SPM0423HM4H-WB [KNOWLES]
Digital SiSonicTM Microphone; 数字SiSonicTM麦克风型号: | SPM0423HM4H-WB |
厂家: | KNOWLES ELECTRONICS |
描述: | Digital SiSonicTM Microphone |
文件: | 总13页 (文件大小:949K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SPM0423HM4H-WB
Digital SiSonicTM Microphone
The SPM0423HM4H-WB is a miniature,
high-performance, low power, top port
silicon digital microphone with a single bit
PDM output. Using Knowles’ proven high
performance SiSonicTM MEMS technology,
the SPM0423HM4H-WB consists of an
acoustic sensor, a low noise input buffer,
and a sigma-delta modulator. These devices
are suitable for applications such as
cellphones, smart phones, laptop
Features:
RF Shielded
PDM Output
Supports Dual Multiplexed Channels
Ultra-Stable Performance
Standard SMD Reflow
Omnidirectional
computers, sensors, digital still cameras,
portable music recorders, and other
portable electronic devices where excellent
wideband audio performance and RF
immunity are required.
Revision: C
Sheet 1 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
1. ABSOLUTE MAXIMUM RATINGS
Parameter
VDD, DATA to Ground
Absolute Maximum Rating Units
-0.3, +5.0
-0.3, +5.0
-0.3, +5.0
±5
V
V
CLOCK to Ground
SELECT to Ground
Input Current
V
mA
sec
°C
Short Circuit Current to/from DATA Indefinite to Ground or VDD
Temperature Range -40 to +100
Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic
& Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical
Specifications” for extended periods may affect device reliability.
2. ACOUSTIC & ELECTRICAL SPECIFICATIONS
TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD=1.8 V, FCLOCK=2.4 MHz, SELECT pin grounded, no load,
unless otherwise indicated
Parameter
Supply Voltage1
Supply Current1,2,3
Sleep Current3
Sensitivity1
Symbol
VDD
Conditions
Min
Typ
-
Max
3.6
600
50
Units
V
1.6
IDD
-
-
500
25
-26
56
µA
ISLEEP
S
FCLOCK < 1 kHz
94 dB SPL @ 1 kHz
µA
-29
-
-23
-
dBFS
dB(A)
Signal to Noise Ratio
SNR
94 dB SPL @ 1 kHz, A-weighted
Total Harmonic
Distortion
THD
AOP
94 dB SPL @ 1 kHz, S = Typ
-
-
1
%
Acoustic Overload
Point
dB
SPL
10% THD @ 1 kHz, S = Typ
Fullscale = ±100
115
-
-
-
-
DC Output
Directivity
4
% FS
Omnidirectional
Decreasing density of 1’s
½ Cycle PDM
Polarity
Increasing sound pressure
Data Format
Logic Input High
Logic Input Low
Logic Output High
Logic Output Low
VIH
VIL
0.65xVDD
-0.3
-
-
-
-
3.6
V
V
V
V
0.35xVDD
VDD
VOH
VOL
IOUT = 1 mA
IOUT = 1 mA
0.65xVDD
0
0.35xVDD
Revision: C
2/28/2013
Sheet 2 of 13
©2013 Knowles Electronics
SPM0423HM4H-W
Parameter
SELECT (high)
Symbol
Conditions
Min
Typ
Max
3.6
0.2
10
Units
VDD -0.2
-
-
V
SELECT (low)
Short Circuit Current
Output Load
-0.3
V
ISC
Grounded DATA pin
-
-
1
-
mA
pF
CLOAD
FCLOCK
100
3.25
60
Clock Frequency
Clock Duty Cycle
Clock Rise/Fall Time
Fall-asleep Time4,5
Wake-up Time4,6
1.0
40
-
-
MHz
%
-
tEDGE
-
10
ns
FCLOCK < 1 kHz
FCLOCK ≥ 1 MHz
-
-
10
ms
ms
-
-
10
No load for min tDV
Max CLOAD for max tDV
Delay Time for Valid
Data
tDV
tDZ
18
0
-
-
60
16
ns
ns
Delay Time for High Z
1 100% tested.
2 IDD varies with CLOAD according to: ΔIDD = 0.5*VDD*ΔCLOAD*FCLOCK
.
3 Maximum specifications are measured at maximum VDD. Typical specifications are measured at standard test
conditions.
4 Valid microphones states are: Powered Down Mode (mic off), Sleep Mode (low current, DATA = high-Z, fast startup),
and Active Mode (normal operation).
5 Time from FCLOCK < 1 kHz to ISLEEP specification is met when transitioning from Active Mode to Sleep Mode.
6 Time from FCLOCK ≥ 1 MHz to all applicable specifications are met when transitioning from Sleep Mode to Active Mode.
Revision: C
2/28/2013
Sheet 3 of 13
©2013 Knowles Electronics
SPM0423HM4H-W
3. MICROPHONE STATE DIAGRAM
Active
Mode
Powered
Down
Mode
Sleep
Mode
Revision: C
2/28/2013
Sheet 4 of 13
©2013 Knowles Electronics
SPM0423HM4H-W
4. FREQUENCY RESPONSE CURVE
Typical Free Field Response
Normalized to 1 kHz
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
100
1,000
10,000
Frequency (Hz)
Revision: C
Sheet 5 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
5. INTERFACE CIRCUIT
VDD
VDD
.1f
.1f
SELECT
SELECT
Mic
(High)
Mic
(Low)
DATA CLOCK
Microphone
Mic (High)
Mic (Low)
SELECT
VDD
Asserts DATA On
Rising Clock Edge
Falling Clock Edge
Latch DATA On
Falling Clock Edge
Rising Clock Edge
GND
Note: All Ground pins must be connected to ground.
Capacitors near the microphone should not contain Class 2 dielectrics.
Detailed information on acoustic, mechanical, and system integration can be found in
the latest SiSonicTM Design Guide application note.
6. TIMING DIAGRAM
1/FCLOCK
tEDGE
VIH
VIL
tEDGE
CLOCK
tDZ
tDV
VOH
Mic (High)
Data
High Z
DATA
(SELECT = VDD)
VOL
tDZ
tDV
VOH
DATA
(SELECT = GND)
High Z
Mic (Low)
Data
VOL
Revision: C
2/28/2013
Sheet 6 of 13
©2013 Knowles Electronics
SPM0423HM4H-W
7. MECHANICAL SPECIFICATIONS
Item
Length (L)
Dimension Tolerance
Units
mm
mm
mm
mm
4.72
3.76
±0.10
±0.10
±0.10
±0.05
Width (W)
Height (H)
1.25
Acoustic Port (AP)
Ø0.84
Pin #
Pin Name
Type
Power
Description
1
GROUND
Ground
Non-Digital
Input
Lo/Hi (L/R) Select
This pin is internally pulled low.
2
SELECT
3
4
5
6
GROUND
CLOCK
DATA
Power
Digital I
Digital O
Power
Ground
Clock Input
PDM Output
Power Supply
VDD
Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified.
Dimensions are in millimeters unless otherwise specified.
Tolerance is ±0.15mm unless otherwise specified
Revision: C
Sheet 7 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
8. EXAMPLE LAND PATTERN
9. EXAMPLE SOLDER STENCIL PATTERN
Notes: Dimensions are in millimeters unless otherwise specified.
Further optimizations based on application should be performed.
Revision: C
2/28/2013
Sheet 8 of 13
©2013 Knowles Electronics
SPM0423HM4H-W
10. PACKAGING & MARKETING DETAIL
Model Number
Suffix Reel Diameter Quantity Per Reel
-6 13” 4,800
SPM0423HM4H-WB
Pin 1
Alpha Character A:
“S”: Knowles SiSonicTM Production
“E”: Knowles Engineering Samples
“P”: Knowles Prototype Samples
“JIN NUMBER”:
Unique Job Identification Number
for product traceability
Notes: Dimensions are in millimeters unless otherwise specified.
Vacuum pickup only in the pick area indicated in Mechanical Specifications.
Tape & reel per EIA-481.
Labels applied directly to reel and external package.
Shelf life: Twelve (12) months when devices are to be stored in factory supplied,
unopened ESD moisture sensitive bag under maximum environmental conditions of
30°C, 70% R.H.
Revision: C
Sheet 9 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
11. RECOMMENDED REFLOW PROFILE
tP
TP
Ramp-up
TL
tL
TSMAX
tS Preheat
Ramp-down
TSMIN
25°C
Time
Time 25°C to Peak
Profile Feature
Pb-Free
Average Ramp-up rate (TSMAX to TP)
Preheat
3°C/second max.
Temperature Min (TSMIN)
150°C
200°C
60-180 seconds
Temperature Max (TSMAX
)
Time (TSMIN to TSMAX) (tS)
Time maintained above:
Temperature (TL)
Time (tL)
217°C
60-150 seconds
Peak Temperature (TP)
Time within 5°C of actual Peak Temperature (tP)
Ramp-down rate (TP to TSMAX
Time 25°C to Peak Temperature
260°C
20-40 seconds
6°C/second max
8 minutes max
)
Notes: Based on IPC/JDEC J-STD-020 Revision C.
All temperatures refer to topside of the package, measured on the package body
surface.
Revision: C
Sheet 10 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
12. ADDITIONAL NOTES
(A) MSL (moisture sensitivity level) Class 1.
(B) Maximum of 3 reflow cycles is recommended.
(C) In order to minimize device damage:
Do not board wash or clean after the reflow process.
Do not brush board with or without solvents after the reflow process.
Do not directly expose to ultrasonic processing, welding, or cleaning.
Do not insert any object in port hole of device at any time.
Do not apply over 30 psi of air pressure into the port hole.
Do not pull a vacuum over port hole of the microphone.
Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.
13. MATERIALS STATEMENT
Meets the requirements of the European RoHS directive, 2011/65/EC as amended.
Meets the requirements of the industry-standard IEC 61249-2-21:2003 for halogenated
substances and Knowles Green Materials Standards Policy section on Halogen-Free.
Ozone depleting substances are not used in the product or the processes used to make the
product including compounds listed in annex A, B, and C of the “Montreal Protocol on
Substances that deplete the ozone Layer.”
Revision: C
Sheet 11 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
14. RELIABILITY SPECIFICATIONS
Test
Thermal Shock
Description
100 cycles air-to-air thermal shock from -40oC to +125oC with 15
minute soaks. (IEC 68-2-4)
High Temperature Storage
Low Temperature Storage
High Temperature Bias
Low Temperature Bias
1,000 hours at +105oC environment (IEC 68-2-2 Test Ba)
1,000 hours at -40oC environment (IEC 68-2-2 Test Aa)
1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba)
1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa)
Temperature / Humidity Bias 1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B)
4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak
acceleration lasting 12 minutes in X, Y, and Z directions.
(Mil-Std-883E, method 2007.2 A)
Vibration
ESD-HBM
3 discharges of ±2 kV direct contact to I/O pins. (ESD STM5.2)
3 discharges of ±8 kV direct contact to lid while unit is grounded.
(IEC 61000-4-2)
ESD-LID/GND
3 discharges of ±2 kV direct contact to I/O pins.
(MIL 883E, Method 3015.7)
ESD-MM
Reflow
5 reflow cycles with peak temperature of +260oC
Mechanical Shock
3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea)
Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate
more than 3 dB from its initial value.
Revision: C
Sheet 12 of 13
2/28/2013
©2013 Knowles Electronics
SPM0423HM4H-W
15. SPECIFICATIONS REVISIONS
Revision
Specification Changes
Initial Release (C10111412)
Date
A
B
6/30/10
10/20/10
Typographical error and format changes.
New RoHS statement (C10114438); updated humidity conditions and ESD
descriptions (C10114466); released in new format (C10114628)
C
2/28/13
Information contained herein is subject to change without notice. It may be used by a party at their own discretion
and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not
to be taken as a license to operate under any existing patents.
Revision: C
Sheet 13 of 13
2/28/2013
©2013 Knowles Electronics
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