LSIR9553/TR1 [LIGITEK]

SURFACE MOUNT LED TAPE AND REEL; 表面安装型LED卷带
LSIR9553/TR1
型号: LSIR9553/TR1
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

SURFACE MOUNT LED TAPE AND REEL
表面安装型LED卷带

文件: 总8页 (文件大小:137K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
SURFACE MOUNT LED TAPE AND REEL  
Pb  
Lead-Free Parts  
LSIR9553/TR1  
DATA SHEET  
SIR9553/TR1  
DOC. NO : QW0905-L  
REV  
: A  
DATE  
:
13 - Jun. - 2008  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSIR9553/TR1  
Page 1/7  
Package Dimensions  
3.5  
3.2  
1.85  
2.8  
2.2  
1.85  
0.95  
0.9  
0.9  
-
+
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
Carrier Type Dimensions  
2.0  
0.23  
4.0  
1.55  
1.75  
5.5  
12.0±0.3  
4.06  
9.3  
Polarity  
4.0  
3.12  
2.24  
Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSIR9553/TR1  
Page 2/7  
Reel Dimensions  
16.0±1.0  
ψ178±2.0  
14.2±1.0  
74.0±1.5  
Description  
12.0mm tape,7"reel  
Quantity/Reel  
1500 devices  
Part No.  
LSIR9553/TR1  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSIR9553/TR1  
Page 3/7  
Absolute Maximum Ratings at Ta=25  
Ratings  
Symbol  
Parameter  
UNIT  
SIR  
100  
mW  
A
Power Dissipation  
PD  
IFP  
Peak Forward Current  
(300PPS,10μs Pulse)  
1
50  
IF  
Forward Current  
mA  
V
5
Reverse Voltage  
Vr  
Electrostatic Discharge  
Operating Temperature  
Storage Temperature  
ESD  
Topr  
Tstg  
2000  
-40 ~ +85  
-40 ~ +85  
V
Electrical Optical Characteristics (Aa=25)  
Typ.  
1.0  
Min.  
0.5  
Max.  
UNIT  
PARAMETER  
Radiant Intensity  
SYMBOL  
Le  
TEST CONDITION  
mW/sr  
mW/cm2  
nm  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
IF=20mA  
VR=5V  
Aperture Radiant Incidence  
Peak Emission Wavelength  
Spectral Line Half Width  
Forward Voltage  
0.07 0.14  
Ee  
λpeak  
△λ  
VF  
880  
50  
nm  
1.4  
1.7  
V
Reverse Current  
μA  
IR  
100  
Viewing Angle  
deg  
2θ1/2  
120  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The radiant intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
4/7  
PART NO. LSIR9553/TR1  
Typical Electro-Optical Characteristics Curve  
SIR CHIP  
Fig.1 Forward Current vs. Rorward Voltage  
Fig.2 Relative Radiant Intensity vs. Wavelength  
1000  
1.0  
100  
10  
1
0.5  
0.0  
0.1  
750  
800  
850  
900  
950  
1000 1050  
0.5  
1.0  
1.5  
2.0  
2.5  
Wavelength(nm)  
Forward Voltage(V)  
Fig.4 Relative Radiant Power  
vs. Forward Peak Current  
Fig.3 Relative Radiant Power  
vs. Forward DC Current  
10.0  
10.0  
1.0  
1.0  
0.1  
0.1  
1
10  
100  
10  
100  
1000  
IFPK(mA)  
I
FDC(mA)  
Fig.6 Relative Radiant Power vs. Temperature  
Fig.5 Forward DC Voltage vs. Temperature  
1.2  
1.1  
1.0  
0.9  
0.8  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
-40  
-40 -20  
0
20  
40  
60  
80  
100  
-20  
0
20  
40  
60  
80  
100  
Ambient Temperature[]  
Ambient Temperature[]  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSIR9553/TR1  
Page 5/7  
Recommended Soldering Conditions  
1. Hand Solder  
Basic spec is 2803 sec one time only.  
2. Wave Solder  
Soldering heat Max. 260℃  
245±5within 5 sec  
Preheat  
120 ~ 150℃  
120 ~ 180 sec  
3. LEAD Reflow Solder  
Temp.  
()  
240  
Rising  
Cooling  
+5/sec  
-5/sec  
Preheat  
150  
120  
Time  
60 ~ 120 sec  
5sec  
4. PB-Free Reflow Solder  
1~5°C/sec  
260°C MaX.  
10sec.Max  
Preheat  
180~200° C  
Above 220° C  
60 sec.Max.  
1~5°C/sec  
120 sec.Max.  
Note: 1.Wave solder and reflow soldering should not be made more than one time.  
2.You can just only select one of the soldering conditions as above.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 6/7  
PART NO. LSIR9553/TR1  
Precautions For Use:  
Storage time:  
1.The operation of Temperatures and RH are : 5~35,RH<60%.  
2.Once the package is opened, the products should be used within a week.  
Otherwise, they should be kept in a damp proof box with descanting agent.  
Considering the tape life, we suggest our customers to use our products within  
a year(from production date).  
3.If opened more than one week in an atmosphere 5~ 35,RH<60%,  
they should be treated at 60℃±5 fo r 15hrs.  
Drive Method:  
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into  
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series  
with the LED.  
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd  
current should not be allowed to change by more than 40 % of its desired value.  
Circuit model A  
LED  
Circuit model B  
LED  
(A) Recommended circuit.  
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.  
Cleaning:  
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.  
ESD(Electrostatic Discharge):  
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic  
glove is recommended when handing these LED. All devices, equipment and machinery must be properly  
grounded.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSIR9553/TR1  
Reliability Test:  
Page 7/7  
Reference  
Standard  
Classification  
Test Item  
Test Condition  
1.Ta=Under Room Temperature As Per Data Sheet  
Maximum Rating.  
2.If=20mA  
MIL-STD-750D: 1026  
MIL-STD-883D: 1005  
JIS C 7021: B-1  
Operating Life Test  
3.t=1000 hrs (-24hrs, +72hrs)  
High Temperature  
Storage Test  
1.Ta=105℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883D:1008  
JIS C 7021: B-10  
Endurance  
Test  
Low Temperature  
Storage Test  
1.Ta=-40℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.IR-Reflow In-Board, 2 Times  
2.Ta=65℃±5℃  
3.RH=90%~95%  
High Temperature  
High Humidity  
Storage Test  
MIL-STD-202F:103B  
JIS C 7021: B-11  
4.t=1000hrs ±2hrs  
1.IR-Reflow In-Board,2 times  
2.Ta=105℃±5&  
-40℃±5℃  
MIL-STD-202F: 107D  
MIL-STD-750D: 1051  
MIL-STD-883D: 1011  
Thermal Shock Test  
(10min) (10min)  
3.total 10 cycles  
MIL-STD-202F: 210A  
MIL-STD-750D: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ℃±5℃  
2.Dwell Time= 10 ±1sec.  
1.T.Sol=235 ℃±5℃  
2.Immersion time 2 ±0.5sec  
3.Immersion rate 25 ±2.5mm/sec  
4.Immersion rate 25 ±2.5mm/sec  
5.Coverage 95% of the dipped surface  
MIL-STD-202F: 208D  
MIL-STD-750D: 2026  
MIL-STD-883D: 2003  
IEC 68 Part 2-20  
Solderability Test  
Environmental  
Test  
JIS C 7021: A-2  
MIL-STD-202F: 107D  
MIL-STD-750D: 1051  
MIL-STD-883D: 1010  
JIS C 7021: A-4  
1.105~ 25~ 55~ 25℃  
30mins 5mins 30mins 5mins  
2.10 Cyeles  
Temperature  
Cycling  
Ramp-up rate(183 to Peak) +3 second max  
Temp. maintain at 125( ±25)120 seconds max  
Temp. maintain above 183 60-150 seconds  
Peak temperature range 235 +5-0℃  
Time within 5 of actual Peak Temperature(tp)  
10-30 seconds  
MIL-STD-750D:2031.2  
J-STD-020  
Solderability Test  
Ramp-down rate +6 /second max  

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