MSC040SMA120B4 [MICROSEMI]

Power Field-Effect Transistor,;
MSC040SMA120B4
型号: MSC040SMA120B4
厂家: Microsemi    Microsemi
描述:

Power Field-Effect Transistor,

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MSC040SMA120B4 Silicon Carbide N-Channel Power MOSFET  
1
Product Overview  
The silicon carbide (SiC) power MOSFET product line from Microsemi increases the performance over  
silicon MOSFET and silicon IGBT solutions while lowering the total cost of ownership for high-voltage  
applications. The MSC040SMA120B4 device is a 1200 V, 40 mΩ SiC MOSFET in a TO-247 4-lead package  
with a source sense.  
1.1  
Features  
The following are key features of the MSC040SMA120B4 device:  
Low capacitances and low gate charge  
Fast switching speed due to low internal gate resistance (ESR)  
Stable operation at high junction temperature, TJ(max) = 175 °C  
Fast and reliable body diode  
Superior avalanche ruggedness  
RoHS compliant  
1.2  
1.3  
Benefits  
The following are benefits of the MSC040SMA120B4 device:  
High efficiency to enable lighter, more compact system  
Simple to drive and easy to parallel  
Improved thermal capabilities and lower switching losses  
Eliminates the need for external freewheeling diode  
Lower system cost of ownership  
Applications  
The MSC040SMA120B4 device is designed for the following applications:  
PV inverter, converter, and industrial motor drives  
Smart grid transmission and distribution  
Induction heating and welding  
H/EV powertrain and EV charger  
Power supply and distribution  
050-7754 MSC040SMA120B4 Datasheet Revision A  
1
2
Device Specifications  
This section shows the specifications for the MSC040SMA120B4 device.  
2.1  
Absolute Maximum Ratings  
The following table shows the absolute maximum ratings for the MSC040SMA120B4 device.  
Table 1 • Absolute Maximum Ratings  
Symbol  
VDSS  
Parameter  
Ratings  
1200  
66  
Unit  
V
Drain source voltage  
ID  
Continuous drain current at TC = 25 °C  
Continuous drain current at TC = 100 °C  
Pulsed drain current 1  
A
46  
IDM  
VGS  
PD  
105  
Gate-source voltage  
23 to -10  
323  
V
Total power dissipation at TC = 25 °C  
Linear derating factor  
W
2.15  
W/°C  
Note:  
1. Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.  
The following table shows the thermal and mechanical characteristics for the MSC040SMA120B4 device.  
Table 2 • Thermal and Mechanical Characteristics  
Symbol  
RθJC  
TJ  
Characteristic  
Min  
Typ  
Max  
0.47  
175  
150  
260  
10  
Unit  
°C/W  
°C  
Junction-to-case thermal resistance  
Operating junction temperature  
Storage temperature  
0.31  
–55  
–55  
TSTG  
TL  
Soldering temperature for 10 seconds (1.6 mm from case)  
Mounting torque, 6-32 or M3 screw  
lbf-in  
N-m  
oz  
1.1  
Wt  
Package weight  
0.22  
6.2  
g
050-7754 MSC040SMA120B4 Datasheet Revision A  
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2.2  
Electrical Performance  
The following table shows the static characteristics for the MSC040SMA120B4 device. TJ = 25 °C unless  
otherwise specified.  
Table 3 • Static Characteristics  
Symbol  
Characteristic  
Test Conditions  
Min  
Typ  
Max  
50  
Unit  
V
V(BR) DSS  
Drain-source breakdown  
voltage  
VGS = 0 V, ID = 100 µA  
1200  
RDS(on)  
Drain-source on resistance 1  
Gate-source threshold voltage  
Threshold voltage coefficient  
Zero gate voltage drain current  
VGS = 20 V, ID = 40 A  
VGS = VDS, ID = 2 mA  
VGS = VDS, ID = 2 mA  
VDS = 1200 V, VGS = 0 V  
40  
mΩ  
V
VGS(th)  
1.8  
2.6  
–4.5  
ΔVGS(th) / ΔTJ  
IDSS  
mV/°C  
µA  
100  
500  
VDS = 1200 V, VGS = 0 V  
TJ = 125 °C  
IGSS  
Gate-source leakage current  
VGS = 20 V / –10 V  
±100  
nA  
Note:  
1. Pulse test: pulse width < 380 µs, duty cycle < 2%.  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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The following table shows the dynamic characteristics for the MSC040SMA120B4 device. TJ = 25 °C  
unless otherwise specified.  
Table 4 • Dynamic Characteristics  
Symbol  
Ciss  
Characteristic  
Test Conditions  
Min  
Typ  
1990  
17  
Max  
Unit  
pF  
Input capacitance  
VGS = 0 V  
VDD = 1000 V  
VAC = 25 mV  
ƒ = 1 MHz  
Crss  
Reverse transfer capacitance  
Output capacitance  
Coss  
156  
Qg  
Total gate charge  
VGS = –5 V/20 V  
VDD = 800 V  
ID = 40 A  
137  
29  
31  
10  
8
nC  
ns  
Qgs  
Qgd  
td(on)  
tr  
Gate-source charge  
Gate-drain charge  
Turn-on delay time  
VDD = 800 V  
VGS = -5 V/20 V  
ID = 40 A  
Current rise time  
td(off)  
tf  
Turn-off delay time  
35  
20  
550  
84  
10  
10  
25  
15  
280  
85  
1.2  
3
RG (ext) = 4 Ω1  
Freewheeling diode =  
MSC040SMA120B4  
Current fall time  
Eon  
Eoff  
td(on)  
tr  
Turn-on switching energy 2  
Turn-off switching energy  
Turn-on delay time  
µJ  
ns  
VDD = 800 V  
VGS = -5 V/20 V  
ID = 40 A  
RG (ext) = 4 Ω1  
Current rise time  
td(off)  
tf  
Turn-off delay time  
Freewheeling diode =  
MSC015SDA120B  
Current fall time  
Eon  
Eoff  
ESR  
SCWT  
EAS  
Turn-on switching energy 2  
Turn-off switching energy  
Equivalent series resistance  
Short circuit withstand time  
Avalanche energy, single pulse  
µJ  
f = 1 MHz, 25 mV, drain short  
VDS = 960 V, VGS = 20 V  
Ω
µs  
mJ  
VDS = 145 V, VGS = 20 V,  
ID = 40 A  
2000  
Notes:  
1. RG is total gate resistance excluding internal gate driver impedance.  
2. Eon includes energy of freewheeling diode.  
The following table shows the body diode characteristics for the MSC040SMA120B4 device. TJ = 25 °C  
unless otherwise specified.  
Table 5 • Body Diode Characteristics  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
3.9  
Max  
Unit  
V
VSD  
Diode forward voltage  
ISD = 40 A, VGS = 0 V  
ISD = 40 A, VGS = –5 V  
4.1  
V
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
ISD = 40 A, VGS = –5 V  
VDD = 800 V  
100  
550  
12.5  
ns  
nC  
A
Qrr  
IRRM  
dl/dt = –1000 A/µs  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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2.3  
Typical Performance Curves  
This section shows the typical performance curves for the MSC040SMA120B4 device.  
Figure 1 • Drain Current vs. Drain-to-Source Voltage Figure 2 • Drain Current vs. Drain-to-Source Voltage.  
Figure 3 • Drain Current vs. Drain-to-Source Voltage  
Figure 4 • Drain Current vs. Drain-to-Source Voltage  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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Figure 5 • RDS(on) vs. Junction Temperature  
Figure 7 • Capacitance vs. Drain-to-Source Voltage  
Figure 9 • IDM vs. VDS Third Quadrant Conduction  
Figure 6 • Gate Charge Characteristics  
Figure 8 • IDM vs. Gate-to-Source Voltage  
Figure 10 • IDM vs. VDS Third Quadrant Conduction  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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Figure 11 • VGS(th) vs. Junction Temperature  
Figure 12 • Forward Safe Operating Area  
Figure 13 • Maximum Transient Thermal Impedance  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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3
Package Specification  
This section shows the package specification for the MSC040SMA120B4 device.  
3.1  
Package Outline Drawing  
The following figure illustrates the TO-247 4-lead package outline of the MSC040SMA120B4 device.. The  
dimensions in the figure below are in millimeters and (inches).  
Figure 14 • Package Outline Drawing  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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The following table shows the TO-247 4-lead dimensions and should be used in conjunction with the  
package outline drawing.  
Table 6 • TO-247-4L Dimensions  
Symbol  
Min (mm)  
4.90  
Max (mm)  
5.17  
Min (in.)  
0.193  
Max (in.)  
0.204  
0.083  
0.099  
0.027  
0.226  
0.144  
A
B
1.85  
2.11  
0.073  
C
2.25  
2.51  
0.089  
D
0.55  
0.68  
0.022  
E
5.49  
5.74  
0.216  
F
3.56  
3.66  
0.140  
G
6.15 BSC  
20.83  
19.81  
1.07  
0.242 BSC  
0.820  
H
21.08  
20.32  
1.33  
0.830  
0.800  
0.052  
0.631  
0.557  
0.663  
0.108  
0.295  
I
0.780  
J
0.042  
K
15.77  
13.89  
16.25  
2.00  
16.03  
14.15  
16.85  
2.75  
0.621  
L
0.547  
M
0.640  
N
0.079  
O
7.10  
7.50  
0.280  
P
2.87 BSC  
5.08 BSC  
2.54 BSC  
Drain  
0.113 BSC  
0.200 BSC  
0.100 BSC  
Q
R
Terminal 1  
Terminal 2  
Terminal 3  
Terminal 4  
Terminal 5  
Source  
Source sense  
Gate  
Drain  
050-7754 MSC040SMA120B4 Datasheet Revision A  
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Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services  
for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The  
products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with  
mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and  
complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data  
and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any  
products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the  
entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights,  
licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this  
document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products  
and services at any time without notice.  
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marks are the property of their respective owners.  
050-7754 | September 2019 | Preliminary  
050-7754 MSC040SMA120B4 Datasheet Revision A  
10  

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