MBRD1035CTLG [ONSEMI]

SWITCHMODE Schottky Power Rectifier; 开关模式功率肖特基整流器
MBRD1035CTLG
型号: MBRD1035CTLG
厂家: ONSEMI    ONSEMI
描述:

SWITCHMODE Schottky Power Rectifier
开关模式功率肖特基整流器

开关
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MBRD1035CTL  
SWITCHMODE  
Schottky Power Rectifier  
DPAK Power Surface Mount Package  
The MBRD1035CTL employs the Schottky Barrier principle in a  
large area metaltosilicon power diode. State of the art geometry  
features epitaxial construction with oxide passivation and metal  
overlay contact. Ideally suited for low voltage, high frequency  
switching power supplies, free wheeling diode and polarity protection  
diodes.  
http://onsemi.com  
SCHOTTKY BARRIER  
RECTIFIER  
10 AMPERES  
35 VOLTS  
Features  
Highly Stable Oxide Passivated Junction  
Guardring for Stress Protection  
1
Matched Dual Die Construction −  
May be Paralleled for High Current Output  
High dv/dt Capability  
4
3
Short Heat Sink Tap Manufactured Not Sheared  
Very Low Forward Voltage Drop  
Epoxy Meets UL 94 V0 @ 0.125 in  
PbFree Packages are Available  
4
2
1
3
Mechanical Characteristics:  
Case: Epoxy, Molded  
DPAK  
CASE 369C  
Weight: 0.4 Gram (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
MARKING DIAGRAM  
YWW  
B10  
35CLG  
Y
= Year  
WW  
= Work Week  
B1035CL = Device Code  
G
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
July, 2010 Rev. 7  
MBRD1035CTL/D  
MBRD1035CTL  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
35  
V
RRM  
RWM  
V
R
Average Rectified Forward Current  
Per Leg  
Per Package  
I
5.0  
10  
A
A
A
O
(At Rated V , T = 115°C)  
R
C
Peak Repetitive Forward Current  
Per Leg  
I
10  
FRM  
(At Rated V , Square Wave, 20 kHz, T = 115°C)  
R
C
NonRepetitive Peak Surge Current  
Per Package  
I
FSM  
50  
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)  
Storage / Operating Case Temperature  
T
T
55 to +150  
55 to +150  
10,000  
°C  
°C  
stg,  
c
Operating Junction Temperature (Note 1)  
T
J
Voltage Rate of Change (Rated V , T = 25°C)  
dv/dt  
V/ms  
R
J
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. The heat generated must be less than the thermal conductivity from JunctiontoAmbient: dP /dT < 1/R .  
q
JA  
D
J
THERMAL CHARACTERISTICS  
Thermal Resistance, JunctiontoCase  
Thermal Resistance, JunctiontoAmbient (Note 2)  
Per Leg  
Per Leg  
R
R
3.0  
°C/W  
°C/W  
q
JC  
JA  
137  
q
ELECTRICAL CHARACTERISTICS  
Maximum Instantaneous Forward Voltage (Note 3)  
(See Figure 2)  
V
V
F
Per Leg  
Per Leg  
0.47  
0.41  
0.56  
0.55  
I = 5 Amps, T = 25°C  
F
J
I = 5 Amps, T = 100°C  
F
J
I = 10 Amps, T = 25°C  
F
J
I = 10 Amps, T = 100°C  
F
J
Maximum Instantaneous Reverse Current (Note 3)  
(See Figure 4)  
I
R
mA  
2.0  
30  
0.20  
5.0  
(V = 35 V, T = 25°C)  
R
J
(V = 35 V, T = 100°C)  
R
J
(V = 17.5 V, T = 25°C)  
R
J
(V = 17.5 V, T = 100°C)  
R
J
2. Rating applies when using minimum pad size, FR4 PC Board  
3. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MBRD1035CTL  
DPAK  
75 Units / Rail  
75 Units / Rail  
MBRD1035CTLG  
DPAK  
(PbFree)  
MBRD1035CTLT4  
MBRD1035CTLT4G  
DPAK  
2500 Units / Tape & Reel  
2500 Units / Tape & Reel  
DPAK  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
2
 
MBRD1035CTL  
TYPICAL CHARACTERISTICS  
100  
10  
100  
T = 125°C  
J
T = 125°C  
J
10  
T = 100°C  
J
T = 25°C  
J
T = 25°C  
T = - 40°C  
J
J
1.0  
0.1  
1.0  
0.1  
T = 100°C  
J
0.10  
0.30  
0.50  
0.70  
0.90  
1.10  
0.10  
0.30  
0.50  
0.70  
0.90  
1.10  
V , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)  
F
V , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)  
F
Figure 1. Typical Forward Voltage Per Leg  
Figure 2. Maximum Forward Voltage Per Leg  
1E+0  
1E+0  
100E-3  
100E-3  
T = 125°C  
J
T = 125°C  
J
10E-3  
1E-3  
10E-3  
1E-3  
T = 100°C  
J
T = 100°C  
J
100E-6  
10E-6  
1E-6  
T = 25°C  
J
100E-6  
10E-6  
1E-6  
T = 25°C  
J
0
10  
20  
30  
35  
0
10  
20  
30  
35  
V , REVERSE VOLTAGE (VOLTS)  
R
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 3. Typical Reverse Current Per Leg  
Figure 4. Maximum Reverse Current Per Leg  
http://onsemi.com  
3
MBRD1035CTL  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
4.0  
3.5  
3.0  
2.5  
2.0  
dc  
SQUARE WAVE  
(50% DUTY CYCLE)  
SQUARE WAVE  
(50% DUTY CYCLE)  
dc  
I /I = p  
o
pk  
I /I = p  
pk o  
I /I = 5  
o
pk  
I /I = 10  
o
pk  
I /I = 5  
pk o  
1.5  
1.0  
I /I = 20  
o
pk  
I /I = 10  
pk o  
I /I = 20  
pk o  
1.0  
0
0.5  
0
freq = 20 kHz  
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
0
20  
40  
60  
80  
100  
120  
140  
I , AVERAGE FORWARD CURRENT (AMPS)  
O
T , LEAD TEMPERATURE (°C)  
L
Figure 5. Current Derating Per Leg  
Figure 6. Forward Power Dissipation Per Leg  
125  
115  
105  
1000  
100  
10  
R
= 2.43°C/W  
T = 25°C  
q
JA  
J
R
q
JA  
= 25°C/W  
R
= 48°C/W  
q
JA  
95  
85  
75  
65  
R
q
JA  
= 67.5°C/W  
R
= 84°C/W  
q
JA  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
V , DC REVERSE VOLTAGE (VOLTS)  
R
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 7. Capacitance Per Leg  
Figure 8. Typical Operating Temperature  
Derating Per Leg *  
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any  
reverse voltage conditions. Calculations of T therefore must include forward and reverse power effects. The allowable operating  
J
T may be calculated from the equation:  
J
T = T  
r(t)(Pf + Pr) where  
J
Jmax  
r(t) = thermal impedance under given conditions,  
Pf = forward power dissipation, and  
Pr = reverse power dissipation  
This graph displays the derated allowable T due to reverse bias under DC conditions only and is calculated as T = T  
r(t)Pr,  
J
J
Jmax  
where r(t) = Rthja. For other power applications further calculations must be performed.  
http://onsemi.com  
4
MBRD1035CTL  
1.0  
50%(DUTY CYCLE)  
20%  
10%  
5.0%  
0.1  
2.0%  
1.0%  
SINGLE PULSE  
R
tjl(t)  
= R r  
tjl (t)  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, TIME (s)  
1.0  
10  
100  
1000  
Figure 9. Thermal Response Junction to Case (Per Leg)  
1.0E+00  
1.0E-01  
1.0E-02  
50% (DUTY CYCLE)  
20%  
10%  
5.0%  
2.0%  
1.0%  
1.0E-03  
1.0E-04  
SINGLE PULSE  
R
tjl(t)  
= R r  
tjl (t)  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, TIME (s)  
1.0  
10  
100  
1000  
10000  
Figure 10. Thermal Response Junction to Ambient (Per Leg)  
http://onsemi.com  
5
MBRD1035CTL  
PACKAGE DIMENSIONS  
DPAK (SINGLE GAUGE)  
CASE 369C01  
ISSUE D  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCHES.  
3. THERMAL PAD CONTOUR OPTIONAL WITHIN  
DIMENSIONS b3, L3 and Z.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL  
NOT EXCEED 0.006 INCHES PER SIDE.  
5. DIMENSIONS D AND E ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY.  
6. DATUMS A AND B ARE DETERMINED AT DATUM  
PLANE H.  
C
A
D
A
E
c2  
b3  
B
4
2
L3  
L4  
Z
H
DETAIL A  
1
3
INCHES  
DIM MIN MAX  
0.086 0.094  
A1 0.000 0.005  
0.025 0.035  
MILLIMETERS  
MIN  
2.18  
0.00  
0.63  
0.76  
4.57  
0.46  
0.46  
5.97  
6.35  
MAX  
2.38  
0.13  
0.89  
1.14  
5.46  
0.61  
0.61  
6.22  
6.73  
A
b2  
c
b
b
b2 0.030 0.045  
b3 0.180 0.215  
M
0.005 (0.13)  
C
H
e
c
0.018 0.024  
c2 0.018 0.024  
GAUGE  
SEATING  
PLANE  
L2  
PLANE  
C
D
E
e
0.235 0.245  
0.250 0.265  
0.090 BSC  
2.29 BSC  
9.40 10.41  
1.40 1.78  
2.74 REF  
0.51 BSC  
0.89 1.27  
H
L
L1  
L2  
0.370 0.410  
0.055 0.070  
0.108 REF  
L
A1  
L1  
0.020 BSC  
DETAIL A  
L3 0.035 0.050  
ROTATED 905 CW  
L4  
Z
−−− 0.040  
0.155 −−−  
−−−  
3.93  
1.01  
−−−  
SOLDERING FOOTPRINT*  
6.20  
0.244  
3.00  
0.118  
2.58  
0.102  
5.80  
0.228  
1.60  
0.063  
6.17  
0.243  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent  
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,  
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury  
or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an  
Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MBRD1035CTLD  

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