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PCK2002PD,112 [NXP]

PCK2002P - 533 MHz PCI-X clock buffer SOIC 8-Pin;
PCK2002PD,112
型号： PCK2002PD,112
厂家： NXP    NXP
描述：

PCK2002P - 533 MHz PCI-X clock buffer SOIC 8-Pin

PC 驱动 光电二极管 逻辑集成电路
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INTEGRATED CIRCUITS  
PCK2002P  
533 MHz PCI-X clock buffer  
Product data  
2002 Dec 13  
Supersedes data of 2001 May 09  
Philips  
Semiconductors  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
FEATURES  
PIN CONFIGURATION  
• General purpose and PCI-X 1:4 clock buffer  
• 8-pin TSSOP package  
BUF_OUT3  
BUF_OUT2  
8
7
6
5
1
2
3
4
BUF_IN  
OE  
• See PCK2001 for 48-pin 1:18 buffer part  
• See PCK2001M for 28-pin 1:10 buffer part  
• See PCK2001R for 16-pin 1:6 buffer part  
• Operating frequency: 0 - 533 MHz  
• Part-to-part skew < 500 ps  
V
BUF_OUT0  
DD  
V
BUF_OUT1  
SS  
TOP VIEW  
SA00552  
• Low output skew: <200 ps  
• 3.3 V operation  
PIN DESCRIPTION  
• ESD classification testing is done to JEDEC Standard JESD22.  
PIN  
NUMBER  
I/O  
TYPE  
SYMBOL  
FUNCTION  
Protection exceeds 2000 V to HBM per method A114.  
1
Input  
BUF_IN  
Buffered clock input  
BUF_OUT  
(0-3)  
DESCRIPTION  
The PCK2002PL is a 1- 4 fanout buffer used as a high-performance,  
low skew, general purpose and PCI-X clock buffer. It distributes one  
3, 5, 7, 8  
Output  
Buffered clock outputs  
6
2
4
Input  
Input  
Input  
V
DD  
3.3 V supply  
Output Enable  
Ground  
input clock (BUF_IN) signal to four output clocks (BUF_OUT ).  
n
OE  
V
SS  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
CONDITIONS  
= 3.3 V, C = 25 pF  
TYPICAL  
UNIT  
t
t
Propagation delay  
2.9  
2.8  
PLH  
PHL  
V
ns  
CC  
L
BUF_IN to BUF_OUT  
Rise time  
n
t
r
V
CC  
V
CC  
V
CC  
= 3.3 V, C = 25 pF, 0.2V to 0.6V  
DD  
800  
600  
50  
ps  
ps  
µA  
L
DD  
t
f
Fall time  
= 3.3 V, C = 25 pF, 0.6V to 0.2V  
L DD DD  
I
Total supply current  
= 3.6 V  
CC  
ORDERING INFORMATION  
PACKAGES  
TEMPERATURE RANGE  
-40 to +85 °C  
ORDER CODE  
PCK2002PDP  
PCK2002PD  
DRAWING NUMBER  
SOT505-1  
8-Pin Plastic TSSOP  
8-Pin Plastic SO  
-40 to +85 °C  
SOT96-1  
2
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
FUNCTION TABLE  
OE  
L
BUF_IN  
BUF_OUTn  
X
L
L
L
H
H
H
H
1, 2  
ABSOLUTE MAXIMUM RATINGS  
In accordance with the Absolute Maximum Rating System (IEC 134).  
Voltages are referenced to V (V = 0 V).  
SS  
SS  
LIMITS  
SYMBOL  
PARAMETER  
CONDITION  
UNIT  
MIN  
-0.5  
—
MAX  
+4.3  
-50  
V
I
DC 3.3 V supply voltage  
DC input diode current  
DC input voltage  
V
mA  
V
DD  
V < 0  
I
IK  
V
I
Note 2  
-0.5  
—
V + 0.5  
DD  
I
DC output diode current  
DC output voltage  
V
O
> V or V < 0  
50  
mA  
V
OK  
DD  
O
V
O
Note 2  
-0.5  
—
V
DD  
+ 0.5  
50  
I
O
DC output source or sink current  
Storage temperature range  
V
O
≥ 0 to V  
mA  
°C  
DD  
T
stg  
-65  
+150  
850  
Power dissipation per package  
plastic medium-shrink SO (SSOP)  
For temperature range: 0 to +70 °C  
above +55 °C derate linearly with 11.3 mW/K  
P
tot  
—
mW  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
MIN  
3.0  
20  
0
MAX  
3.6  
V
DD  
DC 3.3V supply voltage  
V
pF  
V
C
Capacitive load  
30  
L
V
I
DC input voltage range  
V
DD  
DD  
V
O
DC output voltage range  
0
V
V
T
amb  
Operating ambient temperature range in free air  
-40  
+85  
°C  
3
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
DC CHARACTERISTICS  
LIMITS  
= -40 to +85 °C  
TEST CONDITIONS  
OTHER  
T
UNIT  
SYMBOL  
PARAMETER  
amb  
V
(V)  
MIN  
MAX  
+ 0.3  
DD  
DD  
V
IH  
HIGH level input voltage  
LOW level input voltage  
3.0 to 3.6  
3.0 to 3.6  
3.0 to 3.6  
3.0  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2.0  
V
V
V
V
IL  
—
V
SS  
DD  
- 0.3  
0.8  
—
I
= -1 mA  
= -24 mA  
= -12 mA  
V
- 0.2  
V
OH  
I
2.0  
—
V
V
OH  
Output HIGH voltage  
Output LOW voltage  
OH  
OH  
3.0  
I
2.4  
—
—
V
3.0 to 3.6  
3.0  
I
OL  
= 1 mA  
0.2  
0.8  
0.55  
—
V
I
OL  
I
OL  
= 24 mA  
= 12 mA  
—
V
V
OL  
3.0  
—
V
3.0  
V
OUT  
= 1 V  
-50  
—
mA  
mA  
mA  
mA  
µA  
µA  
I
Output HIGH current  
Output LOW current  
OH  
3.3  
V
V
= 1.65 V  
= 2.0 V  
-150  
—
OUT  
3.0  
V
OUT  
60  
—
I
OL  
3.3  
= 1.65 V  
150  
5
OUT  
I
I
Input leakage current  
3.6  
V = V or GND  
—
I
DD  
I
Quiescent supply current  
3.6  
V = V or GND  
I = 0  
O
—
100  
CC  
I
DD  
4
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
AC CHARACTERISTICS  
LIMITS  
= -40 to +85 °C  
TEST CONDITIONS  
NOTES  
T
amb  
SYMBOL  
PARAMETER  
UNIT  
6
MIN  
6.0  
6.0  
2.9  
3.0  
1.4  
1.5  
1.8  
1.8  
—
TYP  
MAX  
—
t
CLK HIGH time  
2
3
2
3
4
4
5
5
1
1
—
—
ns  
ns  
H
66 MHz  
t
CLK LOW time  
—
L
t
H
CLK HIGH time  
—
—
ns  
140 MHz  
t
L
CLK LOW time  
—
—
ns  
t
Output rise slew rate  
Output fall slew rate  
Buffer LH propagation delay  
Buffer HL propagation delay  
Bus CLK skew  
1.7  
2.2  
2.9  
2.8  
—
4.0  
4.0  
3.4  
3.4  
200  
500  
V/ns  
V/ns  
ns  
R
t
F
t
t
PLH  
PHL  
ns  
t
ps  
SKW  
t
Device to device skew  
—
—
ps  
DDSKW  
NOTES:  
1. CLK skew is only valid for equal loading of all outputs.  
2. t is measured at 0.5 V as shown in Figure 2.  
H
DD  
3. t is measured at 0.35 V as shown in Figure 2.  
L
DD  
4. t and t are measured as a transition through the threshold region 0.2 V to 0.6 V and 0.6 V to 0.2 V .  
R
F
DD  
DD  
DD  
DD  
5. Input edge rate for these tests must be faster than 1 V/ns.  
6. All typical values are at V = 3.3 V and T = 25 °C.  
CC  
amb  
AC WAVEFORMS  
TEST CIRCUIT  
V
= 50% V  
M
DD  
C = 25 pF  
L
V
V
DD  
DD  
V
OL  
and V are the typical output voltage drop that occur with the  
OH  
output load.  
140 Ω  
V
DD  
V
V
O
I
PULSE  
GENERATOR  
BUF_IN  
INPUT  
V
V
M
D.U.T.  
M
t
R
T
C
L
t
140 Ω  
PLH  
PHL  
0.6 V  
0.2 V  
0.6 V  
0.2 V  
DD  
DD  
V
V
M
M
DD  
DD  
BUF_OUT  
SW00813  
T
T
F
R
Figure 3. Load circuitry for switching times  
SW00811  
Figure 1. Load circuitry for switching times.  
t
p
t
h
0.5 V  
DD  
0.4 V  
0.35 V  
DD  
DD  
t
l
SW00812  
Figure 2. Buffer Output clock  
5
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm  
SOT505-1  
6
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
7
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
REVISION HISTORY  
Rev  
Date  
Description  
_3  
20021213  
Product data (9397 750 10863); ECN 853-2254 29225 of 22 November 2002  
Modifications:  
• Increase F  
to 533 MHz.  
max  
_2  
20010509  
Product data (9397 750 08348); ECN 853-2254 26252 of 09 May 2001.  
8
2002 Dec 13  
Philips Semiconductors  
Product data  
533 MHz PCI-X clock buffer  
PCK2002P  
Data sheet status  
Product  
status  
Definitions  
[1]  
Level  
Data sheet status  
[2] [3]  
I
Objective data  
Development  
Qualification  
This data sheet contains data from the objective specification for product development.  
Philips Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Product data  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1] Please consult the most recently issued data sheet before initiating or completing a design.  
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL  
http://www.semiconductors.philips.com.  
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given  
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no  
representation or warranty that such applications will be suitable for the specified use without further testing or modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be  
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree  
to fully indemnify Philips Semiconductors for any damages resulting from such application.  
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described  
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated  
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys  
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,  
copyright, or mask work right infringement, unless otherwise specified.  
Koninklijke Philips Electronics N.V. 2002  
Contact information  
All rights reserved. Printed in U.S.A.  
For additional information please visit  
http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
Date of release: 12-02  
For sales offices addresses send e-mail to:  
sales.addresses@www.semiconductors.philips.com.  
Document order number:  
9397 750 10863  
Philips  
Semiconductors  

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