NLV74AC86DTR2G [ONSEMI]

Quad 2-Input Exclusive OR Gate;
NLV74AC86DTR2G
型号: NLV74AC86DTR2G
厂家: ONSEMI    ONSEMI
描述:

Quad 2-Input Exclusive OR Gate

栅 光电二极管 逻辑集成电路 石英晶振 栅极
文件: 总8页 (文件大小:92K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74AC86, MC74ACT86  
Quad 2−Input Exclusive−OR  
Gate  
Features  
Outputs Source/Sink 24 mA  
Pb−Free Packages are Available*  
http://onsemi.com  
PDIP−14  
N SUFFIX  
CASE 646  
14  
1
SOIC−14  
D SUFFIX  
CASE 751A  
MAXIMUM RATINGS  
14  
Rating  
Symbol  
Value  
Unit  
1
DC Supply Voltage (Referenced to GND)  
V
CC  
−0.5 to  
+7.0  
V
TSSOP−14  
DT SUFFIX  
CASE 948G  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
V
−0.5 to  
V
V
in  
14  
V
CC  
+0.5  
1
V
out  
−0.5 to  
V
CC  
+0.5  
SOEIAJ−14  
M SUFFIX  
CASE 965  
DC Input Current, per Pin  
I
±20  
mA  
mA  
mA  
°C  
in  
14  
DC Output Sink/Source Current, per Pin  
I
±50  
±50  
out  
CC  
1
DC V or GND Current per Output Pin  
I
CC  
Storage Temperature  
T
stg  
−65 to  
+150  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
Pinout: 14−Lead Packages Conductors  
(Top View)  
V
CC  
14  
13  
12  
11  
10  
9
8
1
2
3
4
5
6
7
GND  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
section on page 4 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
April, 2005 − Rev. 7  
MC74AC86/D  
MC74AC86, MC74ACT86  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
5.0  
5.0  
Max  
6.0  
Unit  
AC  
2.0  
4.5  
0
V
Supply Voltage  
V
V
CC  
ACT  
5.5  
V , V  
in out  
DC Input Voltage, Output Voltage (Ref. to GND)  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
@ 3.0 V  
@ 4.5 V  
@ 5.5 V  
@ 4.5 V  
@ 5.5 V  
150  
40  
25  
10  
8.0  
Input Rise and Fall Time (Note 1)  
AC Devices except Schmitt Inputs  
ns/V  
t , t  
r
f
Input Rise and Fall Time (Note 2)  
ACT Devices except Schmitt Inputs  
t , t  
ns/V  
r
f
T
J
Junction Temperature (PDIP)  
Operating Ambient Temperature Range  
Output Current − High  
140  
85  
°C  
°C  
T
A
−40  
25  
I
−24  
24  
mA  
mA  
OH  
OL  
I
Output Current − Low  
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
CC  
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
DC CHARACTERISTICS  
74AC  
74AC  
T
A
=
−40°C to  
+85°C  
T
A
= +25°C  
V
CC  
Typ  
Guaranteed Limits  
(V)  
Symbol  
Parameter  
Minimum High Level  
Unit  
Conditions  
= 0.1 V  
V
V
V
3.0  
4.5  
5.5  
1.5  
2.25  
2.75  
2.1  
2.1  
V
OUT  
IH  
Input Voltage  
3.15  
3.85  
3.15  
3.85  
V
or V − 0.1 V  
CC  
3.0  
4.5  
5.5  
1.5  
2.25  
2.75  
0.9  
1.35  
1.65  
0.9  
1.35  
1.65  
V
= 0.1 V  
Maximum Low Level  
Input Voltage  
IL  
OUT  
V
V
or V − 0.1 V  
CC  
3.0  
4.5  
5.5  
2.99  
4.49  
5.49  
2.9  
4.4  
5.4  
2.9  
4.4  
5.4  
I
= −50 mA  
Minimum High Level  
Output Voltage  
OH  
OUT  
*V = V or V  
IH  
IN  
IL  
3.0  
4.5  
5.5  
2.56  
3.86  
4.86  
2.46  
3.76  
4.76  
−12 mA  
−24 mA  
−24 mA  
V
V
I
OH  
V
OL  
3.0  
4.5  
5.5  
0.002  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
I
= 50 mA  
OUT  
Maximum Low Level  
Output Voltage  
*V = V or V  
IN  
IL  
IH  
3.0  
4.5  
5.5  
0.36  
0.36  
0.36  
0.44  
0.44  
0.44  
12 mA  
24 mA  
24 mA  
V
I
OL  
I
IN  
Maximum Input  
Leakage Current  
5.5  
±0.1  
±1.0  
mA  
V = V , GND  
I
CC  
I
I
I
5.5  
5.5  
75  
mA  
mA  
V
V
= 1.65 V Max  
= 3.85 V Min  
†Minimum Dynamic  
Output Current  
OLD  
OHD  
CC  
OLD  
−75  
OHD  
Maximum Quiescent  
Supply Current  
5.5  
4.0  
40  
mA  
V
= V or GND  
IN CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one output loaded at a time.  
NOTE:  
I
IN  
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V  
.
CC  
CC  
http://onsemi.com  
2
 
MC74AC86, MC74ACT86  
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74AC  
74AC  
T
A
= −40°C  
T
A
= +25°C  
to +85°C  
C = 50 pF  
C = 50 pF  
L
L
V
(V)  
*
Fig.  
No.  
CC  
Min  
Typ  
Max  
Min  
Max  
Symbol  
Parameter  
Unit  
3.3  
5.0  
2.0  
1.5  
6.0  
4.5  
11.5  
8.5  
1.5  
1.0  
12.5  
9.0  
Propagation Delay  
Inputs to Outputs  
t
t
ns  
3−5  
3−5  
PLH  
3.3  
5.0  
2.0  
1.5  
6.5  
4.5  
11.5  
8.5  
1.5  
1.0  
12.5  
9.5  
Propagation Delay  
Inputs to Outputs  
ns  
PHL  
*Voltage Range 3.3 V is 3.3 V ±0.3 V  
Voltage Range 5.0 V is 5.0 V ±0.5 V.  
DC CHARACTERISTICS  
74ACT  
74ACT  
T
A
=
−40°C to  
+85°C  
T
A
= +25°C  
V
CC  
(V)  
Typ  
Guaranteed Limits  
Symbol  
Parameter  
Unit  
Conditions  
V
V
V
4.5  
5.5  
1.5  
1.5  
2.0  
2.0  
2.0  
2.0  
V
= 0.1 V  
Minimum High Level  
Input Voltage  
IH  
OUT  
V
V
V
or V − 0.1 V  
CC  
4.5  
5.5  
1.5  
1.5  
0.8  
0.8  
0.8  
0.8  
V
OUT  
= 0.1 V  
Maximum Low Level  
Input Voltage  
IL  
or V − 0.1 V  
CC  
4.5  
5.5  
4.49  
5.49  
4.4  
5.4  
4.4  
5.4  
I
= −50 mA  
Minimum High Level  
Output Voltage  
OH  
OUT  
*V = V or V  
IH  
IN  
IL  
4.5  
5.5  
3.86  
4.86  
3.76  
4.76  
V
V
−24 mA  
−24 mA  
I
OH  
V
OL  
4.5  
5.5  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
I
= 50 mA  
Maximum Low Level  
Output Voltage  
OUT  
*V = V or V  
IN  
IL  
IH  
4.5  
5.5  
0.36  
0.36  
0.44  
0.44  
V
24 mA  
24 mA  
I
OL  
I
IN  
Maximum Input  
Leakage Current  
5.5  
±0.1  
±1.0  
mA  
V = V , GND  
I CC  
DI  
Additional Max. I /Input  
5.5  
5.5  
5.5  
0.6  
1.5  
75  
mA  
mA  
mA  
V = V − 2.1 V  
CCT  
CC  
I
CC  
I
V
OLD  
V
OHD  
= 1.65 V Max  
†Minimum Dynamic  
Output Current  
OLD  
I
I
−75  
= 3.85 V Min  
OHD  
CC  
Maximum Quiescent  
Supply Current  
5.5  
4.0  
40  
mA  
V = V or GND  
IN CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one output loaded at a time.  
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74ACT  
74ACT  
T
A
= −40°C  
T
A
= +25°C  
to +85°C  
C = 50 pF  
C = 50 pF  
L
L
V
(V)  
*
Fig.  
No.  
CC  
Min  
Typ  
Max  
Min  
Max  
Symbol  
Parameter  
Unit  
t
t
Propagation Delay  
Propagation Delay  
5.0  
1.5  
8.5  
9.5  
1.0  
10.0  
ns  
3−5  
3−5  
PLH  
5.0  
1.5  
7.0  
9.5  
1.0  
10.5  
ns  
PHL  
*Voltage Range 5.0 V is 5.0 V ±0.5 V.  
http://onsemi.com  
3
MC74AC86, MC74ACT86  
CAPACITANCE  
Symbol  
Value  
Typ  
Parameter  
Unit  
pF  
Test Conditions  
C
C
Input Capacitance  
Power Dissipation Capacitance  
4.5  
35  
V
CC  
V
CC  
= 5.0 V  
= 5.0 V  
IN  
pF  
PD  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74AC86N  
PDIP−14  
25 Units / Rail  
25 Units / Rail  
MC74AC86NG  
PDIP−14  
(Pb−Free)  
MC74ACT86N  
PDIP−14  
25 Units / Rail  
25 Units / Rail  
MC74ACT86NG  
PDIP−14  
(Pb−Free)  
MC74AC86D  
SOIC−14  
55 Units / Rail  
55 Units / Rail  
MC74AC86DG  
SOIC−14  
(Pb−Free)  
MC74AC86DR2  
SOIC−14  
2500 Tape & Reel  
2500 Tape & Reel  
MC74AC86DR2G  
SOIC−14  
(Pb−Free)  
MC74ACT86D  
SOIC−14  
55 Units / Rail  
55 Units / Rail  
MC74ACT86DG  
SOIC−14  
(Pb−Free)  
MC74ACT86DR2  
MC74ACT86DR2G  
SOIC−14  
2500 Tape & Reel  
2500 Tape & Reel  
SOIC−14  
(Pb−Free)  
MC74AC86DTR2  
MC74ACT86DTR2  
MC74ACT86MEL  
MC74ACT86MELG  
TSSOP−14*  
TSSOP−14*  
SOEIAJ−14  
2500 Tape & Reel  
2500 Tape & Reel  
2000 Tape & Reel  
2000 Tape & Reel  
SOEIAJ−14  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
MARKING DIAGRAMS  
PDIP−14  
SOIC−14  
TSSOP−14  
SOEIAJ−14  
MC74AC86N  
AWLYYWW  
AC86  
AWLYWW  
AC  
86  
ALYW  
74AC86  
ALYW  
MC74ACT86N  
AWLYYWW  
ACT86  
AWLYWW  
ACT  
86  
ALYW  
74ACT86  
ALYW  
A
= Assembly Location  
WL, L = Wafer Lot  
YY, Y = Year  
WW, W = Work Week  
http://onsemi.com  
4
MC74AC86, MC74ACT86  
PACKAGE DIMENSIONS  
PDIP−14  
N SUFFIX  
CASE 646−06  
ISSUE N  
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
14  
1
8
7
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS  
WHEN FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE  
MOLD FLASH.  
B
5. ROUNDED CORNERS OPTIONAL.  
A
F
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.260  
0.185  
0.021  
0.070  
MIN  
18.16  
6.10  
3.69  
0.38  
1.02  
MAX  
18.80  
6.60  
4.69  
0.53  
1.78  
L
0.715  
0.240  
0.145  
0.015  
0.040  
N
C
−T−  
SEATING  
PLANE  
G
H
J
K
L
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.290  
−−−  
0.095  
0.015  
0.135  
0.310  
10  
1.32  
0.20  
2.92  
7.37  
−−−  
0.38  
2.41  
0.38  
3.43  
7.87  
10  
J
K
D 14 PL  
H
G
M
M
N
_
_
M
0.13 (0.005)  
0.015  
0.039  
1.01  
SOIC−14  
D SUFFIX  
CASE 751A−03  
ISSUE G  
NOTES:  
−A−  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
14  
8
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
−B−  
P 7 PL  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.127  
(0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
M
M
B
0.25 (0.010)  
7
1
G
F
R X 45  
_
C
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
G
J
K
M
P
R
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
−T−  
SEATING  
PLANE  
J
M
K
D 14 PL  
M
S
S
0.25 (0.010)  
T
B
A
1.27 BSC  
0.19  
0.10  
0
7
0
7
_
_
_
_
5.80  
0.25  
6.20 0.228 0.244  
0.50 0.010 0.019  
http://onsemi.com  
5
MC74AC86, MC74ACT86  
PACKAGE DIMENSIONS  
TSSOP−14  
DT SUFFIX  
CASE 948G−01  
ISSUE A  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
−U−  
L
N
PIN 1  
IDENT.  
F
7
1
DETAIL E  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
S
K
0.15 (0.006) T U  
A
K1  
−V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N−N  
G
H
J
J1  
K
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
−W−  
C
0.10 (0.004)  
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
SEATING  
PLANE  
−T−  
H
G
DETAIL E  
D
0
8
0
8
_
_
_
_
http://onsemi.com  
6
MC74AC86, MC74ACT86  
PACKAGE DIMENSIONS  
SOEIAJ−14  
M SUFFIX  
CASE 965−01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
14  
8
E
Q
1
H
E
_
E
M
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
L
7
1
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
DETAIL P  
Z
D
VIEW P  
A
e
c
MILLIMETERS  
INCHES  
MIN  
−−−  
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
A
−−−  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
b
A
1
A
1
b
c
0.20 0.002  
0.50 0.014  
0.27 0.007  
M
0.13 (0.005)  
0.10 (0.004)  
D
E
e
10.50 0.390  
5.45 0.201  
1.27 BSC  
0.050 BSC  
H
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
E
L
L
E
M
0
10  
0.90 0.028  
10  
_
0.035  
0.056  
0
_
_
_
Q
0.70  
−−−  
1
Z
1.42  
−−−  
http://onsemi.com  
7
MC74AC86, MC74ACT86  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
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MC74AC86/D  

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