PCD5092 [NXP]
DECT baseband controller; DECT基带控制器型号: | PCD5092 |
厂家: | NXP |
描述: | DECT baseband controller |
文件: | 总16页 (文件大小:87K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCD5092
DECT baseband controller
1997 Jul 21
Objective specification
Supersedes data of 1996 Oct 30
File under Integrated Circuits, IC17
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
CONTENTS
1
FEATURES
1.1
2
DSP software features
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
3
4
5
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
6
7
8
FUNCTIONAL DESCRIPTION
PACKAGE OUTLINE
SOLDERING
8.1
8.2
8.3
8.4
Introduction
Reflow soldering
Wave soldering
Repairing soldered joints
9
DEFINITIONS
10
11
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I2C COMPONENTS
1997 Jul 21
2
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
• Easy interfacing with radio circuits, operating at other
supply voltage (RF supply pin with level shifter for RF
signals)
1
FEATURES
• 80C51 ports P0, P1, P2 and P3 available for interfacing
to display, keyboard, I2C-bus, interrupt sources and/or
external memory. Integrated 64 kbyte ROM, 3 kbytes of
data memory and 1 kbyte SDR-RAM. External program
memory is addressable up to 128 kbytes
• On-chip comparator for use as data-slicer
• Low power oscillator with integrated frequency
adjustment
• +2.7 to +5 V port (P0 to P3) interface
• QFP100 package
• TDMA frame (de)multiplexing. Transmission or
• Power-on-reset
reception can be programmed for any slot.
• Programmable power-down modes
• Low supply voltage (2.7 to 3.6 V)
• CMOS technology.
• Ciphering, scrambling, CRC checking/generation and
protected B-fields
• Speech and data buffering space for six handsets
• Local call and B-field loop-back
1.1
DSP software features
• Two interrupt lines for BML and DSP to interrupt 80C51
• ADPCM encoding and decoding complying with G.721
• u-law encoding and decoding complying with G.711
• Echo cancellation and network echo suppressor
• Speech filters
• On-chip, three-channel time-multiplexed 8-bit
Analog-to-Digital Converter (ADC) for RSSI
measurement, one for battery voltage measurement
and one channel available for other purposes
• Programmable gain in speech paths
• Side tone and soft mute
• On-chip 8-bit Digital-to-Analog Converter (DAC) for
electronic potentiometer function
• Phase error measurement and phase error correction by
hardware
• Ringer and tone (DTMF) generator
• Automatic gain control
• DACs and ADCs for dynamic earpiece and dynamic or
electret microphone
• Telephone Answering Machine (TAM) switch.
For each DSP software version a separate manual is
available in which detailed information is provided on how
parameters must be set. For further information please
contact Philips Semiconductors.
• On-chip reference voltage
• On-chip supply for electret microphone
• Very low ohmic buzzer output
• Serial interface to external ADPCM CODEC (PCD5032)
or 8 kHz u-law samples
2
GENERAL DESCRIPTION
• Speech switch for Digital Telephone Answering
Machine (DTAM) connected to SPI interface
The PCD5092 is designed for GAP-compliant single a/b
line basestations with answering machine switch. It has an
embedded 80C51 microcontroller with twice the
performance of the classic architecture, 64 kbytes of
PROM program memory and 3 kbytes of data memory
on-chip. In addition there is 1 kbyte of on-chip data
memory that is shared with on-chip Burst Mode Logic
(BML) and DSP, the System Data RAM (SDR).
• IOM-2 interface (Siemens registered trademark)
• Serial interface to synthesizer for frequency
programming
• Programmable polarity and timing of radio-control
signals
• GMSK pulse shaper
3
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
PCD5092H
QFP100
plastic quad flat package; 100 leads (lead length 1.95 mm);
SOT317-2
body 14 × 20 × 2.8 mm
1997 Jul 21
3
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
4
BLOCK DIAGRAM
BM9H46
b o o k , f u l l p a g e w i d t h
1997 Jul 21
4
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
5
PINNING INFORMATION
Pinning
5.1
1
2
3
4
5
6
7
8
9
ANT_SW1
80 TST2
79 TST1
ANT_SW0
CLK100
78
77
V
V
SS4
T_ENABLE
T_PWR_RMP
T_DATA
DD5V_2
76 A16
75 P2.2
T_GMSK
P2.1
P2.0
74
73
VCO_BND_SW
SYNTH_LOCK
72 P3.7
71 P3.6
S_ENABLE 10
11
12
13
S_DATA
S_CLK
P3.5
P3.4
70
69
S_PWR
68 P3.3
67 P3.2
REF_CLK 14
V
15
16
17
P3.1
P3.0
V
66
65
64
63
62
61
60
SS1
DD_RF
PCD5092
V
V
DD3V_1
SS3
V
SLICE_CTR 18
R_PWR 19
SS2
BZP
BZM
V
20
R_DATAP
R_DATAM 21
R_ENABLE 22
RSSI_AN 23
VANLI 24
VBAT 25
DD3V_2
59 P1.7
P1.6
P1.5
58
57
56 P1.4
55 P1.3
CLK3 26
DCK 27
V
DD5V_1
54
53
52
DI 28
R_SLICED
FS1
DPLL_DATA
29
DO 30
51 GP_CLK7
MGD799
Fig.2 Pin configuration (QFP100).
5
1997 Jul 21
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
5.2
Pin description
Table 1 QFP100 package
STATE
AFTER
RESET
SYMBOL
ANT_SW1
PIN
I/O
PIN TYPE
PIN DESCRIPTION
1
O
O
O
O
O
O
O
O
I
H
ISP2DRF3 antenna switch 1 output
ISP2DRF3 antenna switch 0 output
ANT_SW0
CLK100
2
H
3
H
ISP2DPES 100 Hz signal related to DECT frame timing output
ISP2DRF3 enable transmitter output
T_ENABLE
T_PWR_RMP
T_DATA
4
H
5
L
ISP2DRF3 switch transmitter power output
6
off
ISF2DRF3
ANAIOD1
unmodulated transmitter data output
T_GMSK
VCO_BND_SW
SYNTH_LOCK
S_ENABLE
S_DATA
7
L
GMSK modulated transmitter data output
8
L
ISP2DRF3 VCO band switch output
9
−
DIPP0RF3 synthesizer lock input
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
O
O
O
O
O
−
L
ISP2DRF3 synthesizer enable output
L
ISP2DRF3 serial synthesizer data output
ISP2DRF3 clock for serial synthesizer interface output
ISP2DRF3 switch synthesizer power output
ISP4DRF3 13.824 MHz reference clock for synthesizer output
S_CLK
L
S_PWR
H
REF_CLK
VSS1
running
−
−
supply
supply
supply
negative supply voltage 1
VDD_RF
−
positive supply voltage for RF interface level shifters
positive supply voltage 1 (+3 V)
VDD3V_1
−
−
SLICE_CTR
R_PWR
O
O
I
L
ISP2DRF3 switch slicer time constant output
ISP2DRF3 switch receiver power output
H
−
R_DATAP
R_DATAM
R_ENABLE
RSSI_AN
VANLI
ANAIOD2
ANAIOD2
positive input for receiver data
negative input for receiver data
I
−
O
I
H
−
ISP2DRF3 enable receiver output
ANAIOD1
ANAIOD1
ANAIOD1
analog input for RSSI measurement
I
−
analog input to ADC
VBAT
I
−
analog input for battery voltage measurement
CLK3
O
I/O
L
ISP2DPES 3.456 MHz clock output for external ADPCM codec
DCK
input
ISF2DPES ADPCM output or IOM data clock input/output
ISF2UPES (ISF2UPES in PCD5090/xxx, PCA5097/xxx)
DI
28
29
I
−
DIPP0PES ADPCM or IOM data input
FS1
I/O
input
ISF2DPES 8 kHz framing input/output
ISF2UPES (ISF2UPES in PCD5090/xxx, PCA5097/xxx)
DO
30
31
32
33
O
O
I
off
running
−
ISI8DPES
ANAIOD1
ANAIOD1
ANAIOD1
ADPCM or IOM data output
crystal oscillator output
XTAL2
XTAL1
VANLO
crystal oscillator input
O
1.0 V
analog output from D/A converter
1997 Jul 21
6
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
STATE
SYMBOL
VSSO
PIN
I/O
AFTER
RESET
PIN TYPE
PIN DESCRIPTION
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
−
−
−
supply
negative supply voltage for the oscillator
positive supply voltage for the oscillator
negative input from line interface
positive input from line interface
negative supply voltage for analog circuits
negative input from microphone
positive input from microphone
VDDO
−
supply
LIFM
I
0.7 V
ANAIOD1
ANAIOD1
supply
LIFP
I
0.7 V
VSSA
−
−
MICM
MICP
VMIC
Vref
I
0.7 V
ANAIOR1
ANAIOR1
ANAIOD1
ANAIOD1
ANAIOR1
supply
I
0.7 V
O
off
positive microphone supply voltage (+2 V)
reference voltage (+2 V)
O
2.0 V
VBGP
VDDA
O
1.25 V
bandgap output voltage (+1.25 V)
positive supply voltage for analog circuits
negative output to earpiece
−
−
1.4 V
1.4 V
−
EARM
EARP
EN_WATCHDOG
P1.0
O
ANAIOD1
ANAIOD1
O
positive output to earpiece
I
DIUP0PES watchdog enable input
I/O
I/O
I/O
O
H
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISP2DPES general purpose 6.912 MHz output
ISP2DPES data after clock recovery network
ISP2DPES R_DATA comparator output
P1.1
H
P1.2
H
GP_CLK7
DPLL_DATA
R_SLICED
VDD5V_1
P1.3
L
O
L
O
L
−
−
supply
positive supply voltage 1 for the +5 V interface
I/O
I/O
I/O
I/O
I/O
−
H
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
P1.4
H
P1.5
H
P1.6
off
off
−
ISI8DPES
ISI8DPES
supply
bidirectional 80C51 port pin
bidirectional 80C51 port pin
positive supply voltage 2 (+3 V)
negative buzzer output
P1.7
VDD3V_2
BZM
O
L
ANAIOD2
ANAIOD2
supply
BZP
O
L
positive buzzer output
VSS2
−
−
negative supply voltage 2
negative supply voltage 3
VSS3
−
−
supply
P3.0
I/O
I/O
I/O
I/O
I/O
I/O
H
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
P3.1
H
P3.2
H
P3.3
H
P3.4
H
P3.5
H
1997 Jul 21
7
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
STATE
SYMBOL
P3.6
PIN
I/O
AFTER
RESET
PIN TYPE
PIN DESCRIPTION
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
I/O
I/O
I/O
I/O
I/O
O
H
H
H
H
H
L
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
P3.7
P2.0
P2.1
P2.2
A16
ISP4DPES address bit 16 for 128 kbytes external program memory
VDD5V_2
VSS4
TST1
TST2
P2.3
P2.4
P2.5
P2.6
P2.7
PSE
ALE
−
−
supply
supply
positive supply voltage 2 for the +5 V interface
negative supply voltage 4
−
−
I
−
DIDP0PES test input 1
I
−
DIDP0PES test input 2
I/O
I/O
I/O
I/O
I/O
O
H
H
H
H
H
H
H
−
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES program store enable (80C51); active LOW
ISQ4CPES address latch enable (80C51)
ISF2DPES external access enable (80C51); active LOW
O
EA
I
VSS5
VDD5V_3
P0.7
−
−
supply
supply
negative supply voltage 5
−
−
positive supply voltage 3 for the +5 V interface
I/O
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0
92
93
94
95
96
97
98
I/O
I/O
I/O
I/O
I/O
I/O
I/O
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)
M_RESET
99
I
−
DIDP0PES master reset input (Schmitt trigger)
ISF2DPES reset output
RESET_OUT
100
O
H
1997 Jul 21
8
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
6
FUNCTIONAL DESCRIPTION
The PCD509x is a family of single-chip controllers, designed for use in Digital Enhanced Cordless Telecommunications
systems (DECT). The family is designed for minimum component-count and minimum power consumption. All controllers
include an embedded 80C51 microcontroller with on-chip memory and I2C-bus. The Philips DECT RF interface is
implemented. The Burst Mode Logic (BML) performs the time-critical MAC layer functions for applications in DECT
handsets and base stations. The ADPCM transcoding is in compliance with the CCITT recommendation G.721 and
includes receive and transmit filters.
EARPIECE
RADIO
PCD5091
CIRCUITS
MICROPHONE
MGD797
a. Handset.
LINE
INTERFACE
(e.g. TEA1118)
RADIO
CIRCUITS
PCD5092/
PCD5094
a/b line
u-law TAM switch
MBH945
b. Basestation (PCD5092) with analog interface and echo cancellation; up to 6 portables can be handled.
EARPIECE
RADIO
CIRCUITS
PCD5093
MICROPHONE
2 x IOM or
2 x ADPCM-CODEC or
2
a combination
MGD795
c. Base with digital interface and analog handset connected; up to 6 portables can be handled.
Fig.3 Block diagrams of DECT systems with PCX509x.
9
1997 Jul 21
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
7
PACKAGE OUTLINE
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
y
X
A
80
51
81
50
Z
E
Q
e
A
2
H
A
E
E
(A )
3
A
1
θ
w M
p
pin 1 index
L
p
b
L
31
100
detail X
1
30
w M
Z
v
M
D
A
b
p
e
D
B
H
v
M
B
D
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.25 2.90
0.05 2.65
0.40 0.25 20.1 14.1
0.25 0.14 19.9 13.9
24.2 18.2
23.6 17.6
1.0
0.6
1.4
1.2
0.8
0.4
1.0
0.6
mm
3.20
0.25
0.65
1.95
0.2 0.15 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT317-2
1997 Jul 21
10
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
8
SOLDERING
Introduction
8.3
Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
8.1
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
8.2
Reflow soldering
Even with these conditions do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
Reflow soldering techniques are suitable for all QFP
packages.
QFP100 (SOT382-1) or QFP160 (SOT322-1).
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
8.4
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1997 Jul 21
11
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
9
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Short-form specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
The data in this specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
10 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
11 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1997 Jul 21
12
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
NOTES
1997 Jul 21
13
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
NOTES
1997 Jul 21
14
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5092
NOTES
1997 Jul 21
15
Philips Semiconductors – a worldwide company
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Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Vietnam: see Singapore
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
437027/00/02/pp16
Date of release: 1997 Jul 21
Document order number: 9397 750 01657
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