BZA100T/R [NXP]
DIODE 27.5 W, UNIDIRECTIONAL, 18 ELEMENT, SILICON, TVS DIODE, MS-013AC, PLASTIC, MS-013, SOP-20, Transient Suppressor;
| 型号： | BZA100T/R |
| 厂家： | 
NXP |
| 描述： | DIODE 27.5 W, UNIDIRECTIONAL, 18 ELEMENT, SILICON, TVS DIODE, MS-013AC, PLASTIC, MS-013, SOP-20, Transient Suppressor |
| 文件： | 总8页 (文件大小：64K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
M3D
BZA100
18-fold ESD transient voltage
suppressor
1997 Dec 02
Product specification
Supersedes data of 1996 Mar 21
Philips Semiconductors
Product specification
18-fold ESD transient voltage suppressor
BZA100
FEATURES
DESCRIPTION
PINNING
• SO20 SMD package allows 18
separate voltage regulator diodes
in a common anode configuration
18-fold monolitic transient voltage
suppressor. Its 18-fold junction
common anode design protects 18
separate lines using only one
package. This device is ideal for
situations where board space is a
premium.
PIN
DESCRIPTION
1 to 5
cathode (k1 to k5)
6 and 16 common anode (a1; a2)
7 to 15 cathode (k6 to k14)
17 to 20 cathode (k15 to k18)
• Working voltage: typ. 6.8 V
• Forward voltage: max. 1.3 V
• Maximum reverse peak power
dissipation: 27.5 W at tp = 1 ms
• Maximum clamping voltage at peak
pulse current: 11 V at 2.5 A
handbook, 4 columns
k
k
k
1
20
19
18
17
16
15
14
13
12
11
1
18
17
• Low leakage current: max. 2 µA
k
2
2
• ESD rating >8 kV, according
IEC 801-2.
k
k
k
k
3
3
16
20 19 18 17 16 15 14 13 12 11
4
4
5
15
APPLICATIONS
k
a
5
2
SO20
• Where transient overvoltage
protection in voltage and ESD
sensitive equipment is required
such as:
a
k
k
k
6
1
14
7
6
7
13
12
1
2
3
4
5
6
7
8
9
10
k
k
8
MBG396
– Computers
k
k
k
k
9
8
9
11
10
– Printers
10
– Business machines
– Communication systems
– Medical equipment.
Fig.1 Pin configuration for SO20 (SOT163-1) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
working current
CONDITIONS
MIN.
MAX.
note 1
200
UNIT
IZ
−
−
−
−
mA
IF
continuous forward current
mA
A
IFSM
IZSM
Ptot
non-repetitive peak forward current
non-repetitive peak reverse current
total power dissipation
tp = 1 ms; square pulse
tp = 1 ms; square pulse; see Fig.2
see Fig.3
4
2.5
A
up to Ts = 60 °C; note 2
up to Tamb = 25 °C; note 3
tp = 1 ms; square pulse; see Fig.4
−
−
−
1.6
W
W
W
1.25
27.5
PZSM
non-repetitive peak reverse power
dissipation
Tstg
Tj
storage temperature
−65
+150
150
°C
°C
operating junction temperature
−
Notes
1. DC working current limited by Ptot max
2. One or more diodes loaded; Ts is the temperature at the soldering point.
3. One or more diodes loaded; device mounted on a printed-circuit board with Rth a-s = 43.5 K/W.
.
1997 Dec 02
2
Philips Semiconductors
Product specification
18-fold ESD transient voltage suppressor
BZA100
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-s
Rth j-a
thermal resistance from junction to soldering point
thermal resistance from junction to ambient
one or more diodes loaded
56.5
100
K/W
K/W
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VZ
working voltage
forward voltage
non-repetitive peak reverse voltage tp = 1 ms; IZSM = 2.5 A
IZ = 5 mA
6.4
6.8
7.2
1.3
11
2
V
V
V
VF
IF = 200 mA
−
−
−
−
−
−
−
−
−
−
−
3
VZSM
IR
reverse current
VR = 5.25 V
IZ = 1 mA
IZ = 5 mA
IZ = 5mA
µA
Ω
rdif
differential resistance
40
8
Ω
SZ
Cd
temperature coefficient of
working voltage
−
mV/K
diode capacitance
see Fig.5
VR = 0; f = 1 MHz
VR = 5.25 V; f = 1 MHz
−
−
−
−
120
60
pF
pF
1997 Dec 02
3
Philips Semiconductors
Product specification
18-fold ESD transient voltage suppressor
BZA100
GRAPHICAL DATA
MBG393
MBG394
10
2.4
handbook, halfpage
handbook, halfpage
P
tot
(W)
I
ZSM
(A)
1.6
1
0.8
−1
10
10
0
0
−1
2
3
o
50
100
150
1
10
10
10
(ms)
T
( C)
t
s
p
All diodes loaded.
Fig.2 Maximum non-repetitive peak reverse
current as a function of pulse time.
Fig.3 Power derating curve.
MBG395
MBG392
2
100
10
handbook, halfpage
handbook, halfpage
C
d
(pF)
P
ZSM
(W)
80
10
60
40
0
1
10
−1
2
3
2
4
6
1
10
10
10
(ms)
V
(V)
t
R
p
PZSM = VZSM × IZSM
.
VZSM is the non-repetitive peak reverse voltage at IZSM
.
Tj = 25 °C; f = 1 MHz.
Fig.4 Maximum non-repetitive peak reverse power
dissipation as a function of pulse duration
(square pulse).
Fig.5 Diode capacitance as a function of reverse
voltage; typical values.
1997 Dec 02
4
Philips Semiconductors
Product specification
18-fold ESD transient voltage suppressor
BZA100
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
1997 Dec 02
5
Philips Semiconductors
Product specification
18-fold ESD transient voltage suppressor
BZA100
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Dec 02
6
Philips Semiconductors
Product specification
18-fold ESD transient voltage suppressor
BZA100
NOTES
1997 Dec 02
7
Philips Semiconductors – a worldwide company
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© Philips Electronics N.V. 1997
SCA56
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
117027/00/02/pp8
Date of release: 1997 Dec 02
Document order number: 9397 750 03107
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