2SK1398 [NEC]

N-CHANNEL MOS FET FOR HIGH SPEED SWITCHING; N沟道MOS FET,用于高速开关
2SK1398
型号: 2SK1398
厂家: NEC    NEC
描述:

N-CHANNEL MOS FET FOR HIGH SPEED SWITCHING
N沟道MOS FET,用于高速开关

开关
文件: 总8页 (文件大小:54K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SK1398  
N-CHANNEL MOS FET  
FOR HIGH SPEED SWITCHING  
ORDERING INFORMATION  
DESCRIPTION  
The 2SK1398 is N-channel MOS Field Effect Transistor  
designed for a high-speed switching device in digital circuits.  
The 2SK1398 is driven by a 2.5-V power source, it is  
suitable for applications including headphone stereos  
which need power saving.  
PART NUMBER  
2SK1398  
PACKAGE  
SST  
FEATURES  
Directly driven by ICs having a 3-V power supply.  
Not necessary to consider driving current because of its high input impedance.  
Possible to reduce the number of parts by omitting the bias resistor.  
Can be used complementary with the 2SJ184.  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
GS  
DSS  
Drain to Source Voltage (V = 0 V)  
V
V
50  
±7.0  
V
V
DS  
GSS  
Gate to Source Voltage (V = 0 V)  
D(DC)  
Drain Current (DC)  
I
±100  
mA  
mA  
mW  
°C  
Drain Current (pulse) Note  
Total Power Dissipation  
Channel Temperature  
Storage Temperature  
D(pulse)  
I
±200  
T
P
250  
ch  
T
150  
stg  
T
–55 to +150  
°C  
Note PW 10 ms, Duty cycle 50 %  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. D14772EJ2V0DS00 (2nd edition)  
(Previous No. TC-2342)  
Date Published March 2000 NS CP(K)  
Printed in Japan  
The mark shows major revised points.  
1991, 2000  
©
2SK1398  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
CHARACTERISTICS  
Drain Cut-off Current  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 50 V, VGS = 0 V  
MIN. TYP. MAX. UNIT  
10  
±5.0  
1.5  
µA  
µA  
V
Gate Leakage Current  
IGSS  
VGS = ±7.0 V, VDS = 0 V  
VDS = 3.0 V, ID = 1.0 µA  
VDS = 3.0 V, ID = 10 mA  
VGS = 2.5 V, ID = 10 mA  
VGS = 4.0 V, ID = 10 mA  
VDS = 3.0 V  
Gate to Source Cut-off Voltage  
Forward Transfer Admittance  
Drain to Source On-state Resistance  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
Ciss  
0.9  
20  
1.2  
38  
22  
14  
8
mS  
40  
20  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
Coss  
VGS = 0 V  
7
Crss  
f = 1 MHz  
3
td(on)  
VDD = 3.0 V  
15  
100  
30  
35  
tr  
ID = 20 mA  
Turn-off Delay Time  
Fall Time  
td(off)  
VGS(on) = 3.0 V  
tf  
RG = 10 , RL = 150 Ω  
TEST CIRCUIT SWITCHING TIME  
D.U.T.  
V
GS  
RL  
90 %  
V
GS  
Wave Form  
VGS(on)  
10 %  
0
R
G
PG.  
VDD  
R = 10  
G
90 %  
I
D
90 %  
10 %  
I
D
V
0
GS  
10 %  
I
D
0
Wave Form  
t
r
t
d(on)  
td(off)  
t
f
τ
t
on  
toff  
τ = 1µ s  
Duty Cycle 1 %  
2
Data Sheet D14772EJ2V0DS00  
2SK1398  
TYPICAL CHARACTERISTICS (TA = 25 °C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
300  
250  
200  
150  
100  
50  
100  
80  
60  
40  
20  
0
20 40 60 80 100 120 140 160  
- Case Temperature - ˚C  
0
30  
60  
90 120 150 180  
T
C
T
A
- Ambient Temperature - ˚C  
FORWARD TRANSFER CHARACTERISTICS  
Pulsed  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
100  
10  
1
100  
80  
60  
40  
20  
Pulsed  
V
V
V
GS = 4.5 V  
GS = 4.0 V  
GS = 2.5 V  
T
A
= 150 ˚C  
75 ˚C  
25 ˚C  
25 ˚C  
0.1  
1.0  
2.0  
0
1.5  
0.5  
V
DS = 3.0 V  
0.01  
V
DS - Drain to Source Voltage - V  
2
0
1
3
4
5
6
7
V
GS  
- Gate to Source Voltage - V  
GATE TO SOURCE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
2.0  
1000  
100  
10  
V
DS = 3.0 V  
V
DS = 5.0 V  
I
D
= 1.0 µA  
f = 1 kHz  
1.5  
1.0  
0.5  
1
10  
100 200  
I
D
- Drain Current - mA  
0
50  
100  
150  
T
ch - Channel Temperature - ˚C  
3
Data Sheet D14772EJ2V0DS00  
2SK1398  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
DRAIN TO SOURCE ON-STATE RESISTANCE  
vs. DRAIN CURRENT  
30  
20  
100  
Pulsed  
Pulsed  
V
GS = 2.5 V  
V
GS = 4.0 V  
10  
ID = 100 mA  
I = 10 mA  
D
10  
1
0.1  
1
10  
100  
I
D - Drain Current - mA  
0
1
3
5
7
8
9
2
4
6
10  
V
GS - Gate to Source Voltage - V  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
25  
20  
30  
VGS = 2.5 V  
V
GS = 4.0 V  
= 5.0 mA  
ID  
= 5.0 mA  
ID  
25  
15  
10  
20  
15  
0
0
100  
ch - Channel Temperature - ˚C  
150  
100  
Tch - Channel Temperature - ˚C  
150  
50  
50  
T
CAPACITANCE vs. DRAIN TO  
SOURCE VOLTAGE  
SWITCHING CHARACTERISTICS  
1 000  
100  
100  
V
GS = 0 V  
f = 1 MHz  
t
r
t
f
t
d(off)  
d(on)  
10  
Ciss  
t
10  
1
C
oss  
V
DD = 3.0 V  
V
= 3.0 V  
C
rss  
RGGSS = 10  
1
1000  
1
10  
100  
1
10  
DS - Drain to Source Voltage - V  
100  
I
D
- Drain Current - mA  
V
4
Data Sheet D14772EJ2V0DS00  
2SK1398  
SOURCE TO DRAIN DIODE  
FORWARD VOLTAGE  
Pulsed  
V
GS = 0 V  
100  
10  
1
0.1  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
VSD - Source to Drain Voltage - V  
5
Data Sheet D14772EJ2V0DS00  
2SK1398  
PACKAGE DRAWING (Unit: mm)  
SST  
4.0±0.2  
2.0±0.2  
2
3
1
0.50 TYP.  
0.45 TYP.  
EQUIVALENT CIRCUIT  
Drain  
0.42 TYP.  
Body  
Diode  
Gate  
Gate  
Protection  
Diode  
Source  
Marking : G25  
1.27 TYP.  
1.27 TYP.  
1. Source  
2. Drain  
3. Gate  
2
3
1
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage  
exceeding the rated voltage may be applied to this device.  
6
Data Sheet D14772EJ2V0DS00  
2SK1398  
[MEMO]  
7
Data Sheet D14772EJ2V0DS00  
2SK1398  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in  
this document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property  
rights of third parties by or arising from use of a device described herein or any other liability arising from use  
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other  
intellectual property rights of NEC Corporation or others.  
Descriptions of circuits, software, and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these circuits,  
software, and information in the design of the customer's equipment shall be done under the full responsibility  
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third  
parties arising from the use of these circuits, software, and information.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a  
customer designated "quality assurance program" for a specific application. The recommended applications of  
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device  
before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
M7 98. 8  

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