Radiation Characteristics
rel = f (ϕ)
S
OHL01660
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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SFH 4281
Maßzeichnung
Package Outlines
2.1 (0.083)
1.7 (0.067)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
1.0 (0.039)
0.9 (0.035)
2.1 (0.083)
0...0.1 (0.004)
0.6 (0.024)
0.4 (0.016)
Cathode marking
GPLY6899
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
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SFH 4281
Löthinweise
Soldering Conditions
Bauform
Types
Tauch-, Schwall- und Schlepplötung
Reflowlötung
Reflow Soldering
Dip, Wave and Drag Soldering
Lötbad-
temperatur
Maximal
zulässige
Lötzeit
Abstand
Lötstelle –
Gehäuse
Lötzonen-
temperatur
Maximale
Durchlaufzeit
Temperature
of the
Soldering
Bath
Max. Perm.
Soldering
Time
Distance
between
Solder Joint
and Case
Temperature
of Soldering
Zone
Max. Transit
Time
TOPLED RG
260 °C
10 s
–
245 °C
10 s
Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage.
For additional information on general soldering conditions please contact us.
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
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