IPB120N04S4-04 [INFINEON]

车规级MOSFET;
IPB120N04S4-04
型号: IPB120N04S4-04
厂家: Infineon    Infineon
描述:

车规级MOSFET

文件: 总8页 (文件大小:263K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IPB120N04S4-04  
OptiMOS-T2 Power-Transistor  
Product Summary  
Features  
V DS  
40  
3.6  
120  
V
• N-channel - Enhancement mode  
R DS(on),max  
I D  
mW  
A
• Automotive AEC Q101 qualified  
• MSL1 up to 260°C peak reflow  
• 175°C operating temperature  
Green package (lead free)  
• 100% Avalanche tested  
PG-TO263-3-2  
Type  
Package  
Ordering Code Marking  
- 4N0404  
IPB120N04S4-04  
PG-TO263-3-2  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol  
Conditions  
Unit  
I D  
T C=25°C, V GS=10V  
Continuous drain current  
120  
91  
A
T C=100°C, V GS=10V1)  
Pulsed drain current1)  
I D,pulse  
E AS  
T C=25°C  
480  
75  
I D=60A  
Avalanche energy, single pulse  
Avalanche current, single pulse  
Gate source voltage  
mJ  
A
I AS  
-
120  
V GS  
-
±20  
V
P tot  
T C=25°C  
Power dissipation  
79  
W
°C  
T j, T stg  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-
-
-55 ... +175  
55/175/56  
Rev. 1.1  
page 1  
2014-04-07  
IPB120N04S4-04  
Values  
Parameter  
Symbol  
Conditions  
Unit  
min.  
typ.  
max.  
Thermal characteristics1)  
R thJC  
R thJA  
R thJA  
Thermal resistance, junction - case  
-
-
-
-
1.9  
62  
K/W  
Thermal resistance, junction -  
ambient, leaded  
SMD version, device on PCB  
minimal footprint  
-
-
-
-
62  
40  
6 cm2 cooling area2)  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS=0V, I D= 1mA  
V GS(th) V DS=V GS, I D=40µA  
Drain-source breakdown voltage  
Gate threshold voltage  
40  
-
-
V
2.0  
3.0  
4.0  
V DS=40V, V GS=0V,  
T j=25°C  
I DSS  
Zero gate voltage drain current  
-
-
0.01  
3
1
µA  
V DS=18V, V GS=0V,  
T j=85 °C2)  
36  
I GSS  
V GS=20V, V DS=0V  
Gate-source leakage current  
-
-
100 nA  
RDS(on) V GS=10V, I D=100A  
Drain-source on-state resistance  
-
3.2  
3.6  
mΩ  
Rev. 1.1  
page 2  
2014-04-07  
IPB120N04S4-04  
Values  
Parameter  
Symbol  
Conditions  
Unit  
min.  
typ.  
max.  
Dynamic characteristics1)  
D-85579 Neubiberg  
C iss  
C oss  
Crss  
t d(on)  
t r  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
-
-
-
-
-
-
-
3150  
770  
30  
4100 pF  
1000  
V GS=0V, V DS=25V,  
f =1MHz  
70  
11  
-
-
-
-
ns  
18  
V DD=20V, V GS=10V,  
I D=120A, R G=3.5W  
t d(off)  
t f  
Turn-off delay time  
Fall time  
9
15  
Gate Charge Characteristics1)  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
20  
7
26  
16  
55  
-
nC  
Q gd  
V DD=32V, I D=120A,  
V GS=0 to 10V  
Q g  
42  
6.0  
V plateau  
Gate plateau voltage  
V
A
Reverse Diode  
Diode continous forward current1)  
Diode pulse current1)  
I S  
-
-
-
-
120  
480  
T C=25°C  
I S,pulse  
V GS=0V, I F=100A,  
T j=25°C  
V SD  
Diode forward voltage  
-
-
-
0.9  
45  
50  
1.3  
V
V R=20V, I F=I S,  
di F/dt =100A/µs  
Reverse recovery time1)  
Reverse recovery charge1)  
t rr  
-
-
ns  
nC  
Q rr  
1) Defined by design. Not subject to production test.  
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev. 1.1  
page 3  
2014-04-07  
IPB120N04S4-04  
1 Power dissipation  
2 Drain current  
P tot = f(T C); V GS ≥ 6 V  
I D = f(T C); V GS ≥ 6 V  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
T C [°C]  
T C [°C]  
3 Safe operating area  
4 Max. transient thermal impedance  
Z thJC = f(t p)  
I D = f(V DS); T C = 25 °C; D = 0  
parameter: t p  
parameter: D =t p/T  
101  
1000  
1 µs  
limited by on-state  
resistance  
10 µs  
100  
100  
10  
1
0.5  
100 µs  
0.1  
0.05  
10-1  
1 ms  
0.01  
single pulse  
10-2  
0.1  
1
10  
100  
t p [s]  
V DS [V]  
Rev. 1.1  
page 4  
2014-04-07  
IPB120N04S4-04  
5 Typ. output characteristics  
I D = f(V DS); T j = 25 °C  
parameter: V GS  
6 Typ. drain-source on-state resistance  
R DS(on) = (I D); T j = 25 °C  
parameter: V GS  
12  
500  
5.5 V  
10 V  
6 V  
10  
8
400  
300  
200  
100  
0
6
7 V  
6.5  
V
7 V  
4
6.5 V  
6 V  
10 V  
2
5.5 V  
5 V  
0
0
40  
80  
120  
0
2
4
6
8
V DS [V]  
I D [A]  
7 Typ. transfer characteristics  
I D = f(V GS); V DS = 6V  
parameter: T j  
8 Typ. drain-source on-state resistance  
R DS(on) = f(T j); I D = 100 A; V GS = 10 V  
240  
200  
160  
120  
80  
6
5
4
3
2
40  
175 °C  
25 °C  
-55 °C  
0
-60  
-20  
20  
60  
100  
140  
180  
2
4
6
8
T j [°C]  
V GS [V]  
Rev. 1.1  
page 5  
2014-04-07  
IPB120N04S4-04  
9 Typ. gate threshold voltage  
V GS(th) = f(T j); V GS = V DS  
parameter: I D  
10 Typ. capacitances  
C = f(V DS); V GS = 0 V; f = 1 MHz  
104  
4
3.5  
3
Ciss  
Coss  
400µA  
103  
40µA  
2.5  
Crss  
102  
2
1.5  
1
101  
0
10  
20  
30  
40  
-60  
-20  
20  
60  
T j [°C]  
100  
140  
180  
V DS [V]  
11 Typical forward diode characteristicis  
IF = f(VSD  
12 Typ. avalanche characteristics  
I AS = f(t AV  
)
)
parameter: T j  
parameter: Tj(start)  
1000  
100  
25°C  
100°C  
150°C  
25 °C  
175 °C  
10  
1
0.4  
0.7  
1
1.3  
0.1  
1
10  
t AV [µs]  
100  
1000  
V SD [V]  
Rev. 1.1  
page 6  
2014-04-07  
IPB120N04S4-04  
Published by  
Infineon Technologies AG  
Am Campeon 1-12  
D-85579 Neubiberg  
© Infineon Technologies AG 2014  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as  
a guarantee of characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact your  
nearest Infineon Technologies Office (www.infineon.com)  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact your nearest Infineon Technologies Office.  
Infineon Technologies' components may only be used in life-support devices or systems with the  
expressed written approval of Infineon Technologies, if a failure of such components can reasonably  
be expected to cause the failure of that life-support device or system, or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted  
in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons may be endangered.  
Rev. 1.1  
page 7  
2014-04-07  
IPB120N04S4-04  
Revision History  
Version  
Date  
Changes  
1.0  
1.1  
22.10.2013 Final Datasheet  
07.04.2014 Added Avalanche Current  
Rev. 1.1  
page 8  
2014-04-07  

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