MSC0203S [MORESEMI]

N and P-Channel Enhancement Mode Power MOS FET;
MSC0203S
型号: MSC0203S
厂家: MORE Semiconductor    MORE Semiconductor
描述:

N and P-Channel Enhancement Mode Power MOS FET

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MSC0203S  
N and P-Channel Enhancement Mode Power MOS FET  
General Features  
N-Channel  
VDS = 20V,ID = 3A  
R
DS(ON) < 65m@ VGS=4.5V  
DS(ON) < 90m@ VGS=2.5V  
R
Lead Free  
P-Channel  
VDS = -20V,ID = -3A  
R
DS(ON) < 110m@ VGS=-4.5V  
DS(ON) < 140m@ VGS=-2.5V  
R
High power and current handing capability  
Lead free product is acquired  
Surface mount package  
pin Assignment  
PIN Configuration  
N-channel  
P-channel  
SOT-23-6L top view  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
MSC0203S  
SOT-23-6L  
Ø180mm  
8mm  
3000 units  
Absolute Maximum Ratings (TA=25unless otherwise noted)  
Parameter  
Symbol  
VDS  
N-Channel P-Channel  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
20  
-20  
±12  
VGS  
±12  
V
TA=25℃  
TA=70℃  
3
2.4  
-3  
Continuous Drain Current  
ID  
A
-2.4  
Pulsed Drain Current (Note 1)  
Maximum Power Dissipation  
IDM  
PD  
13  
-13  
A
TA=25℃  
0.8  
0.8  
W
Operating Junction and Storage Temperature Range  
TJ,TSTG  
-55 To 150  
-55 To 150  
Thermal Characteristic  
Thermal Resistance,Junction-to-Ambient (Note2)  
RθJA  
RθJA  
N-Ch  
P-Ch  
156  
156  
/W  
/W  
Thermal Resistance,Junction-to-Ambient (Note2)  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
1/10  
MSC0203S  
N-CH Electrical Characteristics (TA=25unless otherwise noted)  
Parameter  
Symbol  
Condition  
Min Typ  
Max  
Unit  
Off Characteristics  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
On Characteristics (Note 3)  
BVDSS  
IDSS  
VGS=0V ID=250μA  
VDS=20V,VGS=0V  
VGS=±12V,VDS=0V  
20  
-
22  
-
-
1
V
μA  
nA  
IGSS  
-
-
±100  
Gate Threshold Voltage  
VGS(th)  
RDS(ON)  
gFS  
VDS=VGS,ID=250μA  
VGS=2.5V, ID=2.8A  
VGS=4.5V, ID=3A  
VDS=5V,ID=3A  
0.5  
0.75  
35  
29  
8
1.2  
90  
65  
-
V
mΩ  
mΩ  
S
-
-
-
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic Characteristics (Note4)  
Input Capacitance  
Clss  
Coss  
Crss  
-
-
-
260  
48  
-
-
-
PF  
PF  
PF  
V
DS=10V,VGS=0V,  
F=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics (Note 4)  
Turn-on Delay Time  
27  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
2.5  
3.2  
21  
-
-
nS  
nS  
nS  
nS  
nC  
nC  
nC  
Turn-on Rise Time  
VDD=10V, RL=3.3Ω  
VGS=4.5V,RGEN=6Ω  
Turn-Off Delay Time  
-
Turn-Off Fall Time  
3
-
Total Gate Charge  
Qg  
Qgs  
Qgd  
2.9  
0.4  
0.6  
5
-
VDS=10V,ID=3A,  
Gate-Source Charge  
V
GS=4.5V  
Gate-Drain Charge  
-
Drain-Source Diode Characteristics  
Diode Forward Voltage (Note 3)  
Diode Forward Current (Note 2)  
VSD  
IS  
VGS=0V,IS=3 A  
-
-
-
-
1.2  
3
V
A
Notes:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature.  
2. Surface Mounted on FR4 Board, t 10 sec.  
3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%.  
4. Guaranteed by design, not subject to production  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
2/10  
MSC0203S  
P-CH Electrical Characteristics (TA=25unless otherwise noted  
Parameter  
Symbol  
Condition  
Min Typ Max  
Unit  
Off Characteristics  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
On Characteristics (Note 3)  
BVDSS  
IDSS  
VGS=0V ID=-250μA  
VDS=-20V,VGS=0V  
VGS=±12V,VDS=0V  
-20  
-
V
-
-
-
-
-1  
μA  
nA  
IGSS  
±100  
Gate Threshold Voltage  
VGS(th)  
RDS(ON)  
gFS  
VDS=VGS,ID=-250μA  
VGS=-4.5V, ID=-2.5 A  
VGS=-2.5V, ID=-2A  
VDS=-5V,ID=-2.5A  
-0.4  
-0.7  
78  
-1  
110  
140  
-
V
mΩ  
mΩ  
S
-
-
-
Drain-Source On-State Resistance  
102  
9.5  
Forward Transconductance  
Dynamic Characteristics (Note4)  
Input Capacitance  
Clss  
Coss  
Crss  
-
-
-
325  
63  
-
-
-
PF  
PF  
PF  
VDS=-10V,VGS=0V,  
Output Capacitance  
F=1.0MHz  
Reverse Transfer Capacitance  
Switching Characteristics (Note 4)  
Turn-on Delay Time  
37  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
11  
5.5  
22  
8
-
-
-
-
-
-
-
nS  
nS  
nS  
nS  
nC  
nC  
nC  
Turn-on Rise Time  
VDD=-10V, RL=5Ω  
VGS=-4.5V,RGEN=3Ω  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Qg  
Qgs  
Qgd  
3.2  
0.6  
0.9  
VDS=-10V,ID=-2A,  
Gate-Source Charge  
VGS=-4.5V  
Gate-Drain Charge  
Drain-Source Diode Characteristics  
Diode Forward Voltage (Note 3)  
Diode Forward Current (Note 2)  
VSD  
IS  
VGS=0V,IS=-3A  
-
-
-
-
-1.2  
-3  
V
A
Notes:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature.  
2. Surface Mounted on FR4 Board, t 10 sec.  
3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%.  
4. Guaranteed by design, not subject to production  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
3/10  
MSC0203S  
N- Channel Typical Electrical and Thermal Characteristics (Curves)  
Vdd  
ton  
tr  
toff  
tf  
td(on)  
VOUT  
VIN  
td(off)  
Rl  
Vin  
90%  
90%  
D
Vout  
Vgs  
INVERTED  
Rgen  
10%  
90%  
G
10%  
50%  
S
50%  
10%  
PULSE WIDTH  
Figure 1:Switching Test Circuit  
Figure 2:Switching Waveforms  
TJ-Junction Temperature()  
TJ-Junction Temperature()  
Figure 3 Power Dissipation  
Figure 4 Drain Current  
Vds Drain-Source Voltage (V)  
ID- Drain Current (A)  
Figure 5 Output Characteristics  
Figure 6 Drain-Source On-Resistance  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
4/10  
MSC0203S  
Vgs Gate-Source Voltage (V)  
TJ-Junction Temperature()  
Figure 7 Transfer Characteristics  
Figure 8 Drain-Source On-Resistance  
Vgs Gate-Source Voltage (V)  
Vds Drain-Source Voltage (V)  
Figure 9 Rdson vs Vgs  
Figure 10 Capacitance vs Vds  
Qg Gate Charge (nC)  
Vsd Source-Drain Voltage (V)  
Figure 11 Gate Charge  
Figure 12 Source- Drain Diode Forward  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
5/10  
MSC0203S  
Vds Drain-Source Voltage (V)  
Figure 13 Safe Operation Area  
Square Wave Pluse Duration(sec)  
Figure 14 Normalized Maximum Transient Thermal Impedance  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
6/10  
MSC0203S  
P- Channel Typical Electrical and Thermal Characteristics (Curves)  
ton  
toff  
tf  
tr  
td(on)  
td(off)  
90%  
90%  
VOUT  
INVERTED  
10%  
90%  
10%  
50%  
VIN  
50%  
10%  
PULSE WIDTH  
Figure 1:Switching Test Circuit  
Figure 2:Switching Waveforms  
TJ-Junction Temperature()  
TJ-Junction Temperature()  
Figure 3 Power Dissipation  
Figure 4 Drain Current  
-Vds Drain-Source Voltage (V)  
-ID- Drain Current (A)  
Figure 5 Output Characteristics  
Figure 6 Drain-Source On-Resistance  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
7/10  
MSC0203S  
-Vgs Gate-Source Voltage (V)  
TJ-Junction Temperature()  
Figure 7 Transfer Characteristics  
Figure 8 Drain-Source On-Resistance  
-Vgs Gate-Source Voltage (V)  
-Vds Drain-Source Voltage (V)  
Figure 9 Rdson vs Vgs  
Figure 10 Capacitance vs Vds  
Qg Gate Charge (nC)  
-Vsd Source-Drain Voltage (V)  
Figure 11 Gate Charge  
Figure 12 Source- Drain Diode Forward  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
8/10  
MSC0203S  
-Vds Drain-Source Voltage (V)  
Figure 13 Safe Operation Area  
Square Wave Pluse Duration(sec)  
Figure 14 Normalized Maximum Transient Thermal Impedance  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
9/10  
MSC0203S  
SOT-23-6L Package Information  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
10/10  

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