PCD5090H-T [NXP]
IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PQFP100, Cordless Telephone IC;
| 型号： | PCD5090H-T |
| 厂家： | 
NXP |
| 描述： | IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PQFP100, Cordless Telephone IC 控制器 |
| 文件： | 总16页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCD5090; PCA5097
DECT baseband controllers
1996 Oct 17
Objective specification
File under Integrated Circuits, IC17
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
INTRODUCTION
This data sheet details the specific features of the:
PCD5090/xxx; DSP-ROM, with external ROM
PCA5097/xxx; DSP-ROM, with Field Electronically
Erasable Programmable Read Only Memory
(FEEPROM).
• On-chip reference voltage
• On-chip supply for electret microphone
• Very low ohmic buzzer output
FEATURES
General
• Serial interface to external ADPCM CODEC (PCD5032)
• IOM-2interface (Siemens registered trademark)
• The PCx509x is designed for GAP-compliant handsets
and simple base stations
• Serial interface to synthesizer for frequency
programming
• Embedded 80C51 microcontroller with twice the
performance of the classic architecture, up to
128 kbytes external memory or 64 kbytes FEEPROM
program memory and 3 kbytes of data memory on chip.
In addition there is 1 kbyte of on-chip data memory that
is shared with on-chip Burst Mode Logic (BML) and
DSP, the System Data RAM (SDR).
• Programmable timing of radio-control signals
• Programmable polarity of radio-control signals
• Easy interfacing with radio circuits, operating at other
supply voltage
• Programmable GMSK pulse shaper
• On-chip comparator for use as bit-slicer
• Power-on reset
• 80C51 ports P0, P1, P2 and P3 available for interfacing
to display, keyboard, I2C-bus, interrupt sources and/or
external memory. External program memory is
addressable up to 128 kbytes (PCD5090/xxx and
PCA5097/xxx).
• Low supply voltage (2.7 to 5.5 V)
• SACMOS technology.
• Portable Part (PP) and Fixed Part (FP) modes
• TDMA frame (de)multiplexing; transmission or reception
can be programmed for any slot
DSP software features
• ADPCM encoding and decoding complying with G.721
• Speech filters
• Ciphering, scrambling, CRC checking/generation,
protected B-fields
• Programmable gain in speech paths
• Side tone and soft mute
• Speech and data buffering space for six handsets
• Local call and B-field loop-back
• Ringer and tone (DTMF) generator
• Dial tone detection
• Two interrupt lines for BML and DSP to interrupt 80C51
• On-chip, three-channel time-multiplexed 8-bit
Analog-to-Digital Converter (ADC) for RSSI
measurement and battery voltage measurement. One
channel available for other purposes.
• Echo cancellation
• Automatic gain control
• Telephone Answering Machine (TAM) switch
• Conference call (PCD5090/400)
• Hands-free operation (PCD5090/311).
• On-chip 8-bit DAC for frequency adjustment of
13.824 MHz on-chip crystal oscillator
• Phase error measurement and phase error correction by
hardware
For each DSP software version a separate manual is
available, in which detailed information is provided on how
parameters must be set.
• Digital-to-Analog Converters (DACs) and ADCs for
dynamic earpiece and dynamic or electret microphone
1996 Oct 17
2
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
PCD5090H
PCA5097H
plastic quad flat package; 100 leads (lead length 1.95 mm); body
14 × 20 × 2.8 mm
QFP100
SOT317-2
SOT407-1
PCD5090HZ LQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
1996 Oct 17
3
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
BLOCK DIAGRAM
GM6E10
a , f u l l p a g e w i d t h
1996 Oct 17
4
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
1996 Oct 17
5
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
1996 Oct 17
6
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
1996 Oct 17
7
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
1996 Oct 17
8
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
1
2
3
4
5
6
7
8
9
ANT_SW1
ANT_SW0
80 WEN
79 SDI
78 SC
CLK100
T_ENABLE
T_PWR_RMP
T_DATA
OEN
77
76 SDO/A16
75 P2.2
T_GMSK
P2.1
P2.0
74
73
VCO_BND_SW
SYNTH_LOCK
72 P3.7
71 P3.6
S_ENABLE 10
11
12
13
S_DATA
S_CLK
P3.5
P3.4
70
69
S_PWR
68 P3.3
67 P3.2
REF_CLK 14
V
V
15
16
17
P3.1
P3.0
V
66
65
64
63
62
61
60
SS_RF
PCA5097
PCD5090
DD_RF
V
DD_FEE
SS_FEE
V
SLICE_CTR 18
R_PWR 19
SS2
BZP
BZM
V
20
R_DATAP
R_DATAM 21
R_ENABLE 22
RSSI_AN 23
VANLI 24
VBAT 25
DD2
59 P1.7
P1.6
P1.5
58
57
56 P1.4
55 P1.3
CLK3 26
DCK 27
PGM
54
53
52
DI 28
R_SLICED
DPLL_DATA
FS1
29
DO 30
51 GP_CLK7
MGE575
Fig.2 Pin configuration of PCX509x (QFP100).
9
1996 Oct 17
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
1
2
3
4
5
6
7
8
9
CLK100
T_ENABLE
T_PWR_RMP
T_DATA
75
74
73
OEN
SDO/A16
P2.2
72 P2.1
T_GMSK
71
70
P2.0
P3.7
VCO_BND_SW
SYNTH_LOCK
S_ENABLE
S_DATA
69 P3.6
68 P3.5
67
66
P3.4
P3.3
S_CLK 10
S_PWR 11
65 P3.2
64 P3.1
12
13
14
15
16
17
REF_CLK
V
PCD5090
63
62
61
P3.0
V
SS_RF
V
DD_RF
SS_FEE
V
V
DD_FEE
SS2
SLICE_CTR
R_PWR
60 BZP
59
58
BZM
V
R_DATAP 18
R_DATAM 19
DD2
57 P1.7
56 P1.6
20
21
R_ENABLE
RSSI_AN
55
54
P1.5
P1.4
VANLI 22
VBAT 23
53 P1.3
52 PGM
24
25
CLK3
DCK
51
R_SLICED
MGD744
Fig.3 Pin configuration of PCD5090/xxx only (LQFP100).
10
1996 Oct 17
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
A-fields and B-fields are stored in separate buffers. In this
way, two traffic bearers, each with their private A-fields,
can share the same B-field buffer as is required in case of
bearer hand-over or local call.
FUNCTIONAL DESCRIPTION
DECT controller system description
The PCX509x is a family of single-chip controllers,
designed for use in Digital Enhanced Cordless
Telecommunications (DECT) systems. The family is
designed for minimal component-count and minimum
power consumption. All controllers include an embedded
80C51 microcontroller with on-chip memory and I2C-bus.
The Philips DECT RF-Interface is implemented. The Burst
Mode Logic performs the time-critical MAC layer functions
for applications in DECT handsets and base stations.
The ADPCM transcoding is in compliance with the CCITT
recommendation G.721 and includes receive and transmit
filters.
The blocks DSP and CODEC support speech processing
functions such as A/D- and D/A conversion, filtering,
ADPCM encoding and decoding, 8-bit A-law PCM to 14-bit
linear PCM conversion and its reverse, echo cancelling,
tone generation, etc.
PCA5097
This chip is intended for program development. It contains
64 kbytes of internal program memory (FEEPROM) for the
80C51 and DSP program RAM.
Power-on reset logic and power management functions
further reduce power consumption and external
PCD5090/xxx
components. The chip is intended to support stand-alone
systems only. There are no provisions to build clusters of
base stations. There are no provisions for external
controllers to exert control over the embedded 80C51 or to
have direct access to the on-chip data memories.
This chip is intended for handset and base station
applications. The DSP program is now fixed in a ROM, for
which several ROM codes (/xxx) are available (handset,
analog base, digital base). An external program memory
for the 80C51 of 128 kbytes ROM can be handled.
The DECT controller consists of a number of functional
blocks that operate more or less autonomously and
communicate with each other via the System Data RAM
(SDR). Blocks have access to SDR via the Internal System
Bus (ISB). The ISB consists of an 8-bit data, a 10-bit
address bus and a number of bus-request/bus-grant
signals. Access to the ISB is controlled by ISB bus
Controller (IBC). The IBC acknowledges bus requests on
the basis of a priority scheme.
PCA5097/xxx
This is the same as PCD5090/xxx, but there is 64 kbytes
internal program memory (FEEPROM) for the 80C51.
The DSP program is preprogrammed in ROM.
This chip is meant for development purpose only.
The embedded controller 80C51 is to be programmed by
the user. It must contain DECT software from
Man-Machine-Interface (MMI) to the DECT protocols TBC,
CBC and DBC (refer to figures 10, 11, 12 and 13 in
“prETS 300 175-2:1992 section 6”).
All software is available from Philips Semiconductors.
Hardware state machines in the Burst Mode Logic (BML)
and the Speech Interface (SPI) execute the lower blocks in
the TBC, CBC and DBC. The 80C51 has control over the
BML and the SPI via tables in SDR. The BML saves serial
data, received via R_DATAP/M, in buffer areas in SDR.
The position of buffers in SDR is fixed by the 80C51
software by means of tables previously mentioned.
1996 Oct 17
11
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
EARPIECE
RADIO
CIRCUITS
PCx509x
MICROPHONE
MGE586
a. Handset.
LINE
INTERFACE
(e.g. PCD1070)
RADIO
CIRCUITS
PCx509x
a/b line
MGD745
b. Base with analog interface and echo cancellation; up to 6 portables can be handled.
EARPIECE
RADIO
PCx509x
CIRCUITS
MICROPHONE
2 x IOM or
2 x ADPCM-CODEC or
2
a combination
MGD746
c. Base with digital interface and analog handset connected; up to 6 portables can be handled.
Fig.4 Block diagrams of DECT systems with PCx509x.
12
1996 Oct 17
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
PACKAGE OUTLINES
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
y
X
A
80
51
81
50
Z
E
Q
e
A
2
H
A
E
E
(A )
3
A
1
θ
w M
p
pin 1 index
L
p
b
L
31
100
detail X
1
30
w M
Z
v
M
D
A
b
p
e
D
B
H
v
M
B
D
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.25 2.90
0.05 2.65
0.40 0.25 20.1 14.1
0.25 0.14 19.9 13.9
24.2 18.2
23.6 17.6
1.0
0.6
1.4
1.2
0.8
0.4
1.0
0.6
mm
3.20
0.25
0.65
1.95
0.2 0.15 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT317-2
1996 Oct 17
13
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
X
A
51
75
50
26
(1)
76
Z
E
e
Q
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
L
pin 1 index
detail X
100
1
25
Z
D
v
M
A
B
e
w M
b
p
D
B
H
v
M
5
D
0
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.5
0.05 1.3
0.28 0.18 14.1 14.1
0.16 0.12 13.9 13.9
16.25 16.25
15.75 15.75
0.75 0.70
0.45 0.57
1.15 1.15
0.85 0.85
mm
1.6
0.25
0.5
1.0
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-12-19
SOT407-1
1996 Oct 17
14
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
SOLDERING
Introduction
Wave soldering
Wave soldering is not recommended for LQFP or QFP
packages. This is because of the likelihood of solder
bridging due to closely-spaced leads and the possibility of
incomplete solder penetration in multi-lead devices.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Reflow soldering
Even with these conditions:
Reflow soldering techniques are suitable for all LQFP and
QFP packages.
• Do not consider wave soldering LQFP packages
LQFP48 (SOT313-2), LQFP64 (SOT314-2) or
LQFP80 (SOT315-1).
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
• Do not consider wave soldering QFP packages
QFP52 (SOT379-1), QFP100 (SOT317-1),
QFP100 (SOT317-2), QFP100 (SOT382-1) or
QFP160 (SOT322-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Oct 17
15
Philips Semiconductors
Objective specification
DECT baseband controllers
PCD5090; PCA5097
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Short-form specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
The data in this specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Oct 17
16
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