DS90LV011AHMF/NOPB [NSC]
IC LINE DRIVER, PDSO5, 1.60 MM, GREEN, MO-178, SOT-23, 5 PIN, Line Driver or Receiver;
| 型号： | DS90LV011AHMF/NOPB |
| 厂家： | 
National Semiconductor |
| 描述： | IC LINE DRIVER, PDSO5, 1.60 MM, GREEN, MO-178, SOT-23, 5 PIN, Line Driver or Receiver 驱动器 |
| 文件： | 总6页 (文件大小：144K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
May 2002
DS90LV011A
3V LVDS Single High Speed Differential Driver
General Description
Features
n Conforms to TIA/EIA-644-A Standard
The DS90LV011A is a single LVDS driver device optimized
for high data rate and low power applications. The
DS90LV011A is a current mode driver allowing power dissi-
pation to remain low even at high frequency. In addition, the
short circuit fault current is also minimized. The device is
designed to support data rates in excess of 400Mbps
(200MHz) utilizing Low Voltage Differential Signaling (LVDS)
technology.
>
n
400Mbps (200MHz) switching rates
n 700 ps (100 ps typical) maximum differential skew
n 1.5 ns maximum propagation delay
n Single 3.3V power supply
n
350 mV differential signaling
n Power Off Protection (outputs in TRI-STATE)
n Pinout simplifies PCB layout
n Low power dissipation (23 mW 3.3V typical)
The device is in both a 5-lead small outline transistor pack-
age and a new LLP-8 package with a 3mm x 3mm body size.
The LVDS outputs have been arranged for easy PCB layout.
The differential driver outputs provide low EMI with its typical
low output swing of 350 mV. The DS90LV011A can be paired
with its companion single line receiver, the DS90LV012A, or
with any of National’s LVDS receivers, to provide a high-
speed LVDS interface.
@
n SOT-23 5-lead package
n Leadless LLP-8 package (3x3 mm body size)
n SOT-23 version pin compatible with SN65LVDS1
n Fabricated with advanced CMOS process technology
n Industrial temperature operating range
(−40˚C to +85˚C)
Connection Diagrams
20014922
(Top View)
Order Number DS90LV011ATMF
See NS Package Number MF05A
20014923
(Top View)
Order Number DS90LV011ATLD
See NS Package Number LDA08A
Functional Diagram
20014902
© 2002 National Semiconductor Corporation
DS200149
www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Lead Temperature Range Soldering
(4 sec.)
+260˚C
+150˚C
Maximum Junction
Temperature
Supply Voltage (VDD
)
−0.3V to +4V
−0.3V to +3.6V
−0.3V to +3.9V
24mA
ESD Ratings
LVCMOS input voltage (TTL IN)
LVDS output voltage (OUT )
LVDS output short circuit current
HBM (1.5 kΩ, 100 pF)
EIAJ (0 Ω, 200 pF)
CDM (0 Ω, 0 pF)
≥ 9kV
≥ 900V
≥ 2000V
≥ 4kV
@
Maximum Package Power Dissipation +25˚C
IEC direct (330 Ω, 150 pF)
LDA Package
2.26 W
Derate LDA Package
Thermal resistance (θJA
MF Package
18.1 mW/˚C above +25˚C
55.3˚C/Watt
Recommended Operating
Conditions
)
902 mW
Min
Typ
Max
3.6
Units
V
Derate MF Package
Thermal resistance (θJA
Storage Temperature
7.22 mW/˚C above +25˚C
138.5˚C/Watt
Supply Voltage (VDD
)
3.0
3.3
)
Temperature (TA)
−40
+25
+85
˚C
−65˚C to +150˚C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3, 8)
Symbol
|VOD
Parameter
Output Differential Voltage
VOD Magnitude Change
Offset Voltage
Conditions
Pin
Min
Typ
350
3
Max
Units
|
RL = 100Ω
OUT+,
OUT−
250
450
35
mV
mV
V
(Figure 1 and Figure 2)
∆VOD
VOS
RL = 100Ω
(Figure 1)
1.125
0
1.22
1
1.375
25
∆VOS
IOFF
IOS
Offset Magnitude Change
Power-off Leakage
Output Short Circuit Current
(Note 4)
mV
µA
mA
VOUT = 3.6V or GND, VDD = 0V
VOUT+ and VOUT− = 0V
1
10
−6
−24
IOSD
Differential Output Short Circuit
Current (Note 4)
VOD = 0V
−5
3
−12
mA
COUT
VIH
VIL
Output Capacitance
Input High Voltage
pF
V
TTL IN
2.0
VDD
0.8
10
Input Low Voltage
GND
V
IIH
Input High Current
VIN = 3.3V or 2.4V
VIN = GND or 0.5V
ICL = −18 mA
2
1
µA
µA
V
IIL
Input Low Current
10
VCL
CIN
IDD
Input Clamp Voltage
Input Capacitance
−1.5
−0.6
3
pF
mA
mA
Power Supply Current
No Load
VIN = VDD or GND
VDD
5
8
RL = 100Ω
7
10
Switching Characteristics
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (Notes 3, 5, 6, 7)
Symbol
tPHLD
tPLHD
tSKD1
tSKD3
tSKD4
tTLH
Parameter
Conditions
Min
0.3
0.3
0
Typ
1.0
1.1
0.1
0.2
0.4
0.5
0.5
250
Max
1.5
1.5
0.7
1.0
1.2
1.0
1.0
Units
ns
Differential Propagation Delay High to Low
Differential Propagation Delay Low to High
Differential Pulse Skew |tPHLD − tPLHD| (Note 9)
Differential Part to Part Skew (Note 10)
Differential Part to Part Skew (Note 11)
Transition Low to High Time
RL = 100Ω, CL = 15 pF
(Figure 3 and Figure 4)
ns
ns
0
ns
0
ns
0.2
0.2
200
ns
tTHL
Transition High to Low Time
ns
fMAX
Maximum Operating Frequency (Note 12)
MHz
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2
Switching Characteristics (Continued)
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V
.
OD
Note 3: All typicals are given for: V
= +3.3V and T = +25˚C.
A
DD
Note 4: Output short circuit current (I ) is specified as magnitude only, minus sign indicates direction only.
OS
Note 5: These parameters are guaranteed by design. The limits are based on statistical analysis of the device performance over PVT (process, voltage,
temperature) ranges.
Note 6: C includes probe and fixture capacitance.
L
Note 7: Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z = 50Ω, t ≤ 1 ns, t ≤ 1 ns (10%-90%).
O
r
f
Note 8: The DS90LV011A is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs.
Note 9: t , |t − t |, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of
SKD1 PHLD
PLHD
the same channel.
Note 10: t , Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This
SKD3
specification applies to devices at the same V
and within 5˚C of each other within the operating temperature range.
DD
Note 11: t
, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended
SKD4
operating temperature and voltage ranges, and across process distribution. t
is defined as |Max − Min| differential propagation delay.
SKD4
<
>
Note 12: f
generator input conditions: t = t
1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, V
250mV. The
and t ).
MAX
r
f
OD
TLH
parameter is guaranteed by design. The limit is based on the statistical analysis of the device over the PVT range by the transitions times (t
THL
Parameter Measurement Information
20014903
FIGURE 1. Differential Driver DC Test Circuit
20014924
FIGURE 2. Differential Driver Full Load DC Test Circuit
20014904
FIGURE 3. Differential Driver Propagation Delay and Transition Time Test Circuit
3
www.national.com
Parameter Measurement Information (Continued)
20014905
FIGURE 4. Differential Driver Propagation Delay and Transition Time Waveforms
Application Information
TABLE 1. Device Pin Descriptions
Pin Name
Package Pin Number
Description
SOT23
LLP
5
4
3
2
1
8
TTL IN
OUT+
OUT−
GND
VDD
LVTTL/LVCMOS driver input pins
Non-inverting driver output pin
Inverting driver output pin
Ground pin
1
3
7
6
Power supply pin, +3.3V 0.3V
No connect
2, 4, 5
NC
PC Board Considerations:
land pad, which is a metal (normally copper) rectangular
region located under the package, should be attached to
ground and match the dimensions of the exposed pad on the
PCB (1:1 ratio).
For PC board considerations for the LLP package, please
refer to application note AN-1187 “Leadless Leadframe
Package.” It is important to note that to optimize signal
integrity (minimize jitter and noise coupling), the LLP thermal
www.national.com
4
Physical Dimensions inches (millimeters)
unless otherwise noted
5-Lead SOT23, JEDEC MO-178, 1.6mm
Order Number DS90LV011ATMF
NS Package Number MF05A
5
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LLP-8, 3mm x 3mm Body
Order Number DS90LV011ATLD
NS Package Number LDA08A
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
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