MBRD1035CTLT4 [ONSEMI]

SWITCHMODE Schottky Power Rectifier; 开关模式功率肖特基整流器
MBRD1035CTLT4
型号: MBRD1035CTLT4
厂家: ONSEMI    ONSEMI
描述:

SWITCHMODE Schottky Power Rectifier
开关模式功率肖特基整流器

整流二极管 开关
文件: 总6页 (文件大小:107K)
中文:  中文翻译
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MBRD1035CTL  
SWITCHMODEt  
Schottky Power Rectifier  
DPAK Power Surface Mount Package  
The MBRD1035CTL employs the Schottky Barrier principle in a  
large area metal−to−silicon power diode. State of the art geometry  
features epitaxial construction with oxide passivation and metal  
overlay contact. Ideally suited for low voltage, high frequency  
switching power supplies, free wheeling diode and polarity protection  
diodes.  
http://onsemi.com  
SCHOTTKY BARRIER  
RECTIFIER  
10 AMPERES  
35 VOLTS  
Features  
Pb−Free Package is Available  
Highly Stable Oxide Passivated Junction  
Guardring for Stress Protection  
1
4
Matched Dual Die Construction −  
May be Paralleled for High Current Output  
High dv/dt Capability  
3
Short Heat Sink Tap Manufactured − Not Sheared  
Very Low Forward Voltage Drop  
MARKING  
DIAGRAM  
Epoxy Meets UL 94 V−O @ 0.125 in  
4
DPAK  
CASE 369C  
YWW  
B1035CL  
Mechanical Characteristics  
2
1
Case: Epoxy, Molded  
3
Weight: 0.4 Gram (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
Y
WW  
= Year  
= Work Week  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
ORDERING INFORMATION  
Shipped in 75 Units Per Plastic Tube  
Available in 16 mm Tape and Reel, 2500 Units Per Reel,  
Device  
Package  
DPAK  
Shipping  
Add “T4’’ to Suffix Part #  
MBRD1035CTL  
75 Units/Rail  
MBRD1035CTLT4  
DPAK  
2500/Tape & Reel  
MBRD1035CTLT4G  
DPAK  
2500/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 3  
MBRD1035CTL/D  
MBRD1035CTL  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
V
35  
V
RRM  
RWM  
R
Average Rectified Forward Current  
Per Leg  
Per Package  
I
5.0  
10  
A
A
A
O
(At Rated V , T = 115°C)  
R
C
Peak Repetitive Forward Current  
Per Leg  
I
10  
FRM  
(At Rated V , Square Wave, 20 kHz, T = 115°C)  
R
C
Non−Repetitive Peak Surge Current  
Per Package  
I
FSM  
50  
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)  
Storage / Operating Case Temperature  
T
T
−55 to +125  
−55 to +125  
10,000  
°C  
°C  
stg,  
c
Operating Junction Temperature  
T
J
Voltage Rate of Change (Rated V , T = 25°C)  
dv/dt  
V/ms  
R
J
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not  
implied, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Thermal Resistance − Junction−to−Case  
Per Leg  
Per Leg  
R
R
2.43  
68  
°C/W  
°C/W  
q
JC  
JA  
Thermal Resistance − Junction−to−Ambient (Note 1)  
q
ELECTRICAL CHARACTERISTICS  
Maximum Instantaneous Forward Voltage (Note 2)  
(See Figure 2)  
V
V
F
Per Leg  
Per Leg  
0.47  
0.41  
0.56  
0.55  
I = 5 Amps, T = 25°C  
F
J
I = 5 Amps, T = 100°C  
F
J
I = 10 Amps, T = 25°C  
F
J
I = 10 Amps, T = 100°C  
F
J
Maximum Instantaneous Reverse Current (Note 2)  
(See Figure 4)  
I
R
mA  
2.0  
30  
0.20  
(V = 35 V, T = 25°C)  
R
J
(V = 35 V, T = 100°C)  
R
J
(V = 17.5 V, T = 25°C)  
R
J
5.0  
(V = 17.5 V, T = 100°C)  
R
J
1. Rating applies when using minimum pad size, FR4 PC Board  
2. Pulse Test: Pulse Width 250 ms, Duty Cycle 2.0%.  
http://onsemi.com  
2
 
MBRD1035CTL  
TYPICAL CHARACTERISTICS  
100  
10  
100  
T = 125°C  
J
T = 125°C  
J
10  
T = 100°C  
J
T = 25°C  
J
T = 25°C  
T = − 40°C  
J
J
1.0  
0.1  
1.0  
0.1  
T = 100°C  
J
0.10  
0.30  
0.50  
0.70  
0.90  
1.10  
0.10  
0.30  
0.50  
0.70  
0.90  
1.10  
V , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)  
F
V , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)  
F
Figure 1. Typical Forward Voltage Per Leg  
Figure 2. Maximum Forward Voltage Per Leg  
1E+0  
1E+0  
100E−3  
100E−3  
T = 125°C  
J
T = 125°C  
J
10E−3  
1E−3  
10E−3  
1E−3  
T = 100°C  
J
T = 100°C  
J
T = 25°C  
J
100E−6  
10E−6  
1E−6  
100E−6  
10E−6  
1E−6  
T = 25°C  
J
0
10  
20  
30  
35  
0
10  
20  
30  
35  
V , REVERSE VOLTAGE (VOLTS)  
R
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 3. Typical Reverse Current Per Leg  
Figure 4. Maximum Reverse Current Per Leg  
http://onsemi.com  
3
MBRD1035CTL  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
4.0  
3.5  
3.0  
2.5  
2.0  
dc  
SQUARE WAVE  
(50% DUTY CYCLE)  
SQUARE WAVE  
(50% DUTY CYCLE)  
dc  
I
/I = p  
pk o  
I /I = p  
pk o  
I
/I = 5  
pk o  
I
/I = 10  
pk o  
I
/I = 5  
pk o  
1.5  
1.0  
I
/I = 20  
pk o  
I /I = 10  
pk o  
I /I = 20  
pk o  
1.0  
0
0.5  
0
freq = 20 kHz  
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
0
20  
40  
60  
80  
100  
120  
140  
I , AVERAGE FORWARD CURRENT (AMPS)  
O
T , LEAD TEMPERATURE (°C)  
L
Figure 5. Current Derating Per Leg  
Figure 6. Forward Power Dissipation Per Leg  
125  
115  
105  
1000  
100  
10  
R
= 2.43°C/W  
T = 25°C  
q
JA  
J
R
q
= 25°C/W  
JA  
R
= 48°C/W  
q
JA  
95  
85  
75  
65  
R
q
= 67.5°C/W  
JA  
R
= 84°C/W  
q
JA  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
V , DC REVERSE VOLTAGE (VOLTS)  
R
V , REVERSE VOLTAGE (VOLTS)  
R
Figure 7. Capacitance Per Leg  
Figure 8. Typical Operating Temperature  
Derating Per Leg *  
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-  
verse voltage conditions. Calculations of T therefore must include forward and reverse power effects. The allowable operating  
J
T may be calculated from the equation:  
J
T = T  
− r(t)(Pf + Pr) where  
J
Jmax  
r(t) = thermal impedance under given conditions,  
Pf = forward power dissipation, and  
Pr = reverse power dissipation  
This graph displays the derated allowable T due to reverse bias under DC conditions only and is calculated as T = T  
− r(t)Pr,  
J
J
Jmax  
where r(t) = Rthja. For other power applications further calculations must be performed.  
http://onsemi.com  
4
MBRD1035CTL  
1.0  
50%(DUTY CYCLE)  
20%  
10%  
5.0%  
0.1  
2.0%  
1.0%  
SINGLE PULSE  
R
tjl(t)  
= R r  
tjl (t)  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, TIME (s)  
1.0  
10  
100  
1000  
Figure 9. Thermal Response Junction to Case (Per Leg)  
1.0E+00  
1.0E−01  
1.0E−02  
50% (DUTY CYCLE)  
20%  
10%  
5.0%  
2.0%  
1.0%  
1.0E−03  
1.0E−04  
SINGLE PULSE  
R
tjl(t)  
= R r  
tjl (t)  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t, TIME (s)  
1.0  
10  
100  
1000  
10000  
Figure 10. Thermal Response Junction to Ambient (Per Leg)  
http://onsemi.com  
5
MBRD1035CTL  
PACKAGE DIMENSIONS  
DPAK  
CASE 369C  
ISSUE O  
NOTES:  
SEATING  
PLANE  
−T−  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
C
2. CONTROLLING DIMENSION: INCH.  
B
R
INCHES  
DIM MIN MAX  
MILLIMETERS  
E
V
MIN  
5.97  
6.35  
2.19  
0.69  
0.46  
0.94  
MAX  
6.22  
6.73  
2.38  
0.88  
0.58  
1.14  
A
B
C
D
E
F
G
H
J
0.235 0.245  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.018 0.023  
0.037 0.045  
0.180 BSC  
0.034 0.040  
0.018 0.023  
0.102 0.114  
0.090 BSC  
4
2
Z
A
K
S
1
3
4.58 BSC  
U
0.87  
0.46  
2.60  
1.01  
0.58  
2.89  
K
L
2.29 BSC  
F
J
R
S
U
V
Z
0.180 0.215  
0.025 0.040  
4.57  
0.63  
0.51  
0.89  
3.93  
5.45  
1.01  
−−−  
1.27  
−−−  
L
H
0.020  
0.035 0.050  
0.155 −−−  
−−−  
D 2 PL  
M
G
0.13 (0.005)  
T
SOLDERING FOOTPRINT*  
6.20  
3.0  
0.244  
0.118  
2.58  
0.101  
5.80  
0.228  
1.6  
0.063  
6.172  
0.243  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MBRD1035CTL/D  

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