LSIR9353 [LIGITEK]
INFRARED EMITTING DIODES; 红外发光二极管
| 型号： | LSIR9353 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | INFRARED EMITTING DIODES |
| 文件： | 总7页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
INFRARED EMITTING DIODES
LSIR9353
DATA SHEET
DOC. NO : QW0905-LSIR9353
C
REV.
:
DATE
:
- 2007
30 - May
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LSIR9353
Package Dimensions
6.0MIN
3.0
6.0MIN
0.5
2.2
1.5
-
+
-
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Features:
1. High radiant intensity.
2. Suitable for pulsed applications.
3. Low average degradation.
Descriptions:
The LSIR9353 series are super-high efficiency Gallium Aluminum Arsenide infrared
emitting diodes encapsulated in water clear plastic T-1 3/4 package individually
Device Selection Guide:
PART NO
LSIR9353
MATERIAL
LENS COLOR
Water Clear
AlGaAs/GaAs
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/6
PART NO. LSIR9353
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
UNIT
mW
Parameter
SIR
100
Power Dissipation
PD
IFP
Peak Forward Current
(300PPS,10μs Pulse)
1
50
A
mA
V
IF
Forward Current
Reverse Voltage
5
Vr
Electrostatic Discharge
Operating Temperature
Storage Temperature
ESD
Topr
Tstg
2000
-40 ~ +85
-40 ~ +85
V
℃
℃
Max 260℃ for 3 sec Max
Soldering Temperature
Tsol
(2mm from body)
Electrical Optical Characteristics (Aa=25℃)
Typ.
1.0
Max.
PARAMETER
Radiant Intensity
SYMBOL Min.
UNIT
mW/sr
mW/cm2
nm
TEST CONDITION
0.5
Le
Ee
IF=20mA
IF=20mA
IF=20mA
IF=20mA
IF=20mA
VR=5V
Aperture Radiant Incidence
Peak Emission Wavelength
Spectral Line Half Width
Forward Voltage
0.07 0.14
λpeak
△λ
VF
880
50
nm
1.4
1.7
V
Reverse Current
μA
100
IR
Viewing Angle
deg
2θ1/2
120
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The radiant intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSIR9353
Page 3/6
Typical Electro-Optical Characteristics Curve
SIR CHIP
Fig.2 Relative Radiant Intensity vs. Wavelength
Fig.1 Forward Current vs. Rorward Voltage
1.0
1000
100
10
1
0.5
0.0
0.1
750
800
850
900
950
1000 1050
0.5
1.0
1.5
2.0
2.5
Wavelength(nm)
Forward Voltage(V)
Fig.3 Relative Radiant Power
vs. Forward DC Current
Fig.4 Relative Radiant Power
vs. Forward Peak Current
10.0
10.0
1.0
1.0
0.1
0.1
1
10
100
10
100
1000
I
FPK(mA)
I
FDC(mA)
Fig.5 Forward DC Voltage vs. Temperature
Fig.6 Relative Radiant Power vs. Temperature
1.2
1.1
1.0
0.9
0.8
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-40 -20
0
20
40
60
80
100
-20
0
20
40
60
80
100
Ambient Temperature[℃]
Ambient Temperature[℃]
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSIR9353
Page 4/6
Storage time:
1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5℃ ~ 35℃,RH<60%,
they should be treated at 60℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, require some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSIR9353
Page 5/6
Mounting:
1. If the leads are subjected to stress during soldering
a printed circuit board, illumination failure may result
immediately or later during use. For this reason,
make sure that the intervals between the installation
holes in the board are equal to the intervals between
the leads (after forming if done) so that no stress is
applied to the lead.
(X)
(O)
(O)
2. The LED lamps are designed for high-density mount-
ing and have a structure which can alleviate mechan-
ical stress due to clinching . Nevertheless , take care
to avoid the occurrence of residual mechanical stress
due to clinching .
15°
45°
Anode side(cathode side on GaAlAs chips)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSIR9353
Page 6/6
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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