FDPF7N50U-G [ONSEMI]

功率 MOSFET,N 沟道,UniFETTM,Ultra FRFETTM, 500 V,5A,1.5Ω,TO-220F;
FDPF7N50U-G
型号: FDPF7N50U-G
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,UniFETTM,Ultra FRFETTM, 500 V,5A,1.5Ω,TO-220F

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Is Now  
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www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
FDPF7N50U  
N-Channel UniFET Ultra FRFET MOSFET  
TM  
TM  
500 V, 5 A, 1.5  
Features  
Description  
UniFETTM MOSFET is ON Semiconductor’s high voltage  
MOSFET family based on planar stripe and DMOS technology.  
This MOSFET is tailored to reduce on-state resistance, and to  
provide better switching performance and higher avalanche  
RDS(on) = 1.5 (Max.) @ VGS = 10 V, ID = 2.5 A  
Low Gate Charge (Typ.12.8 nC)  
Low Crss (Typ. 9 pF)  
energy strength. UniFET Ultra FRFETTM MOSFET has much  
superior body diode reverse recovery performance. Its trr is less  
100% Avalanche Tested  
than 50nsec and the reverse dv/dt immunity is 20V/nsec while  
normal planar MOSFETs have over 200nsec and 4.5V/nsec  
respectively. Therefore UniFET Ultra FRFET MOSFET can  
remove additional component and improve system reliability in  
certain applications that require performance improvement of  
the MOSFET’s body diode. This device family is suitable for  
switching power converter applications such as power factor  
correction (PFC), flat panel display (FPD) TV power, ATX and  
electronic lamp ballasts.  
Improved dv/dt Capability  
Applications  
LCD/LED TV  
Lighting  
Uninterruptible Power Supply  
AC-DC Power Supply  
D
G
G
D
TO-220F  
G
D
S
S
TO-220  
Absolute Maximum Ratings  
S
Symbol  
Parameter  
FDPF7N50U  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
500  
V
ID  
- Continuous (TC = 25C)  
- Continuous (TC = 100C)  
5 *  
3.0 *  
A
A
(Note 1)  
(Note 2)  
IDM  
Drain Current  
- Pulsed  
20 *  
30  
125  
5
A
V
VGSS  
EAS  
IAR  
Gate-Source voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
(Note 1)  
(Note 1)  
(Note 3)  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
8.9  
20  
mJ  
V/ns  
Power Dissipation  
(TC = 25C)  
- Derate above 25C  
31.3  
0.25  
W
W/C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
C  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
C  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
FDPF7N50U  
Unit  
RJC  
RJA  
Thermal Resistance, Junction-to-Case, Max.  
4.0  
C/W  
62.5  
Thermal Resistance, Junction-to-Ambient, Max.  
Publication Order Number:  
©2009 Semiconductor Components Industries, LLC.  
October-2017,Rev.3  
FDPF7N50U/D  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FDPF7N50U  
FDPF7N50U  
TO-220F  
--  
--  
50  
Electrical Characteristics  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Conditions  
Min. Typ. Max Unit  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0V, ID = 250A  
500  
--  
--  
--  
--  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
ID = 250A, Referenced to 25C  
0.5  
V/C  
IDSS  
Zero Gate Voltage Drain Current  
VDS = 500V, VGS = 0V  
VDS = 400V, TC = 125C  
--  
--  
--  
--  
25  
250  
A  
A  
IGSSF  
IGSSR  
Gate-Body Leakage Current, Forward  
Gate-Body Leakage Current, Reverse  
VGS = 30V, VDS = 0V  
VGS = -30V, VDS = 0V  
--  
--  
--  
--  
100  
nA  
nA  
-100  
On Characteristics  
VGS(th) Gate Threshold Voltage  
RDS(on)  
VDS = VGS, ID = 250A  
3.0  
--  
--  
5.0  
1.5  
--  
V
S
Static Drain-Source  
On-Resistance  
V
GS = 10V, ID = 2.5A  
1.2  
2.5  
gFS  
Forward Transconductance  
VDS = 40V, ID = 2.5A  
--  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS = 25V, VGS = 0V,  
f = 1.0MHz  
--  
--  
--  
720  
95  
9
940  
190  
13.5  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VDD = 250V, ID = 5A  
RG = 25  
--  
--  
--  
--  
--  
--  
--  
6
55  
20  
120  
60  
ns  
ns  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
25  
ns  
(Note 4)  
(Note 4)  
35  
80  
ns  
Qg  
VDS = 400V, ID = 5A  
VGS = 10V  
12.8  
3.7  
5.8  
16.6  
--  
nC  
nC  
nC  
Qgs  
Qgd  
--  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
--  
--  
--  
--  
--  
--  
--  
5
20  
1.6  
--  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, IS = 5A  
--  
V
VGS = 0V, IS = 5A  
40  
0.04  
ns  
C  
dIF/dt =100A/s  
Qrr  
Reverse Recovery Charge  
--  
NOTES:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. I = 5A, V = 50V, L=10mH, R = 25, Starting T = 25C  
AS  
DD  
G
J
3. I 5A, di/dt 200A/s, V BV  
, Starting T = 25C  
SD  
DD  
DSS  
J
4. Essentially Independent of Operating Temperature Typical Characteristics  
www.onsemi.com  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
20  
VGS  
Top :  
10.0 V  
8.0V  
101  
7.5 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
15  
10  
5
150oC  
Bottom : 5.0 V  
100  
10-1  
10-2  
25oC  
* Notes :  
1. 250s Pulse Test  
o
2. TC = 25  
C
* Note :  
1. VDS = 40V  
2. 250s Pulse Test  
0
0
10  
20  
30  
40  
50  
2
4
6
8
10  
VDS, Drain-Source Voltage [V]  
VGS , Gate-Source Voltage [V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
2.5  
101  
2.0  
1.5  
1.0  
0.5  
0.0  
VGS = 10V  
100  
VGS = 20V  
150oC  
25oC  
* Notes :  
1. VGS = 0V  
* Note : TJ = 25oC  
2. 250s Pulse Test  
10-1  
0.2  
0
5
10  
15  
20  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
VSD , Source-Drain Voltage [V]  
ID, Drain Current [A]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
12  
10  
8
Ciss = Cgs + Cgd (Cds = shorted)  
VDS = 100V  
VDS = 250V  
Coss = Cds + Cgd  
Crss = Cgd  
1000  
100  
10  
VDS = 400V  
Ciss  
Coss  
6
Crss  
4
* Notes :  
1. VGS = 0 V  
2. f = 1 MHz  
2
5
* Note : ID = 7 A  
0
100  
101  
0
5
10  
15  
QG, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
www.onsemi.com  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. Maximum Drain Current  
Vs. Case Temperature  
6
1.2  
1.1  
4
1.0  
2
* Notes :  
0.9  
0.8  
1. VGS = 0 V  
2. ID = 250 A  
0
-100  
-50  
0
50  
100  
150  
200  
25  
50  
75  
100  
125  
150  
TJ, Junction Temperature [oC]  
TC, Case Temperature [oC]  
Figure 9. Maximum Safe Operating Area  
- FDPF7N50U  
10 us  
101  
100 us  
1 ms  
10 ms  
100 ms  
100  
Operation in This Area  
DC  
is Limited by R DS(on)  
10-1  
* Notes :  
1. TC = 25 o  
C
2. TJ = 150 o  
C
3. Single Pulse  
10-2  
100  
101  
102  
VDS, Drain-Source Voltage [V]  
Figure 10. Transient Thermal Response Curve  
D=0.5  
100  
0.2  
0.1  
0.05  
PDM  
10-1  
0.02  
t1  
0.01  
t2  
* N otes  
:
1. ZJC (t) = 4.0 oC /W M ax.  
2. D uty Factor, D =t1/t2  
3. TJM - TC  
= PDM * ZJC(t)  
single pulse  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1, Square W ave Pulse Duration [sec]  
www.onsemi.com  
4
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
5
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
www.onsemi.com  
6
Mechanical Dimensions  
TO-220M03  
Dimensions in Millimeters  
www.onsemi.com  
7
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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