SPM0423HE4H-WB [KNOWLES]

Digital SiSonicTM Microphone With Enhanced RF Performance; 数字SiSonicTM麦克风具有增强RF性能


型号：	SPM0423HE4H-WB
厂家：	KNOWLES ELECTRONICS
描述：	Digital SiSonicTM Microphone With Enhanced RF Performance 数字SiSonicTM麦克风具有增强RF性能
文件：	总13页 (文件大小：928K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SPM0423HE4H-WB

Digital SiSonic^TMMicrophone

With Enhanced RF Performance

The SPM0423HE4H-WB is a miniature, high-

Features:

performance, low power, top port silicon

digital microphone with a single bit PDM

output. Using Knowles’ proven high

performance SiSonic^TMMEMS technology,

the SPM0423HE4H-WB consists of an

acoustic sensor, a low noise input buffer,

and a sigma-delta modulator. These devices

are suitable for applications such as

cellphones, smart phones, laptop

 Enhanced RF protection

 PDM Output

 Supports Dual Multiplexed Channels

 Ultra-Stable Performance

 Standard SMD Reflow

 Omnidirectional

computers, sensors, digital still cameras,

portable music recorders, and other

portable electronic devices where excellent

wideband audio performance and RF

immunity are required.

Revision: C

Sheet 1 of 13

2/28/2013

SPM0423HE4H-WB

1. ABSOLUTE MAXIMUM RATINGS

Parameter

V_DD, DATA to Ground

Absolute Maximum Rating Units

-0.3, +5.0

±5

CLOCK to Ground

SELECT to Ground

Input Current

sec

°C

Short Circuit Current to/from DATA Indefinite to Ground or V_DD

Temperature Range -40 to +100

Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic

& Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical

Specifications” for extended periods may affect device reliability.

2. ACOUSTIC & ELECTRICAL SPECIFICATIONS

TEST CONDITIONS: 23 ±2°C, 55±20% R.H., V_DD=1.8 V, F_CLOCK=2.4 MHz, SELECT pin grounded, no load,

unless otherwise indicated

Parameter

Supply Voltage¹

Supply Current^1,2,3

Sleep Current³

Sensitivity¹

Symbol

V_DD

Conditions

Min

Typ

Max

3.6

600

Units

1.6

I_DD

500

-26

µA

I_SLEEP

F_CLOCK< 1 kHz

94 dB SPL @ 1 kHz

µA

-29

-23

dBFS

dB(A)

Signal to Noise Ratio

SNR

94 dB SPL @ 1 kHz, A-weighted

Total Harmonic

Distortion

THD

AOP

94 dB SPL @ 1 kHz, S = Typ

Acoustic Overload

Point

SPL

10% THD @ 1 kHz, S = Typ

Fullscale = ±100

115

DC Output

Directivity

% FS

Omnidirectional

Decreasing density of 1’s

½ Cycle PDM

Polarity

Increasing sound pressure

Data Format

Logic Input High

Logic Input Low

Logic Output High

Logic Output Low

V_IH

V_IL

0.65xV_DD

-0.3

3.6

0.35xV_DD

V_DD

V_OH

V_OL

I_OUT= 1 mA

0.65xV_DD

0.35xV_DD

Revision: C

2/28/2013

Sheet 2 of 13

SPM0423HE4H-WB

Parameter

SELECT (high)

Symbol

Conditions

Min

Typ

Max

3.6

0.2

Units

V_DD-0.2

SELECT (low)

Short Circuit Current

Output Load

-0.3

I_SC

Grounded DATA pin

C_LOAD

F_CLOCK

100

3.25

Clock Frequency

Clock Duty Cycle

Clock Rise/Fall Time

Fall-asleep Time^4,5

Wake-up Time^4,6

1.0

MHz

t_EDGE

F_CLOCK< 1 kHz

F_CLOCK≥ 1 MHz

No load for min t_DV

Max C_LOADfor max t_DV

Delay Time for Valid

Data

t_DV

t_DZ

Delay Time for High Z

¹100% tested.

²I_DDvaries with C_LOADaccording to: ΔI_DD= 0.5*V_DD*ΔC_LOAD*F_CLOCK

³Maximum specifications are measured at maximum V_DD. Typical specifications are measured at standard test

conditions.

⁴Valid microphones states are: Powered Down Mode (mic off), Sleep Mode (low current, DATA = high-Z, fast startup),

and Active Mode (normal operation).

⁵Time from F_CLOCK< 1 kHz to I_SLEEPspecification is met when transitioning from Active Mode to Sleep Mode.

⁶Time from F_CLOCK≥ 1 MHz to all applicable specifications are met when transitioning from Sleep Mode to Active Mode.

Revision: C

2/28/2013

Sheet 3 of 13

SPM0423HE4H-WB

3. MICROPHONE STATE DIAGRAM

Active

Mode

Powered

Down

Mode

Sleep

Mode

Revision: C

2/28/2013

Sheet 4 of 13

SPM0423HE4H-WB

4. FREQUENCY RESPONSE CURVE

Typical Free Field Response

Normalized to 1 kHz

-2

-4

-6

-8

-10

-12

-14

-16

-18

-20

100

1,000

10,000

Frequency (Hz)

Revision: C

Sheet 5 of 13

2/28/2013

SPM0423HE4H-WB

5. INTERFACE CIRCUIT

V_DD

.1f

SELECT

Mic

(High)

(Low)

DATA CLOCK

Microphone

Mic (High)

Mic (Low)

SELECT

V_DD

Asserts DATA On

Rising Clock Edge

Falling Clock Edge

Latch DATA On

Falling Clock Edge

Rising Clock Edge

GND

Note: All Ground pins must be connected to ground.

Capacitors near the microphone should not contain Class 2 dielectrics.

Detailed information on acoustic, mechanical, and system integration can be found in

the latest SiSonic^TMDesign Guide application note.

6. TIMING DIAGRAM

1/F_CLOCK

t_EDGE

V_IH

V_IL

t_EDGE

CLOCK

t_DZ

t_DV

V_OH

Mic (High)

Data

High Z

DATA

(SELECT = V_DD)

V_OL

t_DZ

t_DV

V_OH

DATA

(SELECT = GND)

High Z

Mic (Low)

Data

V_OL

Revision: C

2/28/2013

Sheet 6 of 13

SPM0423HE4H-WB

7. MECHANICAL SPECIFICATIONS

Item

Length (L)

Dimension Tolerance

Units

4.72

3.76

±0.10

±0.08

Width (W)

Height (H)

1.25

Acoustic Port (AP)

Ø0.84

Pin #

Pin Name

Type

Description

GROUND

Power

Ground

Non-Digital

Input

Lo/Hi (L/R) Select

This pin is internally pulled low.

SELECT

GROUND

CLOCK

DATA

Power

Digital I

Digital O

Power

Ground

Clock Input

PDM Output

Power Supply

V_DD

Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified.

Dimensions are in millimeters unless otherwise specified.

Tolerance is ±0.15mm unless otherwise specified

Revision: C

Sheet 7 of 13

2/28/2013

SPM0423HE4H-WB

8. EXAMPLE LAND PATTERN

9. EXAMPLE SOLDER STENCIL PATTERN

Notes: Dimensions are in millimeters unless otherwise specified.

Further optimizations based on application should be performed.

Revision: C

2/28/2013

Sheet 8 of 13

SPM0423HE4H-WB

10. PACKAGING & MARKETING DETAIL

Model Number

Suffix Reel Diameter Quantity Per Reel

-6 13” 4,800

SPM0423HE4H-WB

Pin 1

Alpha Character A:

“S”: Knowles SiSonic^TMProduction

“E”: Knowles Engineering Samples

“P”: Knowles Prototype Samples

“JIN NUMBER”:

Unique Job Identification Number

for product traceability

Notes: Dimensions are in millimeters unless otherwise specified.

Vacuum pickup only in the pick area indicated in Mechanical Specifications.

Tape & reel per EIA-481.

Labels applied directly to reel and external package.

Shelf life: Twelve (12) months when devices are to be stored in factory supplied,

unopened ESD moisture sensitive bag under maximum environmental conditions of

30°C, 70% R.H.

Revision: C

Sheet 9 of 13

2/28/2013

SPM0423HE4H-WB

11. RECOMMENDED REFLOW PROFILE

t_P

T_P

Ramp-up

T_L

t_L

T_SMAX

t_SPreheat

Ramp-down

T_SMIN

25°C

Time

Time 25°C to Peak

Profile Feature

Pb-Free

Average Ramp-up rate (T_SMAXto T_P)

Preheat

3°C/second max.



Temperature Min (T_SMIN)

150°C

200°C

60-180 seconds

Temperature Max (T_SMAX

)

Time (T_SMINto T_SMAX) (t_S)

Time maintained above:



Temperature (T_L)

Time (t_L)

217°C

60-150 seconds

Peak Temperature (T_P)

Time within 5°C of actual Peak Temperature (t_P)

Ramp-down rate (T_Pto T_SMAX

Time 25°C to Peak Temperature

260°C

20-40 seconds

6°C/second max

8 minutes max

)

Notes: Based on IPC/JDEC J-STD-020 Revision C.

All temperatures refer to topside of the package, measured on the package body

surface.

Revision: C

Sheet 10 of 13

2/28/2013

SPM0423HE4H-WB

12. ADDITIONAL NOTES

(A) MSL (moisture sensitivity level) Class 1.

(B) Maximum of 3 reflow cycles is recommended.



Do not board wash or clean after the reflow process.

Do not brush board with or without solvents after the reflow process.

Do not directly expose to ultrasonic processing, welding, or cleaning.

Do not insert any object in port hole of device at any time.

Do not apply over 30 psi of air pressure into the port hole.

Do not pull a vacuum over port hole of the microphone.

Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.

13. MATERIALS STATEMENT

Meets the requirements of the European RoHS directive, 2011/65/EC as amended.

Meets the requirements of the industry-standard IEC 61249-2-21:2003 for halogenated

substances and Knowles Green Materials Standards Policy section on Halogen-Free.

Ozone depleting substances are not used in the product or the processes used to make the

product including compounds listed in annex A, B, and C of the “Montreal Protocol on

Substances that deplete the ozone Layer.”

Revision: C

Sheet 11 of 13

2/28/2013

SPM0423HE4H-WB

14. RELIABILITY SPECIFICATIONS

Test

Description

100 cycles air-to-air thermal shock from -40^oC to +125^oC with 15

minute soaks. (IEC 68-2-4)

Thermal Shock

High Temperature Storage

Low Temperature Storage

High Temperature Bias

Low Temperature Bias

1,000 hours at +105^oC environment (IEC 68-2-2 Test Ba)

1,000 hours at -40^oC environment (IEC 68-2-2 Test Aa)

1,000 hours at +105^oC under bias (IEC 68-2-2 Test Ba)

1,000 hours at -40^oC under bias (IEC 68-2-2 Test Aa)

Temperature / Humidity Bias 1,000 hours at +85^oC/85% R.H. under bias. (JESD22-A101A-B)

4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak

acceleration lasting 12 minutes in X, Y, and Z directions.

(Mil-Std-883E, method 2007.2 A)

Vibration

ESD-HBM

3 discharges of ±2 kV direct contact to I/O pins. (ESD STM5.2)

3 discharges of ±8 kV direct contact to lid while unit is grounded.

(IEC 61000-4-2)

ESD-LID/GND

3 discharges of ±2 kV direct contact to I/O pins.

(MIL 883E, Method 3015.7)

ESD-MM

Reflow

5 reflow cycles with peak temperature of +260^oC

Mechanical Shock

3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea)

Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate

more than 3 dB from its initial value.

Revision: C

Sheet 12 of 13

2/28/2013

SPM0423HE4H-WB

15. SPECIFICATIONS REVISIONS

Revision

Specification Changes

Initial Release (C10111411)

Date

6/30/10

10/20/10

Typographical error and format changes.

New RoHS statement (C10114438); updated humidity conditions and ESD

descriptions (C10114466); released in new format (C10114628)

2/28/13

Information contained herein is subject to change without notice. It may be used by a party at their own discretion

and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not

to be taken as a license to operate under any existing patents.

Revision: C

Sheet 13 of 13

2/28/2013

SPM0423HE4H-WB [KNOWLES]

相关型号：

SPM0423HM4H-WB

SPM0437HD4H-B

SPM05-10R

SPM05-20R

SPM1-051

SPM1-121

SPM1-151

SPM1-241

SPM1004

SPM1004-0V8C

SPM1004-1V0C

SPM1004-1V2C