BZA109TST/R [NXP]
DIODE 25 W, UNIDIRECTIONAL, 18 ELEMENT, SILICON, TVS DIODE, MO-150AE, PLASTIC, SMD, SSOP-20, Transient Suppressor;
| 型号： | BZA109TST/R |
| 厂家： | 
NXP |
| 描述： | DIODE 25 W, UNIDIRECTIONAL, 18 ELEMENT, SILICON, TVS DIODE, MO-150AE, PLASTIC, SMD, SSOP-20, Transient Suppressor |
| 文件： | 总12页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
ndbook, halfpage
BZA109
9-fold ESD transient voltage
suppressor
1997 Dec 01
Product specification
Supersedes data of 1997 Oct 27
File under Discrete Semiconductors, SC01
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
FEATURES
DESCRIPTION
PINNING
• ESD rating >8 kV, according to
IEC1000-4-2
9-fold monolithic transient voltage
suppressor in an SO20; SOT163-1
surface mount package. The device is
ideal in situations where board space
is a premium.
PIN
DESCRIPTION
1 to 5
input (IN1 to IN5)
• SOT163-1 surface mount package
• Common anode configuration
• Non-clamping range 0.5 to 6.8 V
6 and 15 common anode (GND)
7 to 10 input (IN6 to IN9)
11 to 14 output (OUT9 to OUT6)
16 to 20 output (OUT5 to OUT1)
• Maximum non-repetitive peak
reverse power dissipation: 25 W
at tp = 1 ms
• Maximum clamping voltage at peak
handbook, 4 columns
pulse current: 10 V at IZSM = 2.5 A.
IN1
IN2
IN3
IN4
IN5
GND
IN6
IN7
IN8
IN9
1
20 OUT1
19 OUT2
18 OUT3
2
APPLICATIONS
3
20 19 18 17 16 15 14 13 12 11
• For 9-bit wide undershoot/
overshoot clamping and fast ESD
transient suppression in:
OUT4
OUT5
GND
4
17
16
15
14
13
12
11
5
SO20
– Computers and peripherals
– Audio and video equipment
– Business machines
6
7
OUT6
OUT7
OUT8
OUT9
1
2
3
4
5
6
7
8
9
10
8
MBK268
– Communication systems
– Medical equipment.
9
10
Fig.1 Pin configuration for SO20 (SOT163-1) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
IZ
working current
Tamb = 25 °C
−
−
−
−
−
−
−
20
mA
IF
continuous forward current
feed-through current
Tamb = 25 °C
100
100
4.5
2.5
1.25
25
mA
mA
A
IFT
Tamb = 25 °C; note 1
IFSM
IZSM
Ptot
PZSM
non-repetitive peak forward current
non-repetitive peak reverse current
total power dissipation
tp = 1 ms; square pulse
tp = 1 ms; square pulse; see Fig.2
A
Tamb ≤ 25 °C; note 2; see Fig.3
W
W
non-repetitive peak reverse power
dissipation
tp = 1 ms; square pulse; see Fig.4
Tstg
Tj
storage temperature
−65
−65
+150
+150
°C
°C
operating junction temperature
Notes
1. Current is flowing from input to corresponding output.
2. One or more diodes loaded.
1997 Dec 01
2
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
one or more diodes loaded
100
K/W
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VZ
working voltage
forward voltage
IZ = 250 µA
6.4
6.8
−
7.2
1.1
10
V
V
V
VF
IF = 100 mA
−
−
−
−
−
VZSM
IH
non-repetitive peak reverse voltage IZSM = 2.5 A; tp = 1 ms
−
input high current
VIN = 5.25 V
IZ = 250 µA
IZ = 5 mA
−
0.5
100
−
µA
rdif
differential resistance
−
Ω
SZ
temperature coefficient of
working voltage
3
mV/K
Cd
diode capacitance
see Fig.5
VR = 0; f = 1 MHz
VR = 5.25 V; f = 1 MHz
−
−
−
−
200
100
pF
pF
1997 Dec 01
3
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
GRAPHICAL DATA
MBK269
MBK393
10
2.0
handbook, halfpage
handbook, halfpage
P
tot
I
ZSM
(A)
(W)
1.5
1.0
0.5
1
0
0
−1
10
1
10
50
100
150
T
200
(°C)
t
(ms)
p
amb
One or more diodes loaded.
Fig.2 Maximum non-repetitive peak reverse
current as a function of pulse time.
Fig.3 Power derating curve.
MBK272
MBK270
2
10
150
handbook, halfpage
handbook, halfpage
P
C
d
(pF)
ZSM
(W)
100
50
0
0
10
10
−1
1
10
2
4
6
V
(V)
t
(ms)
R
p
PZSM = VZSM × IZSM
.
VZSM is the non-repetitive peak reverse voltage at IZSM
.
Tj = 25 °C; f = 1 MHz.
Fig.4 Maximum non-repetitive peak reverse power
dissipation as a function of pulse duration
(square pulse).
Fig.5 Diode capacitance as a function of reverse
voltage; typical values.
1997 Dec 01
4
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
ESD TESTER
RG 223/U
50 Ω coax
DIGITIZING
OSCILLOSCOPE
10×
R
Z
450 Ω
ATTENUATOR
CH1
note 1
C
Z
50 Ω
RG 223/U
50 Ω coax
DIGITIZING
OSCILLOSCOPE
10×
450 Ω
ATTENUATOR
IEC 1000-4-2 network
CH2
C
= 150 pF; R = 330 Ω
input
output
Z
Z
note 1
50 Ω
Note 1: attenuator is only used for open
socket high voltage measurements
1/9 BZA109
vertical scale = 100 V/Div
horizontal scale = 50 ns/Div
vertical scale = 10 V/Div
horizontal scale = 50 ns/Div
output
GND
input
GND
GND
unclamped +1 kV ESD voltage waveform
(IEC1000−4−2 network)
clamped +1 kV ESD voltage waveform
(IEC1000−4−2 network)
vertical scale = 10 V/Div
horizontal scale = 50 ns/Div
GND
GND
input
GND
vertical scale = 100 V/Div
horizontal scale = 50 ns/Div
output
unclamped −1 kV ESD voltage waveform
(IEC1000−4−2 network)
clamped −1 kV ESD voltage waveform
(IEC1000−4−2 network)
MBK273
Fig.6 ESD clamping test set-up and waveforms.
5
1997 Dec 01
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
APPLICATION INFORMATION
Typical common anode application
A 9-fold transient suppressor in an SO20; SOT163-1 package makes it possible to protect nine separate lines using only
one package. Two simplified examples are shown in Figs 7 and 8.
FUNCTIONAL
DECODER
A
B
C
D
E
F
G
H
I
keyboard,
terminal,
printer,
etc.
I/O
BZA109
GND
MBK274
Fig.7 Computer interface protection.
V
V
DD
GG
address bus
RAM
ROM
data bus
I/O
CPU
CLOCK
control bus
4/9 BZA109
GND
MBK275
Fig.8 Microprocessor protection.
6
1997 Dec 01
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA109 is
determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further
add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a
minimum. This includes the lead length of the suppression element.
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input terminals or connectors.
2. Keep parallel signal paths to a minimum.
3. Avoid running protection conductors in parallel with unprotected conductors.
4. Minimize all printed-circuit board loop areas including power and ground loops.
5. Minimize the length of the transient return path to ground.
6. Avoid using shared transient return paths to a common ground point.
1997 Dec 01
7
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
1997 Dec 01
8
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Dec 01
9
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
NOTES
1997 Dec 01
10
Philips Semiconductors
Product specification
9-fold ESD transient voltage suppressor
BZA109
NOTES
1997 Dec 01
11
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© Philips Electronics N.V. 1997
SCA56
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
117027/00/03/pp12
Date of release: 1997 Dec 01
Document order number: 9397 750 03108
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