IRF5NJ6215 [INFINEON]
POWER MOSFET P-CHANNEL(Vdss=-150V, Rds(on)=0.29ohm, Id=-11A); POWER MOSFET P- CHANNEL （ VDSS = -150V ， RDS（ON） = 0.29ohm ，ID = -11A ）
| 型号： | IRF5NJ6215 |
| 厂家： | 
Infineon |
| 描述： | POWER MOSFET P-CHANNEL(Vdss=-150V, Rds(on)=0.29ohm, Id=-11A) |
| 文件： | 总7页 (文件大小：117K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 94284A
HEXFET® POWER MOSFET
SURFACE MOUNT (SMD-0.5)
IRF5NJ6215
150V, P-CHANNEL
Product Summary
Part Number
BV
RDS(on)
ID
DSS
IRF5NJ6215
-150V
0.29Ω
-11A
Fifth Generation HEXFET® power MOSFETs from
International Rectifier utilize advanced processing
techniquestoachievethelowestpossibleon-resistance
per silicon unit area. This benefit, combined with the
fast switching speed and ruggedized device design
that HEXFET power MOSFETs are well known for,
providesthedesignerwithanextremelyefficientdevice
for use in a wide variety of applications.
SMD-0.5
Features:
n
n
n
n
n
n
n
n
Low RDS(on)
Avalanche Energy Ratings
Dynamic dv/dt Rating
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Surface Mount
These devices are well-suited for applications such
as switching power supplies, motor controls, invert-
ers, choppers, audio amplifiers and high-energy pulse
circuits.
Light Weight
Absolute Maximum Ratings
Parameter
Units
I
@ V
@ V
= -10V, T = 25°C Continuous Drain Current
-11
-7.2
-44
D
GS
C
A
I
D
= -10V, T = 100°C Continuous Drain Current
C
GS
I
Pulsed Drain Current ➀
Max. Power Dissipation
DM
@ T = 25°C
P
75
W
W/°C
V
D
C
Linear Derating Factor
0.6
V
Gate-to-Source Voltage
±20
GS
E
Single Pulse Avalanche Energy ➀
Avalanche Current ➀
130
mJ
A
AS
I
-11
AR
E
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➀
Operating Junction
7.5
mJ
V/ns
AR
dv/dt
10
T
-55 to 150
J
T
Storage Temperature Range
oC
g
STG
Package Mounting Surface Temperature
Weight
300 (for 5 s)
1.0 (Typical)
For footnotes refer to the last page
www.irf.com
1
9/11/01
IRF5NJ6215
Electrical Characteristics @Tj = 25°C (Unless Otherwise Specified)
Parameter
Min Typ Max Units
Test Conditions
BV
DSS
Drain-to-Source Breakdown Voltage
-150
—
—
—
—
V
V
= 0V, I = -250µA
D
GS
V/°C Reference to 25°C, I = -1.0mA
∆BV
/∆T Temperature Coefficient of Breakdown
-0.17
DSS
J
D
Voltage
R
Static Drain-to-Source On-State
Resistance
—
—
0.29
Ω
V = -10V, I = -7.2A
GS D
DS(on)
➀
V
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
-2.0
2.3
—
—
—
—
—
-4.0
—
V
V
= V , I = -250µA
GS(th)
fs
DS
GS
D
Ω
g
S ( )
V
DS
= -25V, I
= -7.2A ➀
DS
I
-25
-250
V
= -150V ,V =0V
DSS
DS GS
µA
—
V
= -120V,
DS
= 0V, T =125°C
V
GS
J
I
I
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.0
-100
100
66
V
V
= -20V
= 20V
GSS
GSS
GS
GS
nA
nC
Q
Q
Q
V
=-10V, I = -7.2A
g
gs
gd
d(on)
r
GS
D
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
FallTime
13
40
V
DS
= -120V
t
t
t
t
25
V
= -75V, I = -7.2A,
DD
GS
D
65
75
V
=-10V, R = 6.8Ω
G
ns
d(off)
f
53
L
+ L
Total Inductance
—
S
D
Measured from the center of
nH
drain pad to center of source pad
C
C
C
Input Capacitance
—
—
—
990
230
120
—
—
—
V
= 0V, V
= -25V
iss
GS
DS
f = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
pF
oss
rss
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
Test Conditions
I
I
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) ➀
Diode Forward Voltage
—
—
—
—
—
—
—
—
—
—
-11
-44
-1.6
240
1.7
S
A
SM
V
t
V
ns
µC
T = 25°C, I = -7.2A, V
= 0V ➀
j
SD
rr
S
GS
Reverse Recovery Time
T = 25°C, I = -7.2A, di/dt ≤ -100A/µs
j
F
V
Q
Reverse Recovery Charge
≤ -25V ➀
DD
RR
t
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .
S D
on
Thermal Resistance
Parameter
Min Typ Max Units
Test Conditions
R
Junction-to-Case
—
—
1.67
°C/W
thJC
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
2
www.irf.com
IRF5NJ6215
100
10
1
100
10
1
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
TOP
TOP
BOTTOM -4.5V
BOTTOM -4.5V
-4.5V
-4.5V
20µs PULSE WIDTH
20µs PULSE WIDTH
T = 150 C
J
°
°
T = 25 C
J
0.1
0.1
0.1
0.1
1
10
100
1
10
100
-V , Drain-to-Source Voltage (V)
DS
-V , Drain-to-Source Voltage (V)
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
10
1
2.5
2.0
1.5
1.0
0.5
0.0
-11A
=
I
D
°
T = 25 C
J
°
T = 150 C
J
= -50V
V
DS
20µs PULSE WIDTH
V
=-10V
GS
0.1
4
6
8
10 12
14
-60 -40 -20
0
20 40 60 80 100 120 140 160
°
-V , Gate-to-Source Voltage (V)
GS
T , Junction Temperature( C)
J
Fig 4. Normalized On-Resistance
Fig 3. Typical Transfer Characteristics
Vs.Temperature
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3
IRF5NJ6215
2000
1600
1200
800
20
16
12
8
V
= 0V,
f = 1MHz
gd , ds
I
D
= -7.2A
GS
C
= C + C
C
SHORTED
V
V
V
=-120V
=-75V
=-30V
iss
gs
DS
DS
DS
C
= C
gd
rss
C
= C + C
ds
oss
gd
C
iss
C
oss
C
rss
400
4
FOR TEST CIRCUIT
SEE FIGURE 13
0
1
0
10
100
0
20
40
60
80
-V , Drain-to-Source Voltage (V)
DS
Q
, Total Gate Charge (nC)
G
Fig 5. Typical Capacitance Vs.
Fig 6. Typical Gate Charge Vs.
Drain-to-SourceVoltage
Gate-to-SourceVoltage
100
10
1
100
10
1
OPERATION IN THIS AREA LIMITED BY RDS(on)
°
T = 150 C
J
°
T = 25 C
J
1ms
10ms
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0 V
GS
0.1
0.4
0.1
0.8
1.2
1.6
1
10
100
1000
-V ,Source-to-Drain Voltage (V)
SD
-V
, Drain-toSource Voltage (V)
DS
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
ForwardVoltage
4
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IRF5NJ6215
12
RD
VDS
VGS
D.U.T.
RG
-
+
8
VDD
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
4
Fig 10a. Switching Time Test Circuit
t
t
r
t
t
f
d(on)
d(off)
V
GS
10%
0
25
50
T
75
100
125
150
°
, Case Temperature ( C)
C
90%
V
Fig 9. Maximum Drain Current Vs.
DS
CaseTemperature
Fig 10b. Switching Time Waveforms
10
1
D = 0.50
0.20
0.10
0.05
P
DM
0.1
t
0.02
0.01
1
SINGLE PULSE
(THERMAL RESPONSE)
t
2
Notes:
1. Duty factor D = t / t
1
2
2. Peak T = P
x
Z
+ T
C
J
DM
thJC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t , Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRF5NJ6215
250
200
150
100
50
I
D
L
V
DS
TOP
-3.2A
-4.6A
BOTTOM -7.2A
D.U.T
R
G
VD
D
I
A
AS
DRIVER
V
-
GS
0.01
t
Ω
p
15V
Fig 12a. Unclamped Inductive Test Circuit
0
I
AS
25
50
75
100
125
150
°
Starting T , Junction Temperature( C)
J
Fig 12c. Maximum Avalanche Energy
Vs. DrainCurrent
t
p
V
(BR)DSS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
50KΩ
Q
G
.2µF
-12V
.3µF
-10V
-
V
+
DS
Q
Q
GD
GS
D.U.T.
V
GS
V
G
-3mA
I
I
D
G
Charge
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
Fig 13a. Basic Gate Charge Waveform
6
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IRF5NJ6215
Footnotes:
Repetitive Rating; Pulse width limited by
I
≤ -7.2A, di/dt ≤ -390 A/µs,
SD
maximum junction temperature.
V
≤ -150V, T ≤ 150°C
J
DD
Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
V
= - 50 V, Starting T = 25°C, L= 5.0mH
J
DD
Peak I
= -7.2A, V
= -10 V, R = 25Ω
AS
GS
G
Case Outline and Dimensions — SMD-0.5
PAD ASSIGNMENTS
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 09/01
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7
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