CPC1968 [IXYS]
5A Load Current with 5C/W Heat Sink; 5A负载电流，在5℃ / W散热器
| 型号： | CPC1968 |
| 厂家： | 
IXYS CORPORATION |
| 描述： | 5A Load Current with 5C/W Heat Sink |
| 文件： | 总7页 (文件大小：1570K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CPC1968
ISOPLUS™-264 Power Relay
INTEGRATED
C
IRCUITS
D
IVISION
Characteristics
Description
The CPC1968 single-pole normally open (1-Form-A)
Solid State Power Relay is rated for up to 5A
continuous load current with a 5°C/W heat sink.
Parameter
Rating
Units
VP
Blocking Voltage
500
Load Current, TA=25°C:
Optically coupled MOSFET technology enables the
With 5°C/W Heat Sink
No Heat Sink
5
2
CPC1968 to provide 2500V
of input to output
Arms / A
rms
DC
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses IXYS
Integrated Circuits Division’s patented OptoMOS
architecture while the input, a highly efficient GaAlAs
infrared LED, provides the optically coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance switching
applications.
On-Resistance
0.35
R
0.3
°C/W
JC
Features
• 5A Load Current with 5°C/W Heat Sink
• Low 0.35 On-Resistance
• 500V Blocking Voltage
P
• 2500V
Input/Output Isolation
rms
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process in which the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
• Low Thermal Resistance (0.3 °C/W)
• Electrically Non-conductive Thermal Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
2500V
isolation but also very low thermal
rms
resistance (0.3 °C/W).
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
Ordering Information
• Multiplexers
• Data Acquisition
• Electronic Switching
Part
Description
ISOPLUS-264 Package (25 per tube)
CPC1968J
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
Switching Characteristics
Form-A
Pin Configuration
IF
90%
10%
ILOAD
t
t
on
off
DS-CPC1968-R01
www.ixysic.com
1
CPC1968
INTEGRATED
C
IRCUITS
D
IVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Symbol
Blocking Voltage
Ratings
Units
500
5
VP
Reverse Input Voltage
Input Control Current
Peak (10ms)
V
mA
A
100
1
Input Power Dissipation
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
150
mW
Vrms
°C
2500
-40 to +85
-40 to +125
°C
1.2 Electrical Characteristics @ 25°C
Parameter
Conditions
Symbol
Minimum
Typical Maximum
Units
Output Characteristics
1
Load Current
Peak
t10ms
AP
25
Continuous
Continuous
Continuous
No Heat Sink
IL
2
-
-
T =25°C
C
A
rms / ADC
15
T =99°C
C
IL(99)
RON
7.1
2
I =10mA, I =1A
L
On-Resistance
F
-
-
-
-
0.35
1
V =500V
L
Off-State Leakage Current
Switching Speeds
Tur n-On
ILEAK
P
A
ton
toff
-
-
-
-
4.6
0.07
620
20
5
-
I =20mA, V =10V
L
ms
pF
F
Tur n-Off
V =25V, f=1MHz
L
Output Capacitance
Cout
V =1V, f=1MHz
L
3500
-
Input Characteristics
3
I =1A
L
IF
IF
Input Control Current to Activate
-
2.45
10
-
mA
mA
V
Input Control Current to Deactivate
Input Voltage Drop
-
0.6
0.9
-
-
1.2
-
I =5mA
F
VF
IR
1.4
10
V =5V
R
Reverse Input Current
A
Input/Output Characteristics
Capacitance, Input-to-Output
-
C
-
1
-
pF
I/O
1 Higher load currents possible with proper heat sinking.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (TC > 60ºC) a LED drive current of 20mA is recommended.
2
www.ixysic.com
R01
CPC1968
INTEGRATED
C
IRCUITS
D
IVISION
2 Thermal Characteristics
Parameter
Conditions
Symbol
RJC
Minimum
Typical Maximum Units
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
-
-
-
-
33
-
0.3
-
°C/W
°C/W
°C
Free Air
-
RJA
T
-40
110
J
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
2
(TJ - TA) IL(99)
RθCA
=
- RθJC
IL2 • PD(99)
TJ = Junction Temperature (°C), TJ ≤ 110°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 31W
* Elevated junction temperature reduces semiconductor lifetime.
R01
www.ixysic.com
3
CPC1968
INTEGRATED
C
IRCUITS
D
IVISION
3 Performance Data @ 25°C (Unless Otherwise Noted)
Typical Turn-On Time
(N=50, IF=20mA, IL=1A)
Typical Turn-Off Time
(N=50, IF=20mA, IL=1A)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
20
15
10
5
30
25
20
15
10
5
40
35
30
25
20
15
10
5
0
0
0
3.7 4.0 4.3 4.6 4.9 5.2 5.5 5.8
0.060 0.065 0.070 0.075 0.080 0.085 0.090
1.215 1.220 1.225 1.230 1.235 1.240
Turn-On Time (ms)
Turn-Off Time (ms)
LED Forward Voltage (V)
Typical IF for Switch Operation
(N=50, IL=1A)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1A)
Typical Blocking Voltage Distribution
(N=50, IF=0mA, IL=10µA)
20
15
10
5
25
20
15
10
5
25
20
15
10
5
0
0
0
1.65 1.90 2.15 2.40 2.65 2.90 3.15 3.40
0.260 0.265 0.270 0.275 0.280 0.285 0.290
On-Resistance (Ω)
540 545 550 555 560 565 570 575
LED Forward Current (mA)
Blocking Voltage (VP)
Typical Turn-Off Time
vs. LED Forward Current
(IL=1A)
Typical Turn-On Time
vs. LED Forward Current
(IL=1A)
Typical LED Forward Voltage Drop
vs.Temperature
80
75
70
65
60
1.6
1.5
1.4
1.3
1.2
1.1
20
15
10
5
IF=50mA
IF=20mA
IF=10mA
IF=5mA
0
0
10
20
30
40
50
-40
-20
0
20
40
60
80
100
0
10
20
30
40
50
LED Current (mA)
Temperature (ºC)
LED Current (mA)
Typical Turn-On Time
vs.Temperature
(VL=10V)
Typical Turn-Off Time
vs.Temperature
(VL=10V)
Typical IF for Switch Operation
vs.Temperature
(IL=1A)
14
12
10
8
12
10
8
80
75
70
65
60
55
50
45
40
IF=20mA
IF=10mA
IF=20mA
IF=10mA
6
6
4
4
2
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
4
www.ixysic.com
R01
CPC1968
INTEGRATED
C
IRCUITS
D
IVISION
Typical Load Current
vs. Load Voltage
(IF=20mA)
Maximum Load Current
Typical On-Resistance
vs.Temperature
vs.Temperature
(IF=20mA)
(IF=20mA, IL=1A)
12
10
8
6
4
0.50
0.45
0.40
0.35
0.30
0.25
0.20
Heat Sink
1ºC/W
5ºC/W
10ºC/W
Free Air
2
6
0
4
-2
-4
-6
2
0
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
Typical Blocking Voltage
vs.Temperature
(IL=50μA)
Leakage Current vs.Temperature
Measured Across Pins 1&2
(IF=0mA, VL=500VP)
3500
3000
2500
2000
1500
1000
500
590
580
570
560
550
540
530
520
40
35
30
25
20
15
10
5
0
0
-40
-20
0
20
40
60
80
100
0
50
100
150
200
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Load Voltage (V)
Temperature (ºC)
Energy Rating Curve
30
25
20
15
10
5
0
10μs 100μs 1ms 10ms 100ms 1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
R01
www.ixysic.com
5
CPC1968
INTEGRATED
C
IRCUITS
D
IVISION
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1968J
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1968J
245°C for 30 seconds
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
6
www.ixysic.com
R01
CPC1968
INTEGRATED
C
IRCUITS
D
IVISION
4.5 Mechanical Dimensions
5.029 0.127
(0.198 0.005)
1.181 0.076
(0.047 0.003)
19.914 0.254
(0.784 0.010)
17.221 0.254
(0.678 0.010)
1.930 0.381
(0.076 0.015)
26.162 0.254
(1.030 0.010)
20.600 0.254
(0.811 0.010)
2.362 0.381
(0.093 0.015)
20.396 0.508
(0.803 0.020)
DIMENSIONS
mm
(inches)
3.810 0.254
(0.150 0.010)
0.635 0.076
(0.025 0.003)
2.794 0.127
(0.110 0.005)
15.240 0.508
(0.600 0.020)
1.270 TYP
(0.050 TYP)
NOTE: Back-side heat sink meets 2500Vrms isolation to the pins.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1968-R01
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
11/2/2012
R01
www.ixysic.com
7
相关型号：
©2020 ICPDF网 联系我们和版权申明