PCK2002P [NXP]
140 MHz PCI-X clock buffer; 140 MHz的PCI -X时钟缓冲器
| 型号： | PCK2002P |
| 厂家： | 
NXP |
| 描述： | 140 MHz PCI-X clock buffer |
| 文件： | 总8页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
PCK2002P
140 MHz PCI-X clock buffer
Product data
2001 May 09
File under Integrated Circuits ICL03
Philips
Semiconductors
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
FEATURES
PIN CONFIGURATION
• General purpose and PCI-X 1:4 clock buffer
BUF_OUT3
BUF_OUT2
8
7
6
5
1
2
3
4
BUF_IN
OE
• 8-pin TSSOP package
• See PCK2001 for 48-pin 1:18 buffer part
• See PCK2001M for 28-pin 1:10 buffer part
• See PCK2001R for 16-pin 1:6 buffer part
• Operating frequency: 0 – 140 MHz
• Part-to-part skew < 500 ps
V
BUF_OUT0
DD
V
BUF_OUT1
SS
TOP VIEW
SA00552
• Low output skew: <200 ps
• 3.3 V operation
PIN DESCRIPTION
• ESD classification testing is done to JEDEC Standard JESD22.
PIN
NUMBER
I/O
TYPE
SYMBOL
FUNCTION
Protection exceeds 2000 V to HBM per method A114.
1
Input
BUF_IN
Buffered clock input
BUF_OUT
(0–3)
DESCRIPTION
The PCK2002PL is a 1–4 fanout buffer used as a high-performance,
low skew, general purpose and PCI-X clock buffer. It distributes one
3, 5, 7, 8
Output
Buffered clock outputs
6
2
4
Input
Input
Input
V
DD
3.3 V supply
Output Enable
Ground
input clock (BUF_IN) signal to four output clocks (BUF_OUT ).
n
OE
V
SS
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
= 3.3 V, C = 25 pF
TYPICAL
UNIT
t
t
Propagation delay
2.9
2.8
PLH
PHL
V
ns
CC
L
BUF_IN to BUF_OUT
Rise time
n
t
r
V
CC
V
CC
V
CC
= 3.3 V, C = 25 pF, 0.2V to 0.6V
DD
800
600
50
ps
ps
µA
L
DD
t
f
Fall time
= 3.3 V, C = 25 pF, 0.6V to 0.2V
L DD DD
I
Total supply current
= 3.6 V
CC
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
–40 to +85 °C
ORDER CODE
PCK2002PDP
PCK2002PD
DRAWING NUMBER
SOT505-1
8-Pin Plastic TSSOP
8-Pin Plastic SO
–40 to +85 °C
SOT96-1
2
2001 May 09
853-2254 26252
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
FUNCTION TABLE
OE
L
BUF_IN
BUF_OUTn
X
L
L
L
H
H
H
H
1, 2
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to V (V = 0 V).
SS
SS
LIMITS
SYMBOL
PARAMETER
CONDITION
UNIT
MIN
–0.5
—
MAX
+4.3
–50
V
I
DC 3.3 V supply voltage
DC input diode current
DC input voltage
V
mA
V
DD
V < 0
I
IK
V
I
Note 2
–0.5
—
V + 0.5
DD
I
DC output diode current
DC output voltage
V
O
> V or V < 0
±50
+ 0.5
DD
mA
V
OK
DD
O
V
O
Note 2
–0.5
—
V
I
O
DC output source or sink current
Storage temperature range
V
O
≥ 0 to V
±50
mA
°C
DD
T
stg
–65
+150
Power dissipation per package
plastic medium-shrink SO (SSOP)
For temperature range: 0 to +70 °C
above +55 °C derate linearly with 11.3 mW/K
P
tot
—
850
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
CONDITIONS
UNIT
MIN
3.0
20
0
MAX
3.6
V
DD
DC 3.3V supply voltage
V
pF
V
C
Capacitive load
30
L
V
I
DC input voltage range
V
DD
V
DD
V
O
DC output voltage range
0
V
T
amb
Operating ambient temperature range in free air
–40
+85
°C
3
2001 May 09
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
DC CHARACTERISTICS
LIMITS
= –40 to +85 °C
TEST CONDITIONS
OTHER
SYMBOL
PARAMETER
T
UNIT
amb
V
(V)
MIN
MAX
+ 0.3
DD
DD
V
IH
HIGH level input voltage
LOW level input voltage
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
3.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2.0
V
V
V
V
IL
—
V
SS
DD
– 0.3
0.8
—
I
= –1 mA
= –24 mA
= –12 mA
V
– 0.2
V
OH
V
OH
Output HIGH voltage
Output LOW voltage
I
2.0
—
V
OH
OH
3.0
I
2.4
—
—
V
3.0 to 3.6
3.0
I
OL
= 1 mA
0.2
0.8
0.55
—
V
V
OL
I
OL
I
OL
= 24 mA
= 12 mA
—
V
3.0
—
V
3.0
V
OUT
= 1 V
–50
—
mA
mA
mA
mA
µA
µA
I
Output HIGH current
Output LOW current
OH
3.3
V
V
= 1.65 V
= 2.0 V
–150
—
OUT
3.0
V
OUT
60
—
I
OL
3.3
= 1.65 V
150
±5
OUT
±I
I
Input leakage current
3.6
V = V or GND
—
I
DD
I
Quiescent supply current
3.6
V = V or GND
I = 0
O
—
100
CC
I
DD
4
2001 May 09
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
AC CHARACTERISTICS
LIMITS
= –40 to +85 °C
TEST CONDITIONS
NOTES
T
amb
SYMBOL
PARAMETER
UNIT
MAX
6
MIN
6.0
6.0
2.9
3.0
1.4
1.5
1.8
1.8
—
TYP
T
CLK HIGH time
2
3
2
3
4
4
5
5
1
1
—
—
—
—
ns
ns
H
66 MHz
T
CLK LOW time
L
T
H
CLK HIGH time
—
—
ns
140 MHz
T
L
CLK LOW time
—
—
ns
T
Output rise slew rate
Output fall slew rate
Buffer LH propagation delay
Buffer HL propagation delay
Bus CLK skew
1.7
2.2
2.9
2.8
—
4.0
4.0
3.4
3.4
200
500
V/ns
V/ns
ns
R
T
F
T
PLH
PHL
SKW
T
ns
T
ps
T
Device to device skew
—
—
ps
DDSKW
NOTES:
1. CLK skew is only valid for equal loading of all outputs.
2. T is measured at 0.5 V as shown in Figure 2.
H
DD
3. T is measured at 0.35 V as shown in Figure 2.
L
DD
4. T and T are measured as a transition through the threshold region 0.2 V to 0.6 V and 0.6 V to 0.2 V .
R
F
DD
DD
DD
DD
5. Input edge rate for these tests must be faster than 1 V/ns.
6. All typical values are at V = 3.3 V and T = 25 °C.
CC
amb
AC WAVEFORMS
TEST CIRCUIT
V
= 50% V
M
DD
C = 25 pF
L
V
V
DD
DD
V
OL
and V are the typical output voltage drop that occur with the
OH
output load.
140 Ω
V
DD
V
V
O
I
PULSE
GENERATOR
BUF_IN
INPUT
V
V
M
D.U.T.
M
t
R
T
C
L
t
140 Ω
PLH
PHL
0.6 V
0.2 V
0.6 V
0.2 V
DD
DD
V
V
M
M
DD
DD
BUF_OUT
SW00813
T
T
F
R
Figure 3. Load circuitry for switching times
SW00811
Figure 1. Load circuitry for switching times.
t
p
t
h
0.5 V
DD
0.4 V
0.35 V
DD
DD
t
l
SW00812
Figure 2. Buffer Output clock
5
2001 May 09
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
6
2001 May 09
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
7
2001 May 09
Philips Semiconductors
Product data
140 MHz PCI-X clock buffer
PCK2002P
Data sheet status
Product
status
Definitions
[1]
Data sheet status
[2]
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
Preliminary data
Product data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on
the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 2001
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 05-01
Document order number:
9397 750 08348
Philips
Semiconductors
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