MBRD1035CTL_10 [ONSEMI]
SWITCHMODE Schottky Power Rectifier; 开关模式功率肖特基整流器型号: | MBRD1035CTL_10 |
厂家: | ONSEMI |
描述: | SWITCHMODE Schottky Power Rectifier |
文件: | 总6页 (文件大小:106K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MBRD1035CTL
SWITCHMODE
Schottky Power Rectifier
DPAK Power Surface Mount Package
The MBRD1035CTL employs the Schottky Barrier principle in a
large area metal−to−silicon power diode. State of the art geometry
features epitaxial construction with oxide passivation and metal
overlay contact. Ideally suited for low voltage, high frequency
switching power supplies, free wheeling diode and polarity protection
diodes.
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SCHOTTKY BARRIER
RECTIFIER
10 AMPERES
35 VOLTS
Features
• Highly Stable Oxide Passivated Junction
• Guardring for Stress Protection
1
• Matched Dual Die Construction −
May be Paralleled for High Current Output
• High dv/dt Capability
4
3
• Short Heat Sink Tap Manufactured − Not Sheared
• Very Low Forward Voltage Drop
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Pb−Free Packages are Available
4
2
1
3
Mechanical Characteristics:
• Case: Epoxy, Molded
DPAK
CASE 369C
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MARKING DIAGRAM
YWW
B10
35CLG
Y
= Year
WW
= Work Week
B1035CL = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
July, 2010 − Rev. 7
MBRD1035CTL/D
MBRD1035CTL
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
35
V
RRM
RWM
V
R
Average Rectified Forward Current
Per Leg
Per Package
I
5.0
10
A
A
A
O
(At Rated V , T = 115°C)
R
C
Peak Repetitive Forward Current
Per Leg
I
10
FRM
(At Rated V , Square Wave, 20 kHz, T = 115°C)
R
C
Non−Repetitive Peak Surge Current
Per Package
I
FSM
50
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Storage / Operating Case Temperature
T
T
−55 to +150
−55 to +150
10,000
°C
°C
stg,
c
Operating Junction Temperature (Note 1)
T
J
Voltage Rate of Change (Rated V , T = 25°C)
dv/dt
V/ms
R
J
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient (Note 2)
Per Leg
Per Leg
R
R
3.0
°C/W
°C/W
q
JC
JA
137
q
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(See Figure 2)
V
V
F
Per Leg
Per Leg
0.47
0.41
0.56
0.55
I = 5 Amps, T = 25°C
F
J
I = 5 Amps, T = 100°C
F
J
I = 10 Amps, T = 25°C
F
J
I = 10 Amps, T = 100°C
F
J
Maximum Instantaneous Reverse Current (Note 3)
(See Figure 4)
I
R
mA
2.0
30
0.20
5.0
(V = 35 V, T = 25°C)
R
J
(V = 35 V, T = 100°C)
R
J
(V = 17.5 V, T = 25°C)
R
J
(V = 17.5 V, T = 100°C)
R
J
2. Rating applies when using minimum pad size, FR4 PC Board
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%
ORDERING INFORMATION
Device
†
Package
Shipping
MBRD1035CTL
DPAK
75 Units / Rail
75 Units / Rail
MBRD1035CTLG
DPAK
(Pb−Free)
MBRD1035CTLT4
MBRD1035CTLT4G
DPAK
2500 Units / Tape & Reel
2500 Units / Tape & Reel
DPAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MBRD1035CTL
TYPICAL CHARACTERISTICS
100
10
100
T = 125°C
J
T = 125°C
J
10
T = 100°C
J
T = 25°C
J
T = 25°C
T = - 40°C
J
J
1.0
0.1
1.0
0.1
T = 100°C
J
0.10
0.30
0.50
0.70
0.90
1.10
0.10
0.30
0.50
0.70
0.90
1.10
V , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
V , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
Figure 1. Typical Forward Voltage Per Leg
Figure 2. Maximum Forward Voltage Per Leg
1E+0
1E+0
100E-3
100E-3
T = 125°C
J
T = 125°C
J
10E-3
1E-3
10E-3
1E-3
T = 100°C
J
T = 100°C
J
100E-6
10E-6
1E-6
T = 25°C
J
100E-6
10E-6
1E-6
T = 25°C
J
0
10
20
30
35
0
10
20
30
35
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 3. Typical Reverse Current Per Leg
Figure 4. Maximum Reverse Current Per Leg
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3
MBRD1035CTL
8.0
7.0
6.0
5.0
4.0
3.0
2.0
4.0
3.5
3.0
2.5
2.0
dc
SQUARE WAVE
(50% DUTY CYCLE)
SQUARE WAVE
(50% DUTY CYCLE)
dc
I /I = p
o
pk
I /I = p
pk o
I /I = 5
o
pk
I /I = 10
o
pk
I /I = 5
pk o
1.5
1.0
I /I = 20
o
pk
I /I = 10
pk o
I /I = 20
pk o
1.0
0
0.5
0
freq = 20 kHz
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
0
20
40
60
80
100
120
140
I , AVERAGE FORWARD CURRENT (AMPS)
O
T , LEAD TEMPERATURE (°C)
L
Figure 5. Current Derating Per Leg
Figure 6. Forward Power Dissipation Per Leg
125
115
105
1000
100
10
R
= 2.43°C/W
T = 25°C
q
JA
J
R
q
JA
= 25°C/W
R
= 48°C/W
q
JA
95
85
75
65
R
q
JA
= 67.5°C/W
R
= 84°C/W
q
JA
0
5
10
15
20
25
30
35
0
5
10
15
20
25
V , DC REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 7. Capacitance Per Leg
Figure 8. Typical Operating Temperature
Derating Per Leg *
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any
reverse voltage conditions. Calculations of T therefore must include forward and reverse power effects. The allowable operating
J
T may be calculated from the equation:
J
T = T
− r(t)(Pf + Pr) where
J
Jmax
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T due to reverse bias under DC conditions only and is calculated as T = T
− r(t)Pr,
J
J
Jmax
where r(t) = Rthja. For other power applications further calculations must be performed.
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4
MBRD1035CTL
1.0
50%(DUTY CYCLE)
20%
10%
5.0%
0.1
2.0%
1.0%
SINGLE PULSE
R
tjl(t)
= R • r
tjl (t)
0.01
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 9. Thermal Response Junction to Case (Per Leg)
1.0E+00
1.0E-01
1.0E-02
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
1.0%
1.0E-03
1.0E-04
SINGLE PULSE
R
tjl(t)
= R • r
tjl (t)
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
10000
Figure 10. Thermal Response Junction to Ambient (Per Leg)
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5
MBRD1035CTL
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
A
D
A
E
c2
b3
B
4
2
L3
L4
Z
H
DETAIL A
1
3
INCHES
DIM MIN MAX
0.086 0.094
A1 0.000 0.005
0.025 0.035
MILLIMETERS
MIN
2.18
0.00
0.63
0.76
4.57
0.46
0.46
5.97
6.35
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
A
b2
c
b
b
b2 0.030 0.045
b3 0.180 0.215
M
0.005 (0.13)
C
H
e
c
0.018 0.024
c2 0.018 0.024
GAUGE
SEATING
PLANE
L2
PLANE
C
D
E
e
0.235 0.245
0.250 0.265
0.090 BSC
2.29 BSC
9.40 10.41
1.40 1.78
2.74 REF
0.51 BSC
0.89 1.27
H
L
L1
L2
0.370 0.410
0.055 0.070
0.108 REF
L
A1
L1
0.020 BSC
DETAIL A
L3 0.035 0.050
ROTATED 905 CW
L4
Z
−−− 0.040
0.155 −−−
−−−
3.93
1.01
−−−
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
5.80
0.228
1.60
0.063
6.17
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
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MBRD1035CTLD
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