NLV74ACT125DR2G [ONSEMI]

带 3 态输出的四路缓冲器;
NLV74ACT125DR2G
型号: NLV74ACT125DR2G
厂家: ONSEMI    ONSEMI
描述:

带 3 态输出的四路缓冲器

驱动 总线驱动器 总线收发器
文件: 总9页 (文件大小:142K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74AC125, MC74ACT125  
Quad Buffer with 3−State  
Outputs  
Features  
Outputs Source/Sink  
ACT125 Has TTL Compatible Inputs  
PbFree Packages are Available  
http://onsemi.com  
PDIP14  
N SUFFIX  
CASE 646  
14  
V
A
B
O
A
B
O
3
CC  
2
2
2
3
3
1
14  
13  
12  
11  
10  
9
8
SOIC14  
D SUFFIX  
CASE 751A  
14  
1
1
2
3
4
5
6
7
A
B
O
A
B
O
1
GND  
0
0
0
1
1
Figure 1. Pinout: 14Lead Packages Conductors  
TSSOP14  
DT SUFFIX  
CASE 948G  
14  
(Top View)  
1
PIN ASSIGNMENT  
PIN  
FUNCTION  
Inputs  
A , B  
n
SOEIAJ14  
M SUFFIX  
CASE 965  
n
14  
O
Outputs  
n
1
FUNCTION TABLE  
Inputs  
Output  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
A
n
B
n
O
n
L
L
L
H
L
H
H
X
Z
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
section on page 5 of this data sheet.  
NOTE: H = High Voltage Level;  
L = Low Voltage Level;  
Z = High Impedance;  
X = Immaterial  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
October, 2006 Rev. 7  
MC74AC125/D  
MC74AC125, MC74ACT125  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
V
DC Supply Voltage (Referenced to GND)  
0.5 to +7.0  
CC  
V
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
0.5 to V + 0.5  
V
in  
CC  
V
out  
0.5 to V + 0.5  
V
CC  
I
± 20  
± 50  
mA  
mA  
mA  
°C  
in  
I
DC Output Sink/Source Current, per Pin  
out  
CC  
I
DC V or GND Current per Output Pin  
± 50  
CC  
T
stg  
Storage Temperature  
65 to +150  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
4.5  
0
Typ  
5.0  
5.0  
Max  
6.0  
Unit  
AC  
V
Supply Voltage  
V
V
CC  
ACT  
5.5  
V , V  
in out  
DC Input Voltage, Output Voltage (Ref. to GND)  
V
CC  
V
V
V
@ 3.0 V  
@ 4.5 V  
@ 5.5 V  
150  
40  
25  
CC  
CC  
CC  
Input Rise and Fall Time (Note 1)  
AC Devices except Schmitt Inputs  
ns/V  
t , t  
r
f
T
Junction Temperature (PDIP)  
Operating Ambient Temperature Range  
Output Current HIGH  
140  
85  
°C  
°C  
J
T
A
40  
25  
I
24  
24  
mA  
mA  
OH  
I
Output Current LOW  
OL  
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
CC  
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
http://onsemi.com  
2
 
MC74AC125, MC74ACT125  
DC CHARACTERISTICS  
74AC  
74AC  
T
=
A
V
(V)  
CC  
T
A
= +25°C  
40°C to  
+85°C  
Symbol  
Parameter  
Unit  
Conditions  
Typ  
Guaranteed Limits  
Minimum High Level  
Input Voltage  
V
3.0  
4.5  
5.5  
1.5  
2.25  
2.75  
2.1  
3.15  
3.85  
2.1  
3.15  
3.85  
V
= 0.1 V  
OUT  
IH  
V
V
V
or V 0.1 V  
CC  
Maximum Low Level  
Input Voltage  
V
3.0  
4.5  
5.5  
1.5  
2.25  
2.75  
0.9  
1.35  
1.65  
0.9  
1.35  
1.65  
V
= 0.1 V  
OUT  
IL  
or V 0.1 V  
CC  
Minimum High Level  
Output Voltage  
V
3.0  
4.5  
5.5  
2.99  
4.46  
5.49  
2.9  
4.4  
5.4  
2.9  
4.4  
5.4  
I
= 50 mA  
OUT  
OH  
*V = V or V  
IN  
IL  
IH  
3.0  
4.5  
5.5  
2.56  
3.86  
4.86  
2.46  
3.76  
4.76  
12 mA  
24 mA  
24 mA  
V
V
V
I
I
OH  
Minimum Low Level  
Output Voltage  
V
3.0  
4.5  
5.5  
0.002  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
= 50 mA  
OUT  
OL  
*V = V or V  
IN  
IL  
IH  
3.0  
4.5  
5.5  
0.36  
0.36  
0.36  
0.44  
0.44  
0.44  
12 mA  
24 mA  
24 mA  
I
OL  
I
Maximum Input  
Leakage Current  
V = V , GND  
I CC  
IN  
5.5  
±0.1  
±1.0  
mA  
mA  
V (OE) = V , V  
IH  
I
V (OE) = V , V  
I IL IH  
I
IL  
OZ  
V = V , GND  
V = V , GND  
5.5  
±0.5  
±5.0  
I
CC  
I
CC  
V
= V , GND  
V
V
V
V
= V , GND  
CC  
O
CC  
O
†Minimum Dynamic  
Output Current  
I
5.5  
5.5  
75  
75  
mA  
mA  
= 1.65 V Max  
= 3.85 V Min  
OLD  
OLD  
OHD  
I
OHD  
Maximum Quiescent  
Supply Current  
= V or GND  
CC  
I
IN  
CC  
5.5  
8.0  
80  
mA  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one input loaded at a time.  
NOTE:  
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.  
IN CC  
AC CHARACTERISTICS  
74AC  
74AC  
T
= 40°C  
A
V
(V)  
*
T
C
= +25°C  
= 50 pF  
CC  
A
to +85°C  
C
Symbol  
Parameter  
Unit  
L
= 50 pF  
L
Min  
Max  
Min  
Max  
3.3  
5.0  
1.0  
1.0  
9.0  
7.0  
1.0  
1.0  
10  
7.5  
Propagation Delay  
Data to Output  
t
t
t
ns  
ns  
ns  
ns  
ns  
ns  
PLH  
PHL  
PZH  
3.3  
5.0  
1.0  
1.0  
9.0  
7.0  
1.0  
1.0  
10  
7.5  
Propagation Delay  
Data to Output  
3.3  
5.0  
1.0  
1.0  
10.5  
7.0  
1.0  
1.0  
11  
8.0  
Output Enable  
Time  
3.3  
5.0  
1.0  
1.0  
10  
8.0  
1.0  
1.0  
11  
8.5  
Output Enable  
Time  
t
PZL  
3.3  
5.0  
1.0  
1.0  
10  
9.0  
1.0  
1.0  
10.5  
9.5  
Output Disable  
Time  
t
PHZ  
3.3  
5.0  
1.0  
1.0  
10.5  
9.0  
1.0  
1.0  
11.5  
9.5  
Output Disable  
Time  
t
PLZ  
*Voltage Range 3.3 V is 3.3 V ±0.3 V.  
Voltage Range 5.0 V is 5.0 V ±0.5 V.  
http://onsemi.com  
3
MC74AC125, MC74ACT125  
DC CHARACTERISTICS  
74ACT  
74ACT  
T
=
A
V
(V)  
CC  
T
A
= +25°C  
40°C to  
+85°C  
Symbol  
Parameter  
Unit  
Conditions  
Typ  
Guaranteed Limits  
Minimum High Level  
Input Voltage  
V
V
V
4.5  
5.5  
1.5  
1.5  
2.2  
2.0  
2.0  
2.0  
V
= 0.1 V  
OUT  
IH  
V
V
V
or V 0.1 V  
CC  
Maximum Low Level  
Input Voltage  
4.5  
5.5  
1.5  
1.5  
0.8  
0.8  
0.8  
0.8  
V
= 0.1 V  
OUT  
IL  
or V 0.1 V  
CC  
Minimum High Level  
Output Voltage  
4.5  
5.5  
4.49  
5.49  
4.4  
5.4  
4.4  
5.4  
I
= 50 mA  
OUT  
OH  
*V = V or V  
IN  
IL  
IH  
4.5  
5.5  
3.86  
4.86  
3.76  
4.76  
V
V
24 mA  
24 mA  
I
I
OH  
Minimum Low Level  
Output Voltage  
V
I
4.5  
5.5  
0.001  
0.001  
0.1  
0.1  
0.1  
0.1  
= 50 mA  
OUT  
OL  
*V = V or V  
IH  
IN  
IL  
4.5  
5.5  
0.36  
0.36  
0.44  
0.44  
I
24 mA  
24 mA  
V
OH  
Maximum Input  
Leakage Current  
V = V , GND  
I CC  
IN  
5.5  
±0.1  
±1.0  
mA  
V (OE) = V , V  
IH  
I
V (OE) = V , V  
I IL IH  
I
IL  
OZ  
V = V , GND  
V = V , GND  
5.5  
±0.5  
±5.0  
mA  
I
CC  
I
CC  
V
= V , GND  
V
= V , GND  
O
CC  
O
CC  
DI  
Additional Max. I /Input  
5.5  
5.5  
5.5  
5.5  
0.6  
1.5  
75  
mA  
mA  
mA  
mA  
V = V 2.1 V  
CCT  
CC  
I
CC  
I
I
I
†Minimum Dynamic  
Output Current  
V
V
V
= 1.65 V Max  
OLD  
OLD  
OHD  
75  
80  
= 3.85 V Min  
OHD  
CC  
Maximum Quiescent Supply Current  
8.0  
= V or GND  
IN CC  
*All outputs loaded; thresholds on input associated with output under test.  
†Maximum test duration 2.0 ms, one input loaded at a time.  
AC CHARACTERISTICS  
74ACT  
74ACT  
= 40°C  
T
A
V
(V)  
*
T
C
= +25°C  
CC  
A
to +85°C  
Symbol  
Parameter  
Unit  
= 50 pF  
L
C
= 50 pF  
L
Min  
Max  
Min  
Max  
Propagation Delay  
Data to Output  
t
t
t
t
t
t
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
1.0  
9.0  
1.0  
10  
10  
ns  
ns  
ns  
ns  
ns  
ns  
PLH  
Propagation Delay  
Data to Output  
1.0  
1.0  
1.0  
1.0  
1.0  
9.0  
8.5  
9.5  
9.5  
10  
1.0  
1.0  
1.0  
1.0  
1.0  
PHL  
PZH  
PZL  
PHZ  
PLZ  
Output Enable  
Time  
9.5  
Output Enable  
Time  
10.5  
10.5  
10.5  
Output Disable  
Time  
Output Disable  
Time  
*Voltage Range 5.0 V is 5.0 V ±0.5 V.  
CAPACITANCE  
Symbol  
Value  
Parameter  
Unit  
Test Conditions  
Typ  
4.5  
45  
C
C
Input Capacitance  
Power Dissipation Capacitance  
pF  
pF  
V
V
= 5.0 V  
= 5.0 V  
IN  
CC  
CC  
PD  
http://onsemi.com  
4
MC74AC125, MC74ACT125  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74AC125N  
PDIP14  
25 Units / Rail  
55 Units / Rail  
MC74AC125NG  
PDIP14  
(PbFree)  
MC74AC125D  
SOIC14  
MC74AC125DG  
SOIC14  
(PbFree)  
MC74AC125DR2  
SOIC14  
MC74AC125DR2G  
SOIC14  
(PbFree)  
2500 / Tape & Reel  
MC74AC125DTR2  
MC74AC125DTR2G  
MC74AC125M  
TSSOP14*  
TSSOP14*  
SOEIAJ14  
50 Units / Rail  
MC74AC125MG  
SOEIAJ14  
(PbFree)  
MC74AC125MEL  
MC74AC125MELG  
SOEIAJ14  
2000 / Tape & Reel  
SOEIAJ14  
(PbFree)  
MC74ACT125DR2  
MC74ACT125DR2G  
SOIC14  
SOIC14  
(PbFree)  
2500 / Tape & Reel  
MC74ACT125DTR2  
MC74ACT125DTR2G  
MC74ACT125MEL  
MC74ACT125MELG  
TSSOP14*  
TSSOP14*  
SOEIAJ14  
2000 / Tape & Reel  
25 Units / Rail  
SOEIAJ14  
(PbFree)  
MC74ACT125N  
PDIP14  
MC74ACT125NG  
PDIP14  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently PbFree.  
MARKING DIAGRAMS  
PDIP14  
SOIC14  
TSSOP14  
SOEIAJ14  
14  
14  
14  
1
14  
AC  
125  
ALYWꢀ  
74AC125  
ALYWG  
AC125G  
AWLYWW  
MC74AC125N  
AWLYYWWG  
1
1
1
14  
14  
14  
ACT  
125  
ALYWꢀ  
74ACT125  
ALYWG  
ACT125G  
AWLYWW  
1
1
1
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
W, WW = Work Week  
G or  
= PbFree Package  
(Note: Microdot may be in either location)  
http://onsemi.com  
5
MC74AC125, MC74ACT125  
PACKAGE DIMENSIONS  
PDIP14  
CASE 64606  
ISSUE P  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
14  
1
8
7
B
INCHES  
MILLIMETERS  
A
F
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.260  
0.185  
0.021  
0.070  
MIN  
18.16  
6.10  
3.69  
0.38  
1.02  
MAX  
19.56  
6.60  
4.69  
0.53  
1.78  
0.715  
0.240  
0.145  
0.015  
0.040  
L
N
C
G
H
J
K
L
M
N
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.290  
−−−  
0.095  
0.015  
0.135  
0.310  
10 ꢁ  
0.039  
1.32  
0.20  
2.92  
7.37  
−−−  
0.38  
2.41  
0.38  
3.43  
7.87  
10 ꢁ  
1.01  
T−  
SEATING  
PLANE  
J
K
0.015  
D 14 PL  
H
G
M
M
0.13 (0.005)  
http://onsemi.com  
6
MC74AC125, MC74ACT125  
PACKAGE DIMENSIONS  
SOIC14  
CASE 751A03  
ISSUE H  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
A−  
14  
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.127  
(0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
B−  
P 7 PL  
M
M
B
0.25 (0.010)  
7
1
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
F
R X 45ꢁ  
C
A
B
C
D
F
G
J
K
M
P
R
8.55  
3.80  
1.35  
0.35  
0.40  
1.27 BSC  
0.19  
0.10  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
T−  
SEATING  
PLANE  
J
M
K
D 14 PL  
M
S
S
0.25 (0.010)  
T
B
A
0 ꢁ  
5.80  
0.25  
7ꢁ  
0 ꢁ  
7ꢁ  
6.20 0.228 0.244  
0.50 0.010 0.019  
SOLDERING FOOTPRINT*  
7X  
7.04  
14X  
1.52  
1
14X  
0.58  
1.27  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
MC74AC125, MC74ACT125  
PACKAGE DIMENSIONS  
TSSOP14  
CASE 948G01  
ISSUE B  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
M
S
S
V
0.10 (0.004)  
T
U
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
DETAIL E  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T  
U
A
V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
A
B
C
D
F
G
H
J
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION NN  
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
J1  
K
W−  
C
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
0 ꢁ  
8 ꢁ  
0 ꢁ  
8 ꢁ  
SEATING  
PLANE  
T−  
H
G
DETAIL E  
D
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
8
MC74AC125, MC74ACT125  
PACKAGE DIMENSIONS  
SOEIAJ14  
CASE 96501  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
14  
8
E
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
H
E
E
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
7
1
DETAIL P  
Z
D
MILLIMETERS  
INCHES  
MIN MAX  
−−− 0.081  
VIEW P  
DIM MIN  
MAX  
2.05  
0.20  
0.50  
0.20  
10.50  
5.45  
A
e
A
−−−  
0.05  
0.35  
0.10  
9.90  
5.10  
c
A
1
b
c
0.002  
0.008  
0.020  
0.008  
0.413  
0.215  
0.014  
0.004  
0.390  
0.201  
D
E
e
b
A
1
1.27 BSC  
0.050 BSC  
H
M
7.40  
0.50  
1.10  
8.20  
0.85  
1.50  
0.291  
0.020  
0.043  
0.323  
0.033  
0.059  
0.13 (0.005)  
E
0.10 (0.004)  
0.50  
L
E
10ꢁ  
0.90  
1.42  
M
0
10ꢁ  
0.035  
−−− 0.056  
0
0.028  
Q
1
0.70  
−−−  
Z
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
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Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
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MC74AC125/D  

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