DS90LV011AHMF [NSC]

HIGH TEMPERATURE 3V LVDS DIFFERENTIAL DRIVER; 高温3V LVDS差分驱动器
DS90LV011AHMF
型号: DS90LV011AHMF
厂家: National Semiconductor    National Semiconductor
描述:

HIGH TEMPERATURE 3V LVDS DIFFERENTIAL DRIVER
高温3V LVDS差分驱动器

线路驱动器或接收器 驱动程序和接口 接口集成电路 光电二极管
文件: 总5页 (文件大小:491K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 2005  
DS90LV011AH  
High Temperature 3V LVDS Differential Driver  
General Description  
Features  
n
-40˚C to 125˚C operating temperature range  
The DS90LV011AH is an LVDS driver optimized for high  
data rate and low power applications. The DS90LV011AH is  
a current mode driver allowing power dissipation to remain  
low even at high frequency. In addition, the short circuit fault  
current is also minimized. The device is designed to support  
data rates in excess of 400Mbps (200MHz) utilizing Low  
Voltage Differential Signaling (LVDS) technology.  
n Conforms to TIA/EIA-644-A Standard  
>
n
400Mbps (200MHz) switching rates  
n 700 ps (100 ps typical) maximum differential skew  
n 1.5 ns maximum propagation delay  
n Single 3.3V power supply  
n
350 mV differential signaling  
The device is offered in a 5-lead small outline transistor  
package. The LVDS outputs have been arranged for easy  
PCB layout. The differential driver outputs provide low EMI  
with its typical low output swing of 350 mV. The  
DS90LV011AH can be paired with its companion single line  
receiver, the DS90LT012AH, or with any of National’s LVDS  
receivers, to provide a high-speed LVDS interface.  
n Power Off Protection (outputs in TRI-STATE)  
n Pinout simplifies PCB layout  
@
n Low power dissipation (23 mW 3.3V typical)  
n SOT-23 5-lead package  
n Pin compatible with SN65LVDS1  
Connection Diagram  
20161522  
(Top View)  
Order Number DS90LV011AHMF  
See NS Package Number MF05A  
Functional Diagram  
20161502  
© 2005 National Semiconductor Corporation  
DS201615  
www.national.com  
Absolute Maximum Ratings (Note 1)  
Maximum Junction  
Temperature  
+150˚C  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
ESD Ratings  
HBM (1.5 k, 100 pF)  
EIAJ (0 , 200 pF)  
CDM (0 , 0 pF)  
IEC direct (330 , 150 pF)  
9kV  
900V  
2000V  
4kV  
Supply Voltage (VDD  
)
−0.3V to +4V  
−0.3V to +3.6V  
−0.3V to +3.9V  
24mA  
LVCMOS input voltage (TTL IN)  
LVDS output voltage (OUT )  
LVDS output short circuit current  
@
Maximum Package Power Dissipation +25˚C  
Recommended Operating  
Conditions  
MF Package  
902 mW  
Derate MF Package  
Thermal resistance (θJA  
Storage Temperature  
7.22 mW/˚C above +25˚C  
138.5˚C/Watt  
Min  
Typ  
Max  
Units  
V
)
Supply Voltage (VDD  
)
3.0  
3.3  
3.6  
−65˚C to +150˚C  
Temperature (TA)  
−40  
+25 +125  
˚C  
Lead Temperature Range Soldering  
(4 sec.)  
+260˚C  
Electrical Characteristics  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3, 8)  
Symbol  
|VOD  
Parameter  
Output Differential Voltage  
VOD Magnitude Change  
Offset Voltage  
Conditions  
Pin  
Min  
Typ  
350  
3
Max  
Units  
|
RL = 100Ω  
OUT+,  
OUT−  
250  
450  
35  
mV  
mV  
V
(Figure 1 and Figure 2)  
VOD  
VOS  
RL = 100Ω  
(Figure 1)  
1.125  
0
1.22  
1
1.375  
25  
VOS  
IOFF  
IOS  
Offset Magnitude Change  
Power-off Leakage  
Output Short Circuit Current  
(Note 4)  
mV  
µA  
mA  
VOUT = 3.6V or GND, VDD = 0V  
VOUT+ and VOUT− = 0V  
1
10  
−6  
−24  
IOSD  
Differential Output Short Circuit  
Current (Note 4)  
VOD = 0V  
−5  
3
−12  
mA  
COUT  
VIH  
VIL  
Output Capacitance  
Input High Voltage  
pF  
V
TTL IN  
2.0  
VDD  
0.8  
10  
Input Low Voltage  
GND  
V
IIH  
Input High Current  
VIN = 3.3V or 2.4V  
VIN = GND or 0.5V  
ICL = −18 mA  
2
1
µA  
µA  
V
IIL  
Input Low Current  
10  
VCL  
CIN  
IDD  
Input Clamp Voltage  
Input Capacitance  
−1.5  
−0.6  
3
pF  
mA  
mA  
Power Supply Current  
No Load  
VIN = VDD or GND  
VDD  
5
8
RL = 100Ω  
7
10  
Switching Characteristics  
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (Notes 3, 5, 6, 7)  
Symbol  
tPHLD  
tPLHD  
tSKD1  
tSKD3  
tSKD4  
tTLH  
Parameter  
Conditions  
Min  
0.3  
0.3  
0
Typ  
1.0  
1.1  
0.1  
0.2  
0.4  
0.5  
0.5  
250  
Max  
1.5  
1.5  
0.7  
1.0  
1.2  
1.0  
1.0  
Units  
ns  
Differential Propagation Delay High to Low  
Differential Propagation Delay Low to High  
Differential Pulse Skew |tPHLD − tPLHD| (Note 9)  
Differential Part to Part Skew (Note 10)  
Differential Part to Part Skew (Note 11)  
Transition Low to High Time  
RL = 100, CL = 15 pF  
(Figure 3 and Figure 4)  
ns  
ns  
0
ns  
0
ns  
0.2  
0.2  
200  
ns  
tTHL  
Transition High to Low Time  
ns  
fMAX  
Maximum Operating Frequency (Note 12)  
MHz  
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices  
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.  
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V  
.
OD  
Note 3: All typicals are given for: V  
= +3.3V and T = +25˚C.  
A
DD  
www.national.com  
2
Switching Characteristics (Continued)  
Note 4: Output short circuit current (I ) is specified as magnitude only, minus sign indicates direction only.  
OS  
Note 5: These parameters are guaranteed by design. The limits are based on statistical analysis of the device performance over PVT (process, voltage,  
temperature) ranges.  
Note 6: C includes probe and fixture capacitance.  
L
Note 7: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z = 50, t 1 ns, t 1 ns (10%-90%).  
O
r
f
Note 8: The DS90LV011AH is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs.  
Note 9: t , |t − t |, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of  
SKD1 PHLD  
PLHD  
the same channel.  
Note 10: t , Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This  
SKD3  
specification applies to devices at the same V  
and within 5˚C of each other within the operating temperature range.  
DD  
Note 11: t , part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended  
SKD4  
operating temperature and voltage ranges, and across process distribution. t  
is defined as |Max − Min| differential propagation delay.  
SKD4  
<
>
Note 12: f  
generator input conditions: t = t  
1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, V  
250mV. The  
and t ).  
MAX  
r
f
OD  
TLH  
parameter is guaranteed by design. The limit is based on the statistical analysis of the device over the PVT range by the transitions times (t  
THL  
Parameter Measurement Information  
20161503  
FIGURE 1. Differential Driver DC Test Circuit  
20161524  
FIGURE 2. Differential Driver Full Load DC Test Circuit  
20161504  
FIGURE 3. Differential Driver Propagation Delay and Transition Time Test Circuit  
3
www.national.com  
Parameter Measurement Information (Continued)  
20161505  
FIGURE 4. Differential Driver Propagation Delay and Transition Time Waveforms  
Application Information  
TABLE 1. Device Pin Descriptions  
Pin Name  
Package Pin Number  
Description  
SOT23  
5
4
3
2
1
TTL IN  
OUT+  
OUT−  
GND  
VDD  
LVTTL/LVCMOS driver input pins  
Non-inverting driver output pin  
Inverting driver output pin  
Ground pin  
Power supply pin, +3.3V 0.3V  
No connect  
NC  
www.national.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
5-Lead SOT23, JEDEC MO-178, 1.6mm  
Order Number DS90LV011AHMF  
NS Package Number MF05A  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
Leadfree products are RoHS compliant.  
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