2SJ598-AZ [NEC]

Small Signal Field-Effect Transistor, 12A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251, TO-251, MP-3, 3 PIN;
2SJ598-AZ
型号: 2SJ598-AZ
厂家: NEC    NEC
描述:

Small Signal Field-Effect Transistor, 12A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-251, TO-251, MP-3, 3 PIN

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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SJ598  
SWITCHING  
P-CHANNEL POWER MOS FET  
ORDERING INFORMATION  
DESCRIPTION  
The 2SJ598 is P-channel MOS Field Effect Transistor designed  
PART NUMBER  
PACKAGE  
for solenoid, motor and lamp driver.  
2SJ598  
TO-251 (MP-3)  
TO-252 (MP-3Z)  
2SJ598-Z  
FEATURES  
Low on-state resistance:  
RDS(on)1 = 130 mMAX. (VGS = –10 V, ID = –6 A)  
RDS(on)2 = 190 mMAX. (VGS = –4.0 V, ID = –6 A)  
Low Ciss: Ciss = 720 pF TYP.  
Built-in gate protection diode  
TO-251/TO-252 package  
(TO-251)  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC) (TC = 25°C)  
Drain Current (pulse) Note1  
Total Power Dissipation (TC = 25°C)  
Total Power Dissipation (TA = 25°C)  
Channel Temperature  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT  
PT  
Tch  
Tstg  
IAS  
–60  
m20  
m12  
m30  
23  
V
V
A
A
W
W
°C  
°C  
A
1.0  
150  
(TO-252)  
Storage Temperature  
–55 to +150  
–12  
Single Avalanche Current Note2  
Single Avalanche Energy Note2  
EAS  
14.4  
mJ  
Notes 1. PW 10 µs, Duty Cycle 1%  
2. Starting Tch = 25°C, VDD = –30 V, RG = 25 , VGS = –20 0 V  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. D14656EJ4V0DS00 (4th edition)  
Date Published August 2004 NS CP(K)  
Printed in Japan  
The mark  
shows major revised points.  
2000, 2001  
2SJ598  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
SYMBOL  
TEST CONDITIONS  
VDS = –60 V, VGS = 0 V  
GS = m16 V, VDS = 0 V  
MIN. TYP. MAX.  
UNIT  
µA  
µA  
V
IDSS  
–10  
V
m10  
IGSS  
Gate Cut-off Voltage  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
Ciss  
VDS = –10 V, ID = –1 mA  
VDS = –10 V, ID = –6 A  
VGS = –10 V, ID = –6 A  
VGS = –4.0 V, ID = –6 A  
VDS = –10 V  
–1.5  
5
–2.0  
11  
–2.5  
Forward Transfer Admittance  
Drain to Source On-state Resistance  
S
102  
131  
720  
150  
50  
130  
190  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
Coss  
Crss  
VGS = 0 V  
f = 1 MHz  
td(on)  
tr  
ID = –6 A  
7
VGS = –10 V  
4
ns  
Turn-off Delay Time  
Fall Time  
td(off)  
tf  
VDD = –30 V  
35  
ns  
RG = 0 Ω  
10  
ns  
Total Gate Charge  
QG  
ID = –12 A  
15  
nC  
nC  
nC  
V
Gate to Source Charge  
Gate to Drain Charge  
Body Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
QGS  
QGD  
VF(S-D)  
trr  
VDD= –48 V  
3
VGS = –10 V  
4
IF = 12 A, VGS = 0 V  
IF = 12 A, VGS = 0 V  
di/dt = 100 A/µs  
0.98  
50  
ns  
Qrr  
100  
nC  
TEST CIRCUIT 2 SWITCHING TIME  
TEST CIRCUIT 1 AVALANCHE CAPABILITY  
D.U.T.  
D.U.T.  
L
RG  
= 25 Ω  
V
GS()  
R
L
90%  
90%  
V
GS  
V
GS  
10%  
VDD  
50 Ω  
PG.  
GS = 20 0 V  
Wave Form  
0
RG  
V
PG.  
VDD  
VDS()  
90%  
BVDSS  
IAS  
V
DS  
V
0
GS()  
VDS  
10% 10%  
VDS  
0
Wave Form  
I
D
td(on)  
tr  
td(off)  
t
f
VDD  
τ
ton  
toff  
τ = 1  
µ
s
Starting Tch  
Duty Cycle 1%  
TEST CIRCUIT 3 GATE CHARGE  
D.U.T.  
IG  
= 2 mA  
RL  
PG.  
VDD  
50 Ω  
2
Data Sheet D14656EJ4V0DS  
2SJ598  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
CASE TEMPERATURE  
30  
25  
20  
15  
10  
5
100  
80  
60  
40  
20  
0
0
0
20  
40 60  
80 100 120 140 160  
20 40  
60  
80 100 120 140 160  
0
T
C
- Case Temperature - ˚C  
T
C
- Case Temperature - ˚C  
FORWARD BIAS SAFE OPERATING AREA  
–100  
–10  
PW = 10  
I
D(pulse)  
100  
µ
s
µ
s
ID(DC)  
1 ms  
Power Dissipation  
10 ms  
Limited  
Limited  
RDS(on)  
DC  
–1  
TC  
= 25˚C  
Single Pulse  
–0.1  
–0.1  
–1  
–10  
–100  
VDS - Drain to Source Voltage - V  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
R
R
th(ch-A) = 125˚C/W  
100  
10  
th(ch-C) = 5.43˚C/W  
1
0.1  
0.01  
Single Pulse  
100 1000  
µ
10  
1 m  
10 m  
100 m  
1
10  
100  
µ
PW - Pulse Width - s  
3
Data Sheet D14656EJ4V0DS  
2SJ598  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
FORWARD TRANSFER CHARACTERISTICS  
–50  
–40  
–30  
–20  
–10  
0
–100  
–10  
V
GS = –10 V  
TA  
= 55˚C  
25˚C  
–1  
–4.0 V  
75˚C  
150˚C  
–0.1  
–0.01  
V
DS = –10 V  
Pulsed  
–4  
Pulsed  
–8  
–10  
0
–2  
–4  
–6  
–5  
–1  
–2  
–3  
VGS - Gate to Source Voltage - V  
VDS - Drain to Source Voltage - V  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
100  
10  
200  
Pulsed  
150  
100  
50  
T
A
= 150˚C  
75˚C  
I = –6 A  
D
1
25˚C  
50˚C  
0.1  
VDS = –10 V  
Pulsed  
0.01  
0
–0.01  
–0.1  
0
–5  
–10  
–15  
–20  
–1  
–10  
–100  
I
D - Drain Current - A  
VGS - Gate to Source Voltage - V  
GATE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
DRAIN TO SOURCE ON-STATE  
RESISTANCE vs. DRAIN CURRENT  
–4.0  
–3.0  
300  
200  
100  
0
V
DS = –10 V  
Pulsed  
I
D
= –1 mA  
V
GS = –4.0 V  
–4.5 V  
–10 V  
–2.0  
–1.0  
0
–0.1  
–1  
–10  
–100  
–50  
0
50  
100  
150  
ID - Drain Current - A  
Tch - Channel Temperature - ˚C  
4
Data Sheet D14656EJ4V0DS  
2SJ598  
SOURCE TO DRAIN DIODE  
FORWARD VOLTAGE  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
–100  
300  
Pulsed  
Pulsed  
250  
200  
150  
100  
50  
–10  
–1  
VGS = –10 V  
VGS = –4.0 V  
0 V  
–10 V  
–0.1  
ID = –6 A  
150  
0
–0.01  
0
–1.5  
–1.0  
- Source to Drain Voltage - V  
–0.5  
100  
0
50  
50  
V
SD  
Tch - Channel Temperature - ˚C  
CAPACITANCE vs. DRAIN TO  
SOURCE VOLTAGE  
SWITCHING CHARACTERISTICS  
10000  
1000  
1000  
V
DD = –30V  
V
GS = 0 V  
R
G
= 0 Ω  
f = 1 MHz  
V
GS = –10 V  
100  
10  
1
C
iss  
t
d(off)  
t
f
100  
10  
t
d(on)  
C
oss  
rss  
t
r
C
–0.1  
–1  
–10  
–100  
–0.1  
–1  
–10  
–100  
I
D
- Drain Current - A  
V
DS - Drain to Source Voltage - V  
REVERSE RECOVERY TIME vs.  
DRAIN CURRENT  
DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
1000  
100  
–60  
–50  
–40  
–30  
–20  
–10  
0
–12  
–10  
–8  
–6  
–4  
–2  
0
µ
di/dt = 100 A/ s  
GS = 0 V  
I = –12 A  
D
V
V
GS  
V
DD = –48 V  
–30 V  
–12 V  
10  
1
V
DS  
0.1  
1
10  
100  
2
4
6
8
10 12  
14 16  
0
Q
G
- Gate Charge - nC  
I
F
- Drain Current - A  
5
Data Sheet D14656EJ4V0DS  
2SJ598  
SINGLE AVALANCHE CURRENT vs.  
INDUCTIVE LOAD  
SINGLE AVALANCHE ENERGY  
DERATING FACTOR  
–100  
–10  
160  
140  
120  
100  
80  
V
R
V
DD = –30 V  
= 25 Ω  
GS = –20 0 V  
G
I
AS –12 A  
I
AS = –12A  
EAS  
=
14.4 mJ  
60  
–1  
40  
V
DD = –30V  
= 25 Ω  
GS = –200 V  
20  
R
G
V
–0.1  
0
10  
µ
100  
µ
1m  
10m  
25  
50  
75  
100  
125  
150  
Starting Tch - Starting Channel Temperature - ˚C  
L - Inductive Load - H  
6
Data Sheet D14656EJ4V0DS  
2SJ598  
PACKAGE DRAWINGS (Unit: mm)  
1) TO-251 (MP-3)  
2) TO-252 (MP-3Z)  
2.3 0.2  
0.5 0.1  
6.5 0.2  
5.0 0.2  
4
6.5 0.2  
2.3 0.2  
0.5 0.1  
5.0 0.2  
4
1
2
3
1
2
3
1.1 0.2  
0.9  
0.8  
1.1 0.2  
MAX. MAX.  
2.3 2.3  
0.5 +00..12  
0.5 +00..21  
0.8  
1. Gate  
2.3 2.3  
2. Drain  
3. Source  
4. Fin (Drain)  
1. Gate  
2. Drain  
3. Source  
4. Fin (Drain)  
EQUIVALENT CIRCUIT  
Drain  
Body  
Diode  
Gate  
Gate  
Protection  
Diode  
Source  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage exceeding  
the rated voltage may be applied to this device.  
7
Data Sheet D14656EJ4V0DS  
2SJ598  
The information in this document is current as of August, 2004. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data  
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not  
all products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Electronics products listed in this document  
or any other liability arising from the use of such products. No license, express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
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customers or third parties arising from the use of these circuits, software and information.  
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redundancy, fire-containment and anti-failure features.  
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(Note)  
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defined above).  
M8E 02. 11-1  

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