NLV37WZ16USG [ONSEMI]

三缓冲器;
NLV37WZ16USG
型号: NLV37WZ16USG
厂家: ONSEMI    ONSEMI
描述:

三缓冲器

栅 光电二极管 逻辑集成电路 触发器 栅极
文件: 总5页 (文件大小:69K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NL37WZ16  
Triple Buffer  
The NL37WZ16 is a high performance buffer with inputs operating  
from a 1.65 to 5.5 V supply.  
The NL37WZ16 can be used as a line receiver which will receive  
slow input signals.  
Features  
http://onsemi.com  
MARKING  
Designed for 1.65 V to 5.5 V V Operation  
CC  
Over Voltage Tolerant Inputs and Outputs  
DIAGRAM  
LVTTL Compatible − Interface Capability with 5 V TTL Logic  
8
8
with V = 3 V  
CC  
1
LVCMOS Compatible  
LR M G  
24 mA Balanced Output Sink and Source Capability  
US8  
G
US SUFFIX  
CASE 493  
Near Zero Static Supply Current Substantially Reduces System  
Power Requirements  
Current Drive Capability is 24 mA at the Outputs  
Chip Complexity: FET = 94  
Pb−Free Package is Available  
1
LR  
M
G
= Device Code  
= Date Code*  
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending upon  
manufacturing location.  
IN A1  
1
2
8
7
V
CC  
PIN ASSIGNMENT  
OUT Y3  
OUT Y1  
IN A3  
1
2
IN A1  
OUT Y3  
3
4
5
6
IN A2  
GND  
IN A2  
GND  
3
4
6
5
OUT Y2  
IN A3  
OUT Y2  
7
8
OUT Y1  
V
CC  
Figure 1. Pinout (Top View)  
FUNCTION TABLE  
A Input  
Y Output  
L
L
IN A1  
OUT Y1  
OUT Y2  
OUT Y3  
1
1
H
H
IN A2  
IN A3  
1
ORDERING INFORMATION  
Figure 2. Logic Symbol  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
April, 2006 − Rev. 4  
NL37WZ16/D  
NL37WZ16  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
V
V
V
DC Supply Voltage  
*0.5 to )7.0  
CC  
I
DC Input Voltage  
*0.5 V )7.0  
V
I
DC Output Voltage  
Output in Z or LOW State (Note 1)  
*0.5 V 7.0  
V
O
O
I
I
I
I
I
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
V < GND  
*50  
mA  
mA  
mA  
mA  
mA  
_C  
IK  
I
V
< GND  
O
*50  
OK  
O
$50  
$100  
CC  
GND  
$100  
T
T
T
q
*65 to )150  
STG  
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature under Bias  
Thermal Resistance  
260  
_C  
L
J
)150  
_C  
_C/W  
mW  
(Note 2)  
333  
200  
JA  
P
Power Dissipation in Still Air at 85_C  
Moisture Sensitivity  
D
MSL  
Level 1  
F
R
Flammability Rating  
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
ESD Withstand Voltage  
Human Body Model (Note 3)  
Machine Model (Note 4)  
> 2000  
> 200  
N/A  
V
Charged Device Model (Note 5)  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. I absolute maximum rating must be observed.  
O
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.  
3. Tested to EIA/JESD22−A114−A.  
4. Tested to EIA/JESD22−A115−A.  
5. Tested to JESD22−C101−A.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
1.65  
1.5  
5.5  
5.5  
V
V
V
T
Input Voltage  
(Note 6)  
0
0
5.5  
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
O
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
*40  
)85  
_C  
ns/V  
A
Dt/DV  
V
V
V
= 2.5 V $0.2 V  
= 3.0 V $0.3 V  
= 5.0 V $0.5 V  
0
0
0
20  
10  
5
CC  
CC  
CC  
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.  
http://onsemi.com  
2
 
NL37WZ16  
DC ELECTRICAL CHARACTERISTICS  
V
T
A
= 25°C  
*40°C T 85°C  
CC  
A
Symbol  
Parameter  
Condition  
(V)  
Min  
0.7 V  
Typ  
Max  
Min  
Max  
Unit  
V
V
V
High−Level Input  
Voltage  
1.65 to 5.5  
0.7 V  
V
IH  
CC  
CC  
Low−Level Input  
Voltage  
1.65 to 5.5  
0.3  
0.3 V  
V
V
IL  
CC  
V
CC  
High−Level Output  
Voltage  
I
= −100 mA  
OH  
1.65 to 5.5  
1.65  
2.3  
V
CC  
− 0.1  
V
V
CC  
− 0.1  
CC  
OH  
I
= −4 mA  
= −8 mA  
= −12 mA  
= −16 mA  
= −24 mA  
= −32 mA  
= 100 mA  
= 4 mA  
1.55  
1.50  
2.1  
2.4  
2.7  
2.5  
4.0  
1.55  
OH  
V
IN  
= V or V  
IH IL  
I
1.9  
2.2  
2.4  
2.3  
3.8  
1.9  
2.2  
2.4  
2.3  
3.8  
OH  
I
2.7  
OH  
I
3.0  
OH  
I
3.0  
OH  
I
4.5  
OH  
V
OL  
Low−Level Output  
Voltage  
I
OL  
1.65 to 5.5  
1.65  
2.3  
0.1  
0.24  
0.3  
0.1  
0.24  
0.3  
V
I
OL  
V
IN  
= V or V  
IH IL  
I
OL  
= 8 mA  
0.20  
0.22  
0.28  
0.38  
0.42  
I
OL  
= 12 mA  
= 16 mA  
= 24 mA  
= 32 mA  
2.7  
0.4  
0.4  
I
OL  
3.0  
0.4  
0.4  
I
OL  
3.0  
0.55  
0.55  
$0.1  
1
0.55  
0.55  
$1.0  
10  
I
OL  
4.5  
I
I
Input Leakage Current  
V
= V or GND  
0 to 5.5  
0
mA  
mA  
IN  
IN  
CC  
Power Off−Output  
Leakage Current  
V
= 5.5 V  
OUT  
OFF  
I
Quiescent Supply  
Current  
V
IN  
= V or GND  
5.5  
1
10  
mA  
CC  
CC  
AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W  
R
F
L
L
T
A
= 25°C  
*40°C T 85°C  
A
Min  
1.8  
1.0  
0.8  
1.2  
0.5  
0.8  
Typ  
6.0  
3.0  
2.3  
3.0  
1..8  
2.4  
Max  
Min  
1.8  
1.0  
0.8  
1.2  
0.5  
0.8  
Max  
8.8  
5.8  
4.0  
5.1  
3.2  
4.2  
Symbol  
Parameter  
Condition  
V
(V)  
Unit  
CC  
t
t
Propagation Delay  
(Figure 3 and 4)  
R = 1 MW, C = 15 pF  
1.8 $ 0.15  
2.5 $ 0.2  
3.3 $ 0.3  
7.9  
5.2  
3.6  
4.6  
2.9  
3.8  
ns  
PLH  
L
L
PHL  
R = 1 MW, C = 15 pF  
L
L
R = 1 MW, C = 15 pF  
L
L
R = 500 W, C = 50 pF  
L
L
R = 1 MW, C = 15 pF  
5.0 $ 0.5  
L
L
R = 500 W, C = 50 pF  
L
L
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Power Dissipation Capacitance (Note 7)  
Condition  
Typical  
Unit  
C
V
CC  
= 5.5 V, V = 0 V or V  
CC  
7.0  
pF  
pF  
IN  
I
C
10 MHz, V = 3.3 V, V = 0 V or V  
9
11  
PD  
CC  
CC  
I
CC  
CC  
10 MHz, V = 5.5 V, V = 0 V or V  
I
7. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
) = C V f ) I . C is used to determine the no−load dynamic  
PD CC in CC PD  
CC(OPR  
2
power consumption; P = C V  
f ) I V  
.
D
PD  
CC  
in  
CC  
CC  
http://onsemi.com  
3
 
NL37WZ16  
V
CC  
V
CC  
A
Y
50%  
GND  
PULSE  
GENERATOR  
t
t
PHL  
PLH  
DUT  
R
T
C
R
L
L
50% V  
CC  
PROPAGATION DELAYS  
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
F
W
R = Z  
of pulse generator (typically 50 W)  
T
OUT  
Figure 3. Switching Waveforms  
Figure 4. Test Circuit  
DEVICE ORDERING INFORMATION  
Device Order Number  
NL37WZ16US  
Package Type  
Tape and Reel Size  
US8  
178 mm, 3000 Units / Tape & Reel  
178 mm, 3000 Units / Tape & Reel  
NL37WZ16USG  
US8  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
NL37WZ16  
PACKAGE DIMENSIONS  
US8  
US SUFFIX  
CASE 493−02  
ISSUE B  
−X−  
−Y−  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
A
J
8
5
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION “A” DOES NOT INCLUDE MOLD  
FLASH, PROTRUSION OR GATE BURR.  
MOLD FLASH. PROTRUSION AND GATE  
BURR SHALL NOT EXCEED 0.140 MM  
(0.0055”) PER SIDE.  
DETAIL E  
4. DIMENSION “B” DOES NOT INCLUDE  
INTER−LEAD FLASH OR PROTRUSION.  
INTER−LEAD FLASH AND PROTRUSION  
SHALL NOT E3XCEED 0.140 (0.0055”) PER  
SIDE.  
B
L
5. LEAD FINISH IS SOLDER PLATING WITH  
THICKNESS OF 0.0076−0.0203 MM.  
(300−800 “).  
6. ALL TOLERANCE UNLESS OTHERWISE  
SPECIFIED 0.0508 (0.0002 “).  
1
4
R
S
G
P
U
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
F
G
H
J
K
L
M
N
P
MIN  
1.90  
2.20  
0.60  
0.17  
0.20  
0.50 BSC  
0.40 REF  
0.10  
MAX  
2.10  
2.40  
0.90  
0.25  
0.35  
MIN  
MAX  
0.083  
0.094  
0.035  
0.010  
0.014  
C
0.075  
0.087  
0.024  
0.007  
0.008  
0.020 BSC  
0.016 REF  
0.004  
H
−T−  
SEATING  
PLANE  
0.10 (0.004)  
T
K
N
D
R 0.10 TYP  
M
M
0.10 (0.004)  
T
X Y  
0.18  
0.10  
3.20  
6
0.007  
0.004  
0.126  
6
V
0.00  
3.00  
0
0.000  
0.118  
0
_
_
_
_
5
10  
5
10  
_
_
_
_
0.23  
0.23  
0.37  
0.60  
0.34  
0.33  
0.47  
0.80  
0.010  
0.009  
0.015  
0.024  
0.013  
0.013  
0.019  
0.031  
F
R
S
U
V
DETAIL E  
0.12 BSC  
0.005 BSC  
SOLDERING FOOTPRINT*  
3.8  
0.15  
1.8  
0.07  
0.50  
0.0197  
0.30  
0.012  
1.0  
0.0394  
mm  
inches  
ǒ
Ǔ
SCALE 8:1  
*For additional information on our Pb−Free strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer  
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NL37WZ16/D  

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