DS90LV011AQ [TI]
Automotive LVDS Differential Driver;
| 型号： | DS90LV011AQ |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Automotive LVDS Differential Driver |
| 文件： | 总13页 (文件大小：756K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS90LV011A
www.ti.com
SNLS140C –MAY 2002–REVISED APRIL 2013
DS90LV011A 3V LVDS Single High Speed Differential Driver
Check for Samples: DS90LV011A
1
FEATURES
DESCRIPTION
The DS90LV011A is a single LVDS driver device
optimized for high data rate and low power
applications. The DS90LV011A is a current mode
driver allowing power dissipation to remain low even
at high frequency. In addition, the short circuit fault
current is also minimized. The device is designed to
support data rates in excess of 400Mbps (200MHz)
utilizing Low Voltage Differential Signaling (LVDS)
technology.
2
•
•
•
Conforms to TIA/EIA-644-A Standard
>400Mbps (200MHz) Switching Rates
700 ps (100 ps Typical) Maximum Differential
Skew
•
•
•
•
•
•
1.5 ns Maximum Propagation Delay
Single 3.3V Power Supply
±350 mV Differential Signaling
Power Off Protection (Outputs in TRI-STATE)
Pinout Simplifies PCB Layout
The device is in a 5-lead SOT-23 package. The
LVDS outputs have been arranged for easy PCB
layout. The differential driver outputs provide low EMI
with its typical low output swing of 350 mV. The
DS90LV011A can be paired with its companion single
line receiver, the DS90LV012A, or with any of TI's
LVDS receivers, to provide a high-speed LVDS
interface.
Low Power Dissipation (23 mW @ 3.3V
Typical)
•
•
SOT-23 5-Lead Package
SOT-23 Version Pin Compatible with
SN65LVDS1
•
•
Fabricated with Advanced CMOS Process
Technology
Connection Diagram
Industrial Temperature Operating Range
–
(−40°C to +85°C)
Figure 1. Top View
See Package Number DBV (R-PDSO-G5)
Functional Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
DS90LV011A
SNLS140C –MAY 2002–REVISED APRIL 2013
www.ti.com
Absolute Maximum Ratings(1)
Supply Voltage (VDD
)
−0.3V to +4V
−0.3V to +3.6V
−0.3V to +3.9V
24mA
LVCMOS input voltage (TTL IN)
LVDS output voltage (OUT±)
LVDS output short circuit current
Maximum Package Power Dissipation @ +25°C
DBV Package
902 mW
7.22 mW/°C above +25°C
138.5°C/Watt
Derate DBV Package
Thermal Resistance (θJA
)
Storage Temperature
−65°C to +150°C
+260°C (4 sec.)
Lead Temperature – Soldering
Maximum Junction Temperature
ESD Ratings
+150°C
HBM (1.5 kΩ, 100 pF)
EIAJ (0 Ω, 200 pF)
≥ 9kV
≥ 900V
≥ 2000V
≥ 4kV
CDM (0 Ω, 0 pF)
IEC direct (330 Ω, 150 pF)
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
Recommended Operating Conditions
Min
3.0
-40
Typ
3.3
Max
3.6
Units
V
Supply Voltage (VDD
)
Temperature (TA)
+25
+85
°C
2
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Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV011A
DS90LV011A
www.ti.com
SNLS140C –MAY 2002–REVISED APRIL 2013
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)(3)
Symbol
Parameter
Output Differential Voltage
VOD Magnitude Change
Offset Voltage
Conditions
Pin
Min
Typ
350
3
Max
450
35
Units
mV
mV
V
|VOD
|
ΔVOD
VOS
RL = 100Ω
OUT+,
OUT−
250
(Figure 2 and Figure 3)
RL = 100Ω
(Figure 2)
1.125
0
1.22
1
1.375
25
ΔVOS
IOFF
Offset Magnitude Change
mV
μA
Power-off Leakage
Output Short Circuit Current(4)
VOUT = 3.6V or GND, VDD = 0V
VOUT+ and VOUT− = 0V
VOD = 0V
±1
±10
−24
−12
IOS
−6
−5
mA
mA
IOSD
Differential Output Short Circuit
Current(4)
COUT
VIH
VIL
Output Capacitance
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
Input Clamp Voltage
Input Capacitance
Power Supply Current
3
pF
V
TTL IN
2.0
VDD
0.8
GND
V
IIH
VIN = 3.3V or 2.4V
VIN = GND or 0.5V
ICL = −18 mA
±2
±1
−0.6
3
±10
±10
μA
μA
V
IIL
VCL
CIN
IDD
−1.5
pF
mA
mA
No Load
VIN = VDD or GND
VDD
5
8
RL = 100Ω
7
10
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD
.
(2) All typicals are given for: VDD = +3.3V and TA = +25°C.
(3) The DS90LV011A is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers
outputs.
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
Switching Characteristics
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified.(1)(2)(3)(4)
Symbol
tPHLD
Parameter
Conditions
RL = 100Ω, CL = 15 pF
(Figure 4 and Figure 5)
Min
0.3
0.3
0
Typ
1.0
1.1
0.1
0.2
0.4
0.5
0.5
250
Max
1.5
1.5
0.7
1.0
1.2
1.0
1.0
Units
ns
Differential Propagation Delay High to Low
tPLHD
tSKD1
tSKD3
tSKD4
tTLH
Differential Propagation Delay Low to High
ns
(5)
Differential Pulse Skew |tPHLD − tPLHD
Differential Part to Part Skew(6)
Differential Part to Part Skew(7)
Transition Low to High Time
|
ns
0
ns
0
ns
0.2
0.2
200
ns
tTHL
Transition High to Low Time
Maximum Operating Frequency(8)
ns
fMAX
MHz
(1) All typicals are given for: VDD = +3.3V and TA = +25°C.
(2) These parameters are specified by design. The limits are based on statistical analysis of the device performance over PVT (process,
voltage, temperature) ranges.
(3) CL includes probe and fixture capacitance.
(4) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (10%-90%).
(5) tSKD1, |tPHLD − tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
(6) tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation
delays. This specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range.
(7) tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
(8) fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD
>
250mV. The parameter is specified by design. The limit is based on the statistical analysis of the device over the PVT range by the
transitions times (tTLH and tTHL).
Copyright © 2002–2013, Texas Instruments Incorporated
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DS90LV011A
SNLS140C –MAY 2002–REVISED APRIL 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 2. Differential Driver DC Test Circuit
Figure 3. Differential Driver Full Load DC Test Circuit
Figure 4. Differential Driver Propagation Delay and Transition Time Test Circuit
Figure 5. Differential Driver Propagation Delay and Transition Time Waveforms
4
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Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV011A
DS90LV011A
www.ti.com
SNLS140C –MAY 2002–REVISED APRIL 2013
APPLICATION INFORMATION
Table 1. Device Pin Descriptions
Pin Name
Package Pin Number
Description
SOT-23
5
4
3
2
1
TTL IN
OUT+
OUT−
GND
LVTTL/LVCMOS driver input pins
Non-inverting driver output pin
Inverting driver output pin
Ground pin
VDD
Power supply pin, +3.3V ± 0.3V
Copyright © 2002–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS90LV011A
DS90LV011A
SNLS140C –MAY 2002–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 5
6
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Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV011A
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
1000
1000
(1)
(2)
(6)
(3)
(4/5)
DS90LV011ATMF
NRND
ACTIVE
SOT-23
SOT-23
DBV
5
5
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
N01
N01
DS90LV011ATMF/NOPB
DBV
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS90LV011ATMFX/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
N01
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS90LV011ATMF
SOT-23
DBV
DBV
DBV
5
5
5
1000
1000
3000
178.0
178.0
178.0
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
DS90LV011ATMF/NOPB SOT-23
DS90LV011ATMFX/NOPB SOT-23
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS90LV011ATMF
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
1000
1000
3000
210.0
210.0
210.0
185.0
185.0
185.0
35.0
35.0
35.0
DS90LV011ATMF/NOPB
DS90LV011ATMFX/NOPB
Pack Materials-Page 2
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