PCD5091H-T [NXP]
IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PQFP100, Cordless Telephone IC;
| 型号： | PCD5091H-T |
| 厂家： | 
NXP |
| 描述： | IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PQFP100, Cordless Telephone IC 控制器 |
| 文件： | 总16页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCD5091
DECT baseband controller
1997 Jul 21
Objective specification
Supersedes data of 1996 Oct 30
File under Integrated Circuits, IC17
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
CONTENTS
1
FEATURES
1.1
2
DSP software features
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
3
4
5
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
6
7
8
FUNCTIONAL DESCRIPTION
PACKAGE OUTLINES
SOLDERING
8.1
8.2
8.3
8.4
Introduction
Reflow soldering
Wave soldering
Repairing soldered joints
9
DEFINITIONS
10
11
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I2C COMPONENTS
1997 Jul 21
2
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
• Easy interfacing with radio circuits, operating at other
supply voltage (RF supply pin with level shifter for RF
signals)
1
FEATURES
• 80C51 ports P0, P1, P2 and P3 available for interfacing
to display, keyboard, I2C-bus, interrupt sources and/or
external memory. Integrated 64 kbyte ROM, 3 kbytes of
data memory and 1 kbyte SDR-RAM. External program
memory is addressable up to 128 kbytes
• On-chip comparator for use as data-slicer
• Low power oscillator with integrated frequency
adjustment
• +2.7 to +5 V port (P0 to P3) interface
• QFP100 and LQFP100 packages
• Power-on-reset
• TDMA frame (de)multiplexing. Transmission or
reception can be programmed for any slot
• Programmable power-down modes
• Low supply voltage (2.7 to 3.6 V)
• CMOS technology.
• Ciphering, scrambling, CRC checking/generation and
protected B-fields
• Speech and data buffering space for six handsets
• Local call and B-field loop-back
1.1
DSP software features
• Two interrupt lines for BML and DSP to interrupt 80C51
• ADPCM encoding and decoding complying with G.721
• Volume control
• On-chip, three-channel time-multiplexed 8-bit
Analog-to-Digital Converter (ADC) for RSSI
measurement, one for battery voltage measurement
and one channel available for other purposes
• Speech filters
• Programmable gain in speech paths
• Side tone and soft mute
• On-chip 8-bit Digital-to-Analog Converter (DAC) for
electronic potentiometer function
• Two tone (DTMF) generators
• Automatic gain control
• Phase error measurement and phase error correction by
hardware
• Hands-free operation
• DACs and ADCs for dynamic earpiece and dynamic or
For each DSP software version a separate manual is
available in which detailed information is provided on how
parameters must be set. For further information please
contact Philips Semiconductors.
electret microphone
• On-chip reference voltage
• On-chip supply for electret microphone
• Very low ohmic buzzer output
• Serial interface to external ADPCM CODEC (PCD5032)
2
GENERAL DESCRIPTION
or 8 kHz u-law samples
The PCD5091 is designed for GAP-compliant handsets
with speaker-phone option. It has an embedded 80C51
microcontroller with twice the performance of the classic
architecture, 64 kbytes of PROM program memory and
3 kbytes of data memory on-chip. In addition there is
1 kbyte of on-chip data memory that is shared with on-chip
Burst Mode Logic (BML) and DSP, the System Data RAM
(SDR).
• Speech switch for Digital Telephone Answering
Machine (DTAM) connected to SPI interface
• IOM-2 interface (Siemens registered trademark)
• Serial interface to synthesizer for frequency
programming
• Programmable polarity and timing of radio-control
signals
• GMSK pulse shaper
3
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
PCD5091H
QFP100
plastic quad flat package; 100 leads (lead length 1.95 mm);
SOT317-2
body 14 × 20 × 2.8 mm
PCD5091HZ
1997 Jul 21
LQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm SOT407-1
3
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
4
BLOCK DIAGRAM
GM8D0
b o o k , f u l l p a g e w i d t h
1997 Jul 21
4
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
5
PINNING INFORMATION
Pinning
5.1
1
2
3
4
5
6
7
8
9
ANT_SW1
80 TST2
79 TST1
ANT_SW0
CLK100
78
77
V
V
SS4
T_ENABLE
T_PWR_RMP
T_DATA
DD5V_2
76 A16
75 P2.2
T_GMSK
P2.1
P2.0
74
73
VCO_BND_SW
SYNTH_LOCK
72 P3.7
71 P3.6
S_ENABLE 10
11
12
13
S_DATA
S_CLK
P3.5
P3.4
70
69
S_PWR
68 P3.3
67 P3.2
REF_CLK 14
V
15
16
17
P3.1
P3.0
V
66
65
64
63
62
61
60
SS1
DD_RF
PCD5091
V
V
DD3V_1
SS3
V
SLICE_CTR 18
R_PWR 19
SS2
BZP
BZM
V
20
R_DATAP
R_DATAM 21
R_ENABLE 22
RSSI_AN 23
VANLI 24
VBAT 25
DD3V_2
59 P1.7
P1.6
P1.5
58
57
56 P1.4
55 P1.3
CLK3 26
DCK 27
V
DD5V_1
54
53
52
DI 28
R_SLICED
FS1
DPLL_DATA
29
DO 30
51 GP_CLK7
MBH938
Fig.2 Pin configuration (QFP100).
5
1997 Jul 21
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
1
2
3
4
5
6
7
8
9
CLK100
T_ENABLE
T_PWR_RMP
T_DATA
75
74
73
V
DD5V_2
A16
P2.2
72 P2.1
T_GMSK
71
70
P2.0
P3.7
VCO_BND_SW
SYNTH_LOCK
S_ENABLE
S_DATA
69 P3.6
68 P3.5
67
66
P3.4
P3.3
S_CLK 10
S_PWR 11
65 P3.2
64 P3.1
12
13
14
15
16
17
REF_CLK
V
PCD5091
63
62
61
P3.0
V
SS1
V
DD_RF
SS3
V
V
DD3V_1
SS2
SLICE_CTR
R_PWR
60 BZP
59
58
BZM
V
R_DATAP 18
R_DATAM 19
DD3V_2
57 P1.7
56 P1.6
20
21
R_ENABLE
RSSI_AN
55
54
P1.5
P1.4
VANLI 22
VBAT 23
53 P1.3
24
25
CLK3
DCK
52
51
V
DD5V_1
R_SLICED
MGD798
Fig.3 Pin configuration (LQFP100).
6
1997 Jul 21
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
5.2
Pin description
Table 1 QFP100 and LQFP100 packages
PIN
STATE
AFTER
RESET
SYMBOL
I/O
PIN TYPE
PIN DESCRIPTION
QFP100 LQFP100
ANT_SW1
ANT_SW0
CLK100
1
2
3
99
100
1
O
O
O
H
H
H
ISP2DRF3 antenna switch 1 output
ISP2DRF3 antenna switch 0 output
ISP2DPES 100 Hz signal related to DECT frame timing
output
T_ENABLE
T_PWR_RMP
T_DATA
4
5
2
3
O
O
O
O
O
I
H
L
ISP2DRF3 enable transmitter output
ISP2DRF3 switch transmitter power output
ISF2DRF3 unmodulated transmitter data output
6
4
off
L
T_GMSK
7
5
ANAIOD1
GMSK modulated transmitter data output
VCO_BND_SW
SYNTH_LOCK
S_ENABLE
S_DATA
8
6
L
ISP2DRF3 VCO band switch output
9
7
−
DIPP0RF3 synthesizer lock input
10
11
12
13
14
8
O
O
O
O
O
L
ISP2DRF3 synthesizer enable output
ISP2DRF3 serial synthesizer data output
ISP2DRF3 clock for serial synthesizer interface output
ISP2DRF3 switch synthesizer power output
9
L
S_CLK
10
11
12
L
S_PWR
H
REF_CLK
running ISP4DRF3 13.824 MHz reference clock for synthesizer
output
VSS1
15
16
13
14
−
−
−
−
supply
supply
negative supply voltage 1
VDD_RF
positive supply voltage for RF interface level
shifters
VDD3V_1
17
18
19
20
21
22
23
24
25
15
16
17
18
19
20
21
22
23
−
O
O
I
−
L
H
−
−
H
−
−
−
supply
positive supply voltage 1 (+3 V)
SLICE_CTR
R_PWR
ISP2DRF3 switch slicer time constant output
ISP2DRF3 switch receiver power output
R_DATAP
R_DATAM
R_ENABLE
RSSI_AN
VANLI
ANAIOD2
ANAIOD2
positive input for receiver data
negative input for receiver data
I
O
I
ISP2DRF3 enable receiver output
ANAIOD1
ANAIOD1
ANAIOD1
analog input for RSSI measurement
I
analog input to ADC
VBAT
I
analog input for battery voltage
measurement
CLK3
26
24
O
L
ISP2DPES 3.456 MHz clock output for external ADPCM
codec
1997 Jul 21
7
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
PIN
STATE
AFTER
RESET
SYMBOL
I/O
PIN TYPE
PIN DESCRIPTION
QFP100 LQFP100
DCK
27
25
I/O
input
ISF2DPES ADPCM output or IOM data clock
ISF2UPES input/output (ISF2UPES in PCD5090/xxx,
PCA5097/xxx)
DI
28
29
26
27
I
−
DIPP0PES ADPCM or IOM data input
FS1
I/O
input
ISF2DPES 8 kHz framing input/output
ISF2UPES (ISF2UPES in PCD5090/xxx, PCA5097/xxx)
DO
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
O
O
I
off
ISI8DPES ADPCM or IOM data output
XTAL2
XTAL1
VANLO
VSSO
running ANAIOD1
crystal oscillator output
−
ANAIOD1
ANAIOD1
supply
crystal oscillator input
O
−
1.0 V
−
analog output from D/A converter
negative supply voltage for the oscillator
positive supply voltage for the oscillator
negative input from line interface
positive input from line interface
negative supply voltage for analog circuits
negative input from microphone
positive input from microphone
positive microphone supply voltage (+2 V)
reference voltage (+2 V)
VDDO
−
−
supply
LIFM
I
0.7 V
0.7 V
−
ANAIOD1
ANAIOD1
supply
LIFP
I
VSSA
−
MICM
I
0.7 V
0.7 V
off
ANAIOR1
ANAIOR1
ANAIOD1
ANAIOD1
MICP
I
VMIC
O
O
O
−
Vref
2.0 V
VBGP
VDDA
1.25 V ANAIOR1
bandgap output voltage (+1.25 V)
positive supply voltage for analog circuits
negative output to earpiece
−
supply
EARM
EARP
EN_WATCHDOG
P1.0
O
O
I
1.4 V
ANAIOD1
ANAIOD1
1.4 V
positive output to earpiece
−
H
H
H
L
DIUP0PES watchdog enable input
I/O
I/O
I/O
O
O
O
−
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISP2DPES general purpose 6.912 MHz output
ISP2DPES data after clock recovery network
ISP2DPES R_DATA comparator output
P1.1
P1.2
GP_CLK7
DPLL_DATA
R_SLICED
VDD5V_1
L
L
−
supply
positive supply voltage 1 for the +5 V
interface
P1.3
P1.4
55
56
53
54
I/O
I/O
H
H
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
1997 Jul 21
8
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
PIN
STATE
AFTER
RESET
SYMBOL
I/O
PIN TYPE
PIN DESCRIPTION
QFP100 LQFP100
P1.5
P1.6
P1.7
VDD3V_2
BZM
BZP
VSS2
VSS3
P3.0
P3.1
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
P2.0
P2.1
P2.2
A16
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
I/O
I/O
I/O
−
H
off
off
−
ISQ2CPES bidirectional 80C51 port pin
ISI8DPES bidirectional 80C51 port pin
ISI8DPES bidirectional 80C51 port pin
supply
positive supply voltage 2 (+3 V)
negative buzzer output
O
L
ANAIOD2
ANAIOD2
supply
O
L
positive buzzer output
−
−
negative supply voltage 2
negative supply voltage 3
−
−
supply
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
H
H
H
H
H
H
H
H
H
H
H
L
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISP4DPES address bit 16 for 128 kbytes external
program memory
VDD5V_2
77
75
−
−
supply
positive supply voltage 2 for the +5 V
interface
VSS4
TST1
TST2
P2.3
P2.4
P2.5
P2.6
P2.7
PSE
ALE
78
79
80
81
82
83
84
85
86
87
76
77
78
79
80
81
82
83
84
85
−
I
−
−
supply
negative supply voltage 4
DIDP0PES test input 1
I
−
DIDP0PES test input 2
I/O
I/O
I/O
I/O
I/O
O
H
H
H
H
H
H
H
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES bidirectional 80C51 port pin
ISQ2CPES program store enable (80C51); active LOW
ISQ4CPES address latch enable (80C51)
O
1997 Jul 21
9
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
PIN
STATE
AFTER
RESET
SYMBOL
I/O
PIN TYPE
PIN DESCRIPTION
QFP100 LQFP100
EA
88
86
I
−
ISF2DPES external access enable (80C51); active
LOW
VSS5
89
90
87
88
−
−
−
−
supply
supply
negative supply voltage 5
VDD5V_3
positive supply voltage 3 for the +5 V
interface
P0.7
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0
91
92
93
94
95
96
97
98
89
90
91
92
93
94
95
96
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
off
H
ISP2DPES bidirectional 80C51 port pin
ISQ2CPES (ISQ2CPES in PCD5090/xxx,
PCA5097/xxx)
M_RESET
99
97
98
I
−
DIDP0PES master reset input (Schmitt trigger)
ISF2DPES reset output
RESET_OUT
100
O
H
1997 Jul 21
10
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
6
FUNCTIONAL DESCRIPTION
The PCD509x is a family of single-chip controllers, designed for use in Digital Enhanced Cordless Telecommunications
systems (DECT). The family is designed for minimum component-count and minimum power consumption. All controllers
include an embedded 80C51 microcontroller with on-chip memory and I2C-bus. The Philips DECT RF interface is
implemented. The Burst Mode Logic (BML) performs the time-critical MAC layer functions for applications in DECT
handsets and base stations. The ADPCM transcoding is in compliance with the CCITT recommendation G.721 and
includes receive and transmit filters.
EARPIECE
RADIO
PCD5091
CIRCUITS
MICROPHONE
MGD797
a. Handset.
LINE
INTERFACE
(e.g. TEA1118)
RADIO
CIRCUITS
PCD5092/
PCD5094
a/b line
u-law TAM switch
MBH945
b. Base with analog interface and echo cancellation; up to 6 portables can be handled.
EARPIECE
RADIO
PCD5093
CIRCUITS
MICROPHONE
2 x IOM or
2 x ADPCM-CODEC or
2
a combination
MGD795
c. Base with digital interface and analog handset connected; up to 6 portables can be handled.
Fig.4 Block diagrams of DECT systems with PCX509x.
11
1997 Jul 21
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
7
PACKAGE OUTLINE
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
y
X
A
80
51
81
50
Z
E
Q
e
A
2
H
A
E
E
(A )
3
A
1
θ
w M
p
pin 1 index
L
p
b
L
31
100
detail X
1
30
w M
Z
v
M
D
A
b
p
e
D
B
H
v
M
B
D
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.25 2.90
0.05 2.65
0.40 0.25 20.1 14.1
0.25 0.14 19.9 13.9
24.2 18.2
23.6 17.6
1.0
0.6
1.4
1.2
0.8
0.4
1.0
0.6
mm
3.20
0.25
0.65
1.95
0.2 0.15 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT317-2
1997 Jul 21
12
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
X
A
51
75
50
26
(1)
76
Z
E
e
Q
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
L
pin 1 index
detail X
100
1
25
Z
D
v
M
A
B
e
w M
b
p
D
B
H
v
M
5
D
0
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.5
0.05 1.3
0.28 0.18 14.1 14.1
0.16 0.12 13.9 13.9
16.25 16.25
15.75 15.75
0.75 0.70
0.45 0.57
1.15 1.15
0.85 0.85
mm
1.6
0.25
0.5
1.0
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-12-19
SOT407-1
1997 Jul 21
13
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
If wave soldering cannot be avoided, the following
conditions must be observed:
8
SOLDERING
Introduction
8.1
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions:
• Do not consider wave soldering LQFP packages
LQFP48 (SOT313-2), LQFP64 (SOT314-2) or
LQFP80 (SOT315-1).
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
• Do not consider wave soldering QFP packages
QFP52 (SOT379-1), QFP100 (SOT317-1),
QFP100 (SOT317-2), QFP100 (SOT382-1) or
QFP160 (SOT322-1).
8.2
Reflow soldering
Reflow soldering techniques are suitable for all LQFP and
QFP packages.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
8.4
Repairing soldered joints
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
8.3
Wave soldering
Wave soldering is not recommended for LQFP or QFP
packages. This is because of the likelihood of solder
bridging due to closely-spaced leads and the possibility of
incomplete solder penetration in multi-lead devices.
1997 Jul 21
14
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5091
9
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Short-form specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
The data in this specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
10 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
11 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1997 Jul 21
15
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
437027/00/02/pp16
Date of release: 1997 Jul 21
Document order number: 9397 750 01656
相关型号：
PCD5092H-T
IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PQFP100, PLASTIC, SOT-317-2, QFP-64, Cordless Telephone IC
NXP
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