SFH-4301 [OSRAM]
Schnelle IR-Lumineszenzdiode (950 nm) im 3 mm Radial-Gehäuse;
| 型号： | SFH-4301 |
| 厂家： | 
OSRAM GMBH |
| 描述： | Schnelle IR-Lumineszenzdiode (950 nm) im 3 mm Radial-Gehäuse |
| 文件： | 总6页 (文件大小：83K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Schnelle IR-Lumineszenzdiode (950 nm) im 3 mm Radial-Gehäuse
High-Speed Infrared Emitter (950 nm) in 3 mm Radial Package
SFH 4301
Wesentliche Merkmale
Features
• Hohe Pulsleistung und hoher Gesamt-
strahlungsfluß Φe
• Sehr kurze Schaltzeiten (10 ns)
• Sehr hohe Langzeitstabilität
• Hohe Zuverlässigkeit
• High pulse power and high radiant flux Φe
• Very short switching times (10 ns)
• Very high long-time stability
• High reliability
Anwendungen
Applications
• Schnelle Datenübertragung mit
Übertragungsraten bis 100 Mbaud
(IR Tastatur, Joystick, Multimedia)
• Analoge und digitale Hi-Fi Audio- und
Videosignalübertragung
• High data transmission rate up to 100 Mbaud
(IR keyboard, Joystick, Multimedia)
• Analog and digital Hi-Fi audio and video signal
transmission
• Low power consumption (battery) equipment
• Suitable for professional and high-reliability
applications
• Batteriebetriebene Geräte (geringe
Stromaufnahme)
• Anwendungen mit hohen
• Alarm and safety equipment
Zuverlässigkeits-ansprüchen bzw.
erhöhten Anforderungen
• IR free air transmission
• Alarm- und Sicherungssysteme
• IR Freiraumübertragung
Typ
Type
Bestellnummer
Ordering Code
Gehäuse
Package
SFH 4301
Q62702-P5166
3-mm-LED-Gehäuse (T1), schwarz eingefärbt,
Anschlüsse im 2.54-mm-Raster (1/10’’),
Kathodenkennung: längerer Anschluß
3 mm LED package (T1), black-colored epoxy resin,
solder tabs lead spacing 2.54 mm (1/10’’),
cathode marking: long lead
2001-04-19
1
SFH 4301
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top; Tstg
– 40 … + 100
°C
Operating and storage temperature range
Sperrspannung
Reverse voltage
VR
3
V
Durchlaßstrom
Forward current
IF (DC)
IFSM
100
2.2
mA
A
Stoßstrom
Surge current
tp = 10 µs, D = 0
Verlustleistung
Power dissipation
Ptot
180
375
mW
K/W
Wärmewiderstand Sperrschicht - Umgebung,
freie Beinchenlänge max. 10 mm
Thermal resistance junction - ambient,
lead length between package bottom and PCB
max. 10 mm
RthJA
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SFH 4301
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength of peak emission
IF = 100 mA, tp = 20 ms
λpeak
950
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA, tp = 20 ms
∆λ
40
nm
Abstrahlwinkel
Half angle
ϕ
± 10
Grad
deg.
Aktive Chipfläche
Active chip area
0.09
mm2
mm
ns
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3
10
Schaltzeiten, Ie von 10% auf 90% und
von 90% auf 10%
tr, tf
Switching times, Ie from 10% to 90% and
from 90% to 10%,
IF = 100 mA, tP = 20 ms, RL = 50 Ω
Kapazität
Co
35
pF
Capacitance
VR = 0 V, f = 1 MHz
Durchlaβspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.5 (≤ 1.8)
3.2 (≤ 4.0)
V
V
Sperrstrom
Reverse current
VR = 3 V
IR
0.01 (≤ 10)
µA
Gesamtstrahlungsfluß
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe
TCI
32
mW
%/K
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 100 mA
– 0.44
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SFH 4301
Kennwerte (TA = 25 °C) (cont’d)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 100 mA
TCV
– 1.5
mV/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 100 mA
TCλ
+ 0.2
nm/K
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel von Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
measured at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie typ
16
60
mW/sr
mW/sr
Strahlstärke
Ie typ
400
mW/sr
Radiant intensity
IF = 1 A, tp = 100 µs
Lötbedingungen
Soldering Conditions
Tauch-, Schwall- und Schlepplötung
Kolbenlötung (mit 1,5-mm-Kolbenspitze)
Dip, Wave and Drag Soldering
Iron Soldering (with 1.5-mm-bit)
Lötpad-
temperatur
Maximal
zulässige
Lötzeit
Abstand
Lötstelle –
Gehäuse
Temperatur
des Kolbens
Maximale
zulässige
Lötzeit
Abstand
Lötstelle –
Gehäuse
Temperature
of the
Max. Perm.
Soldering
Distance
between
Temperature
of the Solder- sible Solder-
Max. Permis- Distance
between
Soldering Bath Time
Solder Joint
and Case
ing Iron
ing Time
Solder Joint
and Case
260 °C
10 s
≥ 1.5 mm
300 °C
3 s
≥ 1.5 mm
2001-04-19
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SFH 4301
Relative Spectral Emission
Radiant Intensity Ie/Ie (100 mA) = f (IF)
Single pulse, tp = 20 µs
Max. Permissible Forward Current
IF = f (TA)
I
erel = f (λ)
OHF00809
OHF00359
OHF00777
10 2
120
100
mA
Ι F
Ιerel
Ιe
Ιe (100 mA)
100
80
60
40
20
0
80
10 0
10 -1
10 -2
10 -3
RthJA = 375 K/W
60
40
20
0
10 0
10 1
10 2
10 3
10 4
0
20
40
60
80
100 ˚C 120
800 850 900 950 1000
nm 1100
mA
TA
λ
ΙF
Forward Current IF = f (VF)
single pulse, tp = 20 µs
Radiation Characteristic
erel = f (ϕ)
I
OHF00784
10 4
mA
OHF01016
40˚
30˚
20˚
10˚
0˚
1.0
ϕ
ΙF
10 3
10 2
10 1
10 0
10 -1
10 -2
10 -3
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
0
0.5
1
1.5
2
2.5
3
3.5
V 4.5
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
VF
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
OHF00041
101
tP
A
IF
= tP
IF
D
5
T
T
D
=
0.005
0.01
0.02
0.05
0.1
0.2
0.5
100
5
1
10-1
10-5 10-4 10-3 10-2 10-1 100 101 s 102
tp
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SFH 4301
Maßzeichnung
Package Outlines
5.2 (0.205)
4.5 (0.177)
4.1 (0.161)
3.9 (0.154)
Area not flat
0.6 (0.024)
0.4 (0.016)
4.0 (0.157)
3.6 (0.142)
(3.5 (0.138))
1.8 (0.071)
1.2 (0.047)
0.4 (0.016)
6.3 (0.248)
5.9 (0.232)
29 (1.142)
27 (1.063)
Chip position
Cathode (SFH 409, SFH 4332)
Anode (SFH 487, SFH 4301)
GEXY6250
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2001-04-19
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