AUIRLR3105TRR [INFINEON]

AUTOMOTIVE GRADE; 汽车级
AUIRLR3105TRR
型号: AUIRLR3105TRR
厂家: Infineon    Infineon
描述:

AUTOMOTIVE GRADE
汽车级

晶体 晶体管 功率场效应晶体管
文件: 总13页 (文件大小:632K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97703A  
AUTOMOTIVEGRADE  
AUIRLR3105  
Features  
HEXFET® Power MOSFET  
l AdvancedPlanarTechnology  
l Logic-LevelGateDrive  
Dynamic dV/dT Rating  
l LowOn-Resistance  
l 175°COperatingTemperature  
l Fast Switching  
l FullyAvalancheRated  
l RepetitiveAvalancheAllowed  
up to Tjmax  
D
V(BR)DSS  
55V  
RDS(on) typ.  
30m  
37m  
Ω
Ω
G
max  
S
ID  
25A  
l Lead-Free,RoHSCompliant  
l AutomotiveQualified*  
D
Description  
S
Specifically designed for Automotive applications,  
this Stripe Planar design of HEXFET® Power  
MOSFETs utilizes the latest processing techniques  
to achieve low on-resistance per silicon area. This  
benefit combined with the fast switching speed and  
ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in Automotive and a wide variety of other applications.  
G
D-Pak  
AUIRLR3105  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
25  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V  
@ T = 25°C  
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
18  
@ T = 100°C  
A
C
100  
DM  
57  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.38  
± 16  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS  
61  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (tested )  
IAR  
94  
See Fig. 12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
3.4  
dv/dt  
V/ns  
-55 to + 175  
T
J
T
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
2.65  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/1/11  
AUIRLR3105  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
55 ––– –––  
Conditions  
VGS = 0V, ID = 250μA  
V(BR)DSS  
V
ΔV(BR)DSS/ΔTJ  
RDS(on)  
Breakdown Voltage Temp. Coefficient ––– 0.056 ––– V/°C Reference to 25°C, ID = 1mA  
Static Drain-to-Source On-Resistance  
–––  
–––  
1.0  
30  
37  
43  
VGS = 10V, ID = 15A  
VGS = 5.0V, ID = 13A  
VDS = VGS, ID = 250μA  
VDS = 25V, ID = 15A  
Ω
m
35  
VGS(th)  
Gate Threshold Voltage  
–––  
–––  
–––  
–––  
–––  
–––  
3.0  
–––  
20  
V
gfs  
IDSS  
Forward Transconductance  
Drain-to-Source Leakage Current  
15  
S
–––  
–––  
–––  
–––  
μA VDS = 55V, VGS = 0V  
VDS = 44V, VGS = 0V, TJ = 150°C  
nA VGS = 16V  
250  
200  
-200  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
VGS = -16V  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units Conditions  
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
8.0  
57  
20  
ID = 15A  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
5.6  
nC VDS = 44V  
9.0  
V
V
GS = 5.0V, See Fig. 6 & 13  
DD = 28V  
–––  
–––  
–––  
–––  
–––  
ID = 15A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
25  
ns RG = 24 Ω  
37  
RD = 5.0Ω, See Fig. 18  
Between lead,  
LD  
Internal Drain Inductance  
4.5  
D
S
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
Ciss  
Input Capacitance  
–––  
–––  
–––  
–––  
–––  
–––  
710  
150  
28  
–––  
–––  
–––  
–––  
–––  
–––  
VGS = 0V  
Coss  
Output Capacitance  
pF VDS = 25V  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
ƒ = 1.0MHz, See Fig. 5  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
Coss  
890  
110  
210  
Coss  
Output Capacitance  
Effective Output Capacitance  
V
V
GS = 0V, VDS = 44V, ƒ = 1.0MHz  
GS = 0V, VDS = 0V to 44V  
Coss eff.  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
I
I
Continuous Source Current  
–––  
–––  
25  
MOSFET symbol  
D
S
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
–––  
–––  
100  
G
SM  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
52  
1.3  
78  
V
T = 25°C, I = 15A, V = 0V  
SD  
J S GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns T = 25°C, I = 15A, VDD = 28V  
J F  
rr  
di/dt = 100A/μs  
Q
t
82  
120  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
 Repetitive rating; pulse width limited by  
max. junction temperature.  
‚ Limited by TJmax, starting TJ = 25°C,  
Coss eff. is a fixed capacitance that gives the same charging time  
as Coss while VDS is rising from 0 to 80% VDSS  
.
† Limited by TJmax ' see Fig 12a, 12b, 15, 16 for typical repetitive  
avalanche performance.  
L = 0.55mH, RG = 25Ω, IAS = 15A, VGS =10V.  
ƒ ISD 25A, di/dt 290A/μs, VDD V(BR)DSS  
,
‡ This value determined from sample failure population. 100%  
tested to this value in production.  
TJ 175°C.  
„ Pulse width 300μs; duty cycle 2%.  
ˆ When mounted on 1" square PCB (FR-4 or G-10 Material). For  
recommended footprint and soldering techniques refer to  
application note #AN-994.  
‰ R is measured at TJ of approximately 90°C.  
θ
2
www.irf.com  
AUIRLR3105  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification.  
IR’s Industrial and Consumer qualification level is granted by  
extension of the higher Automotive level.  
Moisture Sensitivity Level  
D-Pak  
N/A  
Class M2(+/- 200V )†††  
Machine Model  
(per AEC-Q101-002)  
Class H1A(+/- 500V )†††  
(per AEC-Q101-001)  
Human Body Model  
ESD  
Class C5(+/- 2000V )†††  
(per AEC-Q101-005)  
Charged Device  
Model  
Yes  
RoHS Compliant  
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.  
††  
††† Highest passing voltage  
www.irf.com  
3
AUIRLR3105  
100  
10  
1
1000  
VGS  
VGS  
15V  
10V  
5.0V  
3.0V  
2.7V  
2.5V  
2.25V  
TOP  
TOP  
15V  
10V  
5.0V  
3.0V  
2.7V  
2.5V  
2.25V  
100  
10  
BOTTOM2.0V  
BOTTOM2.0V  
1
2.0V  
0.1  
0.01  
2.0V  
20μs PULSE WIDTH  
Tj = 175°C  
20μs PULSE WIDTH  
Tj = 25°C  
0.1  
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000.00  
30  
T
= 175°C  
T
= 25°C  
J
J
25  
20  
15  
10  
5
100.00  
10.00  
1.00  
T
= 175°C  
J
T
= 25°C  
J
0.10  
V
= 25V  
V
= 25V  
DS  
20μs PULSE WIDTH  
DS  
20μs PULSE WIDTH  
0.01  
0
2.0  
4.0  
6.0  
8.0  
0
10  
20  
30  
40  
V
, Gate-to-Source Voltage (V)  
I
Drain-to-Source Current (A)  
GS  
D,  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
Vs. Drain Current  
4
www.irf.com  
AUIRLR3105  
1600  
1200  
800  
400  
0
20  
16  
12  
8
V
C
= 0V,  
f = 1 MHZ  
GS  
I = 15A  
D
= C + C  
,
C
ds  
SHORTED  
iss  
gs  
gd  
V
= 44V  
DS  
C
= C  
rss  
gd  
VDS= 28V  
VDS= 11V  
C
= C + C  
oss  
ds  
gd  
Ciss  
Coss  
Crss  
4
FOR TEST CIRCUIT  
SEE FIGURE 13  
0
0
10  
G
20  
30  
40  
1
10  
100  
Q
Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
100.0  
10.0  
1.0  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R (on)  
DS  
T
= 175°C  
J
100μsec  
1msec  
T
= 25°C  
J
1
10msec  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
V
= 0V  
GS  
0.1  
0.1  
1
10  
100  
1000  
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8  
, Source-toDrain Voltage (V)  
V
, Drain-toSource Voltage (V)  
V
DS  
SD  
Fig 8. Maximum Safe Operating Area  
nce  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
www.irf.com  
5
AUIRLR3105  
30  
25  
20  
15  
10  
5
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
25A  
=
I
D
V
= 10V  
GS  
0
-60 -40 -20  
0
20 40  
60 80 100 120 140 160 180  
°
25  
50  
75  
100  
125  
150  
175  
°
, Case Temperature ( C)  
T , Junction Temperature  
(
C)  
T
J
C
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current Vs.  
Vs. Temperature  
Case Temperature  
10  
D = 0.50  
0.20  
1
0.10  
0.05  
SINGLE PULSE  
(THERMAL RESPONSE)  
P
DM  
0.02  
0.01  
0.1  
t
1
t
2
Notes:  
1. Duty factor D =  
t
/ t  
1
2
2. Peak T  
= P  
x
Z
+ T  
J
DM  
thJC  
C
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRLR3105  
15V  
100  
80  
60  
40  
20  
0
I
D
TOP  
6.1A  
11A  
15A  
DRIVER  
+
L
V
DS  
BOTTOM  
D.U.T  
AS  
R
G
V
DD  
-
I
A
V
20V  
GS  
Ω
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
°
( C)  
150  
175  
Starting Tj, Junction Temperature  
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
Vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
2.0  
V
G
I
= 250μA  
D
1.5  
1.0  
0.5  
0.0  
Charge  
Fig 13a. Basic Gate Charge Waveform  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2μF  
12V  
.3μF  
+
V
DS  
D.U.T.  
-
-75 -50 -25  
0
25 50 75 100 125 150 175  
, Temperature ( °C )  
V
GS  
T
J
3mA  
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage Vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRLR3105  
1000  
Duty Cycle = Single Pulse  
100  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming  
Tj = 25°C due to  
Δ
0.01  
avalanche losses. Note: In no  
case should Tj be allowed to  
exceed Tjmax  
10  
0.05  
0.10  
1
0.1  
1.0E-07  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current Vs.Pulsewidth  
70  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
TOP  
BOTTOM 50% Duty Cycle  
= 15A  
Single Pulse  
60  
50  
40  
30  
20  
10  
0
I
D
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. ΔT = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
Vs. Temperature  
8
www.irf.com  
AUIRLR3105  
Driver Gate Drive  
P.W.  
P.W.  
D =  
Period  
D.U.T  
Period  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRLR3105  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak Part Marking Information  
PartNumber  
AULR3105  
DateCode  
Y= Year  
WW= Work Week  
A=Automotive,LeadFree  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRLR3105  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
www.irf.com  
11  
AUIRLR3105  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Tube  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Quantity  
75  
2000  
3000  
3000  
AUIRLR3105  
Dpak  
AUIRLR3105  
AUIRLR3105TR  
AUIRLR3105TRL  
AUIRLR3105TRR  
12  
www.irf.com  
AUIRLR3105  
IMPORTANTNOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its  
subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and  
other changes to its products and services at any time and to discontinue any product or services without  
notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific  
requirements with regards to product discontinuance and process change notification. All products are sold  
subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with IR’s standard warranty. Testing and other quality control techniques are used to the extent  
IR deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
IR assumes no liability for applications assistance or customer product design. Customers are respon-  
sible for their products and applications using IR components. To minimize the risks with customer  
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that product or service voids all express and any implied warranties for the associated IR product or service  
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IR products are neither designed nor intended for use in automotive applications or environments unless  
the specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a  
part number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-  
designated products in automotive applications, IR will not be responsible for any failure to meet such  
requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
13  

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