NLAS7242MUTBG [ONSEMI]

High-Speed USB 2.0 (480 Mbps) DPDT Switches; 高速USB 2.0 ( 480 Mbps)的双刀双掷开关
NLAS7242MUTBG
型号: NLAS7242MUTBG
厂家: ONSEMI    ONSEMI
描述:

High-Speed USB 2.0 (480 Mbps) DPDT Switches
高速USB 2.0 ( 480 Mbps)的双刀双掷开关

开关 光电二极管
文件: 总10页 (文件大小:662K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NLAS7242  
High-Speed USB 2.0  
(480 Mbps) DPDT Switches  
The NLAS7242 is a DPDT switch optimized for highspeed  
USB 2.0 applications within portable systems. It features ultralow on  
capacitance, C = 7.5 pF (typ), and a bandwidth above 950 MHz. It  
is optimized for applications that use a single USB interface connector  
ON  
http://onsemi.com  
MARKING  
to route multiple signal types. The C and R of both channels are  
ON  
ON  
suitably low to allow the NLAS7242 to pass any speed USB data or  
audio signals going to a moderately resistive terminal such as an  
external headset. The device is offered in a UQFN10 1.4 mm x 1.8 mm  
package.  
DIAGRAM  
UQFN10  
CASE 488AT  
AD MG  
Features  
G
1
Optimized FlowThrough Pinout  
R : 5.0 Typ @ V = 4.2 V  
ON  
CC  
C : 7.5 pF Typ @ V = 3.3 V  
AD  
M
G
=
=
=
Device Code  
Date Code  
PbFree Device  
ON  
CC  
V Range: 1.65 V to 4.5 V  
CC  
Typical Bandwidth: 950 MHz  
(Note: Microdot may be in either location)  
1.4 mm x 1.8 mm x 0.50 mm UQFN10  
OVT on Common Signal Pins D+/Dup to 5.25 V  
8 kV HBM ESD Protection on All Pins  
This is a PbFree Device  
ORDERING INFORMATION  
Device  
Package  
Shipping  
3000/Tape & Reel  
Typical Applications  
NLAS7242MUTBG  
UQFN0  
High Speed USB 2.0 Data  
Mobile Phones  
Portable Devices  
(PbFree)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
NLAS7242  
HS  
USB  
XCVR  
FS USB  
XCVR or  
AUDIO  
AMP  
Figure 1. Application Diagram  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
August, 2009 Rev. 4  
NLAS7242/D  
NLAS7242  
HSD2+  
HSD2−  
7
6
8
9
5
4
3
OE  
HSD1+  
V
CC  
HSD1−  
CONTROL  
S
10  
GND  
1
2
D+  
D−  
Figure 2. Pin Connections and Logic Diagram (Top View)  
Table 1. PIN DESCRIPTION  
Table 2. TRUTH TABLE  
Function  
Pin  
S
HSD1+,  
HSD2+,  
HSD1−  
HSD2−  
OE  
S
Control Input  
Output Enable  
Data Ports  
1
0
0
X
0
1
OFF  
ON  
OFF  
OFF  
OFF  
ON  
OE  
HSD1+, HSD1, HSD2+,  
HSD2, D+, D−  
MAXIMUM RATINGS  
Symbol  
Pins  
Parameter  
Value  
0.5 to +5.5  
Unit  
V
V
CC  
V
IS  
V
CC  
Positive DC Supply Voltage  
Analog Signal Voltage  
HSDn+,  
HSDn−  
0.5 to V + 0.3  
V
CC  
D+, D−  
0.5 to +5.25  
0.5 to +5.5  
50  
V
IN  
S, OE  
Control Input Voltage, Output Enable Voltage  
Positive DC Supply Current  
V
I
V
CC  
mA  
°C  
CC  
T
Storage Temperature  
65 to +150  
$300  
S
I
I
I
HSDn+,  
HSDn,  
D+, D−  
Analog Signal Continuous CurrentClosed Switch  
mA  
IS_CON  
HSDn+,  
HSDn,  
D+, D−  
Analog Signal Continuous Current 10% Duty Cycle  
Control Input Current, Output Enable Current  
$500  
$20  
mA  
mA  
IS_PK  
S, OE  
IN  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Pins  
Parameter  
Positive DC Supply Voltage  
Min  
1.65  
GND  
Max  
Unit  
V
V
CC  
V
IS  
4.5  
HSDn+,  
HSDn−  
Analog Signal Voltage  
V
CC  
V
D+, D−  
GND  
GND  
40  
4.5  
V
IN  
S, OE  
Control Input Voltage, Output Enable Voltage  
Operating Temperature  
V
CC  
V
T
A
+85  
°C  
Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable.  
Typical values are listed for guidance only and are based on the particular conditions listed for section, where applicable. These conditions  
are valid for all values found in the characteristics tables unless otherwise specified in the test conditions.  
ESD PROTECTION  
Symbol  
Parameter  
Value  
Unit  
ESD  
Human Body Model All Pins  
8.0  
kV  
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2
NLAS7242  
DC ELECTRICAL CHARACTERISTICS  
CONTROL INPUT, OUTPUT ENABLE VOLTAGE (Typical: T = 25°C)  
40°C to +85°C  
Min  
Typ  
Max  
Symbol  
Pins  
Parameter  
Test Conditions  
V
CC  
(V)  
Unit  
V
IH  
S, OE  
Control Input, Output  
Enable HIGH Voltage  
(See Figure 11)  
2.7  
3.3  
4.2  
1.25  
1.3  
1.4  
V
V
S, OE  
S, OE  
Control Input, Output  
Enable LOW Voltage  
(See Figure 11)  
2.7  
3.3  
4.2  
0.35  
0.4  
V
IL  
0.5  
I
IN  
Current Input, Output  
Enable Leakage Current  
0 V V  
CC  
1.65 4.5  
1.0  
A
IS  
SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C, V = 3.3 V)  
CC  
40°C to +85°C  
Min  
Typ  
Max  
Symbol  
Pins  
Parameter  
Test Conditions  
V
CC  
(V)  
Unit  
I
V
Quiescent Supply Current 0 V V ; I = 0 A  
1.65 3.6  
3.6 4.5  
1.0  
1.0  
A
CC  
CC  
IS  
CC  
D
0 V V 0.5 V  
IS  
CC  
CC  
CC  
I
I
OFF State Leakage  
0 V V  
1.65 4.5  
0.1  
1.0  
1.0  
A  
A  
OZ  
IS  
D+, DPower OFF Leakage  
0 V V  
0
OFF  
IS  
Current  
LIMITED VIS SWING ON RESISTANCE (Typical: T = 25°C)  
40°C to +85°C  
Min  
Typ  
Max  
Symbol  
Pins  
Parameter  
Test Conditions  
V
CC  
(V)  
Unit  
R
OnResistance (Note 1)  
I
= 8 mA  
= 0 V to 0.4 V  
2.7  
3.3  
4.2  
6.0  
5.5  
5.0  
8.6  
7.6  
7.0  
ON  
ON  
IS  
V
R
OnResistance Flatness  
I
= 8 mA  
2.7  
3.3  
4.2  
0.55  
0.30  
0.20  
FLAT  
ON  
IS  
(Notes 1 and 2)  
V
= 0 V to 0.4 V  
R
OnResistance Matching  
(Notes 1 and 3)  
I
= 8 mA  
= 0 V to 0.4 V  
2.7  
3.3  
4.2  
0.60  
0.60  
0.60  
ON  
ON  
V
IS  
1. Guaranteed by design.  
2. Flatness is defined as the difference between the maximum and minimum value of OnResistance as measured over the specified analog  
signal ranges.  
+
+
3. R = R  
R  
between HSD1 and HSD1 or HSD2 and HSD2 .  
ON  
ON(max)  
ON(min)  
FULL VIS SWING ON RESISTANCE (Typical: T = 25°C)  
40°C to +85°C  
Min  
Typ  
Max  
Symbol  
Pins  
Parameter  
OnResistance  
Test Conditions  
V
CC  
(V)  
Unit  
R
I
= 8 mA  
2.7  
3.3  
4.2  
10  
8.0  
7.0  
13.5  
9.75  
8.50  
ON  
ON  
IS  
V
= 0 V to V  
CC  
CC  
CC  
R
OnResistance Flatness  
(Notes 4 and 5)  
I
= 8 mA  
= 0 V to V  
2.7  
3.3  
4.2  
4.5  
3.0  
2.5  
FLAT  
ON  
V
IS  
R
OnResistance  
(Note 4 and 6)  
I
= 8 mA  
= 0 V to V  
2.7  
3.3  
4.2  
0.60  
0.60  
0.60  
ON  
ON  
V
IS  
4. Guaranteed by design.  
5. Flatness is defined as the difference between the maximum and minimum value of OnResistance as measured over the specified analog  
signal ranges.  
+
+
6. R = R  
R between HSD1 and HSD1 or HSD2 and HSD2 .  
ON(min)  
ON  
ON(max)  
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3
 
NLAS7242  
AC ELECTRICAL CHARACTERISTICS  
TIMING/FREQUENCY (Typical: T = 25°C, V = 3.3 V, R = 50 , C = 35 pF, f = 1 MHz)  
CC  
L
L
405C to +855C  
Min  
Typ  
Max  
Symbol  
Pins  
Parameter  
Test Conditions  
V
CC  
(V)  
Unit  
t
Closed to Open  
TurnON Time  
1.65 4.5  
1.65 4.5  
1.65 4.5  
1.65 4.5  
13.0  
30.0  
ns  
ON  
(See Figures 4 and 5)  
t
Open to Closed  
TurnOFF Time  
(See Figures 4 and 5)  
2.0  
12.0  
25.0  
ns  
ns  
OFF  
T
BBM  
BreakBeforeMake  
Time (See Figure 3)  
BW  
3 dB Bandwidth  
(See Figure 10)  
C = 5 pF  
L
950  
MHz  
ISOLATION (Typical: T = 25°C, V = 3.3 V, R = 50 , C = 5 pF)  
CC  
L
L
405C to +855C  
Min  
Typ  
Max  
Symbol  
Pins  
Parameter  
Test Conditions  
V
CC  
(V)  
Unit  
O
Open  
OFFIsolation  
(See Figure 6)  
f = 240 MHz  
1.65 4.5  
22  
dB  
IRR  
X
TALK  
HSDn+ to HSDnNonAdjacent Channel  
f = 240 MHz  
1.65 4.5  
24  
dB  
Crosstalk  
CAPACITANCE (Typical: T = 25°C, V = 3.3 V, R = 50 , C = 5 pF)  
CC  
L
L
405C to +855C  
Min  
Typ  
1.5  
1.0  
7.5  
Max  
Symbol  
Pins  
Parameter  
Test Conditions  
Unit  
C
S, OE  
Control Pin, Output Enable  
Input Capacitance  
pF  
V
V
V
= 0 V, f = 1 MHz  
= 0 V, f = 10 MHz  
IN  
CC  
CC  
CC  
C
D+ to  
HSD1+ or  
HSD2+  
ON Capacitance  
= 3.3 V; OE = 0 V, f = 1 MHz  
S = 0 V or 3.3 V  
ON  
V
CC  
= 3.3 V; OE = 0 V, f = 10 MHz  
S = 0 V or 3.3 V  
6.5  
3.8  
C
HSD1n or OFF Capacitance  
HSD2n  
V
CC  
= V = 3.3 V;  
OFF  
IS  
OE = 0 V, S = 3.3 V or 0 V,  
f = 1 MHz  
V
CC  
= V = 3.3 V;  
2.0  
IS  
OE = 0 V, S = 3.3 V or 0 V,  
f = 10 MHz  
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4
NLAS7242  
V
CC  
DUT  
Input  
V
CC  
Output  
GND  
V
OUT  
0.1 F  
50 ꢀ  
35 pF  
t
BMM  
Output  
50 % OF  
DROOP  
VOLTAGE  
DROOP  
Switch Select Pin  
Figure 3. tBBM (Time BreakBeforeMake)  
V
CC  
Input  
50%  
50%  
90%  
DUT  
0 V  
V
CC  
Output  
V
OUT  
V
0.1 F  
OH  
Open  
90%  
50 ꢀ  
35 pF  
Output  
V
OL  
Input  
t
t
OFF  
ON  
Figure 4. tON/tOFF  
V
CC  
V
CC  
Input  
50%  
50%  
DUT  
0 V  
50 ꢀ  
Output  
V
OUT  
V
OH  
Open  
35 pF  
Output  
V
10%  
10%  
OL  
Input  
t
t
ON  
OFF  
Figure 5. tON/tOFF  
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5
NLAS7242  
50 ꢀ  
DUT  
Reference  
Input  
50 Generator  
Transmitted  
Output  
50 ꢀ  
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss  
is the bandwidth of an On switch. V , Bandwidth and V are independent of the input signal direction.  
ISO  
ONL  
V
OUT  
= Off Channel Isolation = 20 Logǒ Ǔfor V  
V
V
at 100 kHz  
IN  
ISO  
V
IN  
OUT  
V
= On Channel Loss = 20 Logǒ Ǔ for V  
at 100 kHz to 50 MHz  
ONL  
IN  
V
IN  
Bandwidth (BW) = the frequency 3 dB below V  
= Use V setup and test to all other switch analog input/outputs terminated with 50 ꢀ  
ONL  
V
CT  
ISO  
Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk  
(On Channel to Off Channel)/VONL  
DETAILED DESCRIPTION  
High Speed (480Mbps) USB 2.0 Optimized  
Over Voltage Tolerant  
The NLAS7242 is a DPDT switch designed for USB  
The NLAS7242 features over voltage tolerant I/O  
protection on the common signal pins D+/D. This allows  
the switch to interface directly with a USB connector. The  
applications within portable systems. The R and C of  
ON  
ON  
both switches are maintained at industryleading low levels  
in order to ensure maximum signal integrity for USB 2.0  
high speed data communication. The NLAS7242 switch can  
be used to switch between high speed (480Mbps) USB  
signals and a variety of audio or data signals such as full  
speed USB, UART or even a moderately resistive audio  
terminal.  
D+/Dpins can withstand a short to V , up to 5.25 V,  
BUS  
continuous DC current for up to 24 hours as specified in the  
USB 2.0 specification. This protection is achieved without  
the need for any external resistors or protection devices.  
http://onsemi.com  
6
NLAS7242  
NLAS7242  
Figure 7. Board Schematic  
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7
NLAS7242  
Figure 8. Signal Quality  
Figure 9. Near End Eye Diagram  
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8
NLAS7242  
Near End Test Data:  
Consecutive jitter range  
Min  
Max  
54.37  
59.14  
50.79  
74.43  
61.60  
55.31  
82.55  
53.50  
62.60  
73.21  
59.56  
34.57  
81.65  
58.55  
48.43  
80.33  
71.65  
47.30  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
ps  
Paired JK jitter range  
Paired KJ jitter range  
Consecutive jitter range  
Paired JK jitter range  
Paired KJ jitter range  
Consecutive jitter range  
Paired JK jitter range  
Paired KJ jitter range  
Std.  
N.C.  
N.O.  
200 ps  
+200 ps  
200 ps  
200 ps  
+200 ps  
+200 ps  
0
0.5  
1  
1.5  
2  
2.5  
3  
3.5  
4  
4.5  
1.0E+6  
10.0E+6  
100.0E+6  
1.0E+9  
FREQUENCY (Hz)  
Figure 10. Magnitude vs. Frequency  
@ VCC = 3.3 V, All Temperatures  
ICC Leakage Current as a Function of VIN Voltage (255C)  
2.50E03  
4.2 V  
3.3 V  
2.00E03  
1.50E03  
1.00E03  
5.00E04  
0.00E+00  
5.00E04  
2.7 V  
0
0.5  
1
1.5  
2
2.5  
(V)  
3
3.5  
4
4.5  
V
IN  
Figure 11. ICC vs. VIN, Select Pin, All VCC’s, 255C  
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9
NLAS7242  
PACKAGE DIMENSIONS  
UQFN10 1.4x1.8, 0.4P  
CASE 488AT01  
ISSUE A  
EDGE OF PACKAGE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
D
A
2. CONTROLLING DIMENSION: MILLIMETERS  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM  
FROM TERMINAL.  
4. COPLANARITY APPLIES TO THE EXPOSED PAD  
AS WELL AS THE TERMINALS.  
L1  
E
PIN 1 REFERENCE  
DETAIL A  
MILLIMETERS  
Bottom View  
DIM MIN  
MAX  
0.60  
0.05  
0.10  
0.10  
C
2X  
A
A1  
A3  
b
0.45  
0.00  
(Optional)  
0.127 REF  
C
2X  
0.15  
0.25  
MOLD CMPD  
EXPOSED Cu  
B
D
1.40 BSC  
TOP VIEW  
E
1.80 BSC  
0.40 BSC  
e
A
A3  
0.05  
0.05  
C
L
0.30  
0.50  
0.15  
0.60  
0.00  
0.40  
L1  
L3  
A1  
C
DETAIL B  
Side View  
(Optional)  
10X  
A1  
SEATING  
C
MOUNTING FOOTPRINT*  
PLANE  
SIDE VIEW  
1.700  
0.0669  
9 X  
0.563  
0.0221  
5
3
e/2  
e
9 X L  
0.663  
0.0261  
6
1
0.200  
0.0079  
1
10  
10 X  
0.10 C A B  
2.100  
L3  
b
0.05 C  
NOTE 3  
0.0827  
BOTTOM VIEW  
0.400  
0.0157  
10 X  
0.225  
PITCH  
0.0089  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
*For additional information on our PbFree strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operat-  
ing parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor  
the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associ-  
ated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/  
Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NLAS7242/D  

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