AUIRLR3410 [INFINEON]

HEXFET Power MOSFET; HEXFET功率MOSFET
AUIRLR3410
型号: AUIRLR3410
厂家: Infineon    Infineon
描述:

HEXFET Power MOSFET
HEXFET功率MOSFET

晶体 晶体管 功率场效应晶体管
文件: 总12页 (文件大小:247K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97491  
AUTOMOTIVE GRADE  
AUIRLR3410  
Features  
Advanced Planar Technology  
HEXFET® Power MOSFET  
Low On-Resistance  
D
Dynamic dV/dT Rating  
175°C Operating Temperature  
Fast Switching  
V(BR)DSS  
RDS(on) max.  
ID  
100V  
105m  
17A  
G
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to  
Tjmax  
S
Lead-Free, RoHS Compliant  
Automotive Qualified *  
D
Description  
SpecificallydesignedforAutomotiveapplications,  
this Stripe Planar design of HEXFET® Power  
MOSFETsutilizesthelatestprocessingtechniques  
toachievelowon-resistancepersiliconarea. This  
benefit combined with the fast switching speed  
andruggedizeddevicedesignthatHEXFETpower  
MOSFETs are well known for, provides the  
designer with an extremely efficient and reliable  
device for use in Automotive and a wide variety of  
other applications.  
S
G
D-Pak  
AUIRLR3410  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the  
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
17  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Units  
I
I
I
@ T = 25°C  
C
D
D
12  
A
@ T = 100°C  
C
60  
Pulsed Drain Current  
DM  
79  
P
@T = 25°C Power Dissipation  
W
W/°C  
V
D
C
0.53  
± 16  
150  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS  
IAR  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
9.0  
EAR  
dv/dt  
7.9  
Repetitive Avalanche Energy  
Peak Diode Recovery  
mJ  
V/ns  
5.0  
-55 to + 175  
T
T
Operating Junction and  
J
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case )  
°C  
STG  
300  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.9  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
50  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
04/12/2010  
AUIRLR3410  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
100 ––– –––  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
V
V(BR)DSS/ TJ  
RDS(on)  
VGS(th)  
Breakdown Voltage Temp. Coefficient ––– 0.122 ––– V/°C Reference to 25°C, ID = 1mA  
–––  
–––  
–––  
1.0  
––– 0.105  
––– 0.125  
––– 0.155  
VGS = 10V, ID = 10A  
VGS = 5.0V, ID = 10A  
VGS = 4.0V, ID = 9.0A  
VDS = VGS, ID = 250µA  
VDS = 25V, ID = 9.0A  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
–––  
–––  
–––  
–––  
2.0  
–––  
25  
V
S
gfs  
IDSS  
Forward Transconductance  
Drain-to-Source Leakage Current  
7.7  
–––  
–––  
–––  
–––  
µA  
V
DS = 100V, VGS = 0V  
250  
100  
VDS = 80V, VGS = 0V, TJ = 150°C  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA VGS = 16V  
VGS = -16V  
––– -100  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units Conditions  
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
7.2  
53  
34  
4.8  
20  
ID = 9.0A  
nC VDS = 80V  
VGS = 5.0V  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
VDD = 50V  
ID = 9.0A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
30  
ns RG = 6.0 Ω  
VGS = 5.0V  
26  
LD  
D
S
Internal Drain Inductance  
4.5  
Between lead,  
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
Ciss  
Coss  
Crss  
Input Capacitance  
–––  
–––  
–––  
800  
160  
90  
–––  
–––  
–––  
VGS = 0V  
Output Capacitance  
VDS = 25V  
ƒ = 1.0MHz  
Reverse Transfer Capacitance  
pF  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
I
I
Continuous Source Current  
–––  
–––  
17  
MOSFET symbol  
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
G
–––  
–––  
60  
SM  
S
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
140  
1.3  
V
T = 25°C, I = 9.0A, V = 0V  
SD  
J S GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
210  
ns T = 25°C, I = 9.0A  
J F  
rr  
di/dt = 100A/µs  
Q
t
740 1100  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
† This is applied for LS of D-PAK is measured between  
 Repetitive rating; pulse width limited by  
max. junction temperature. ( See fig.11 )  
‚ VDD = 25V, starting TJ = 25°C, L = 3.1mH  
RG = 25, IAS = 9.0A. (See Figure 12)  
ƒ ISD 9.0A, di/dt 540A/µs, VDD V(BR)DSS, TJ 175°C  
„ Pulse width 300µs; duty cycle 2%.  
Uses IRL530N data and test conditions.  
lead and center of die contact  
‡ When mounted on 1" square PCB (FR-4 or G-10  
Material ). For recommended footprint and soldering  
techniques refer to application note #AN-994.  
ˆ R is measured at Tj approximately 90°C.  
θ
2
www.irf.com  
AUIRLR3410  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification. IR’s  
Industrial and Consumer qualification level is granted by extension of the  
higher Automotive level.  
Moisture Sensitivity Level  
D-PAK  
MSL1  
Machine Model  
Class M4  
AEC-Q101-002  
Class H1C  
AEC-Q101-001  
Class C5  
Human Body Model  
ESD  
Charged Device  
Model  
AEC-Q101-005  
Yes  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
www.irf.com  
3
AUIRLR3410  
100  
10  
1
100  
VGS  
15V  
VGS  
TOP  
TOP  
15V  
12V  
10V  
8.0V  
6.0V  
4.0V  
3.0V  
12V  
10V  
8.0V  
6.0V  
4.0V  
3.0V  
BOTTOM 2.5V  
BOTTOM 2.5V  
10  
2.5V  
1
2.5V  
20µs PULSE WIDTH  
20µs PULSE WIDTH  
T
= 175°C  
T
= 25°C  
J
J
0.1  
0.1  
0.1  
A
A
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 2. Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
I
= 15A  
D
TJ = 25°C  
TJ= 175°C  
10  
1
V DS= 50V  
20µs PULSE WIDTH  
10A  
V
= 10V  
GS  
0.1  
A
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
2
3
4
5
6
7
8
9
T , Junction Temperature (°C)  
VGS , Gate-to-Source Voltage (V)  
J
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
4
www.irf.com  
AUIRLR3410  
1400  
1200  
1000  
800  
600  
400  
200  
0
15  
12  
9
V
C
C
C
= 0V,  
f = 1MHz  
I
= 9.0A  
D
GS  
iss  
rss  
oss  
= C + C  
,
C
SHORTED  
V
V
V
= 80V  
= 50V  
= 20V  
gs  
gd  
ds  
DS  
= C  
gd  
DS  
DS  
= C + C  
ds  
gd  
C
C
iss  
6
oss  
C
rss  
3
FOR TEST CIRCUIT  
SEE FIGURE 13  
0
A
A
1
10  
100  
0
10  
20  
30  
40  
50  
V
, Drain-to-Source Voltage (V)  
Q , Total Gate Charge (nC)  
DS  
G
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
1
1000  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
T = 175°C  
J
100  
10  
1
10µs  
T = 25°C  
J
100µs  
1ms  
T
T
= 25°C  
C
J
= 175°C  
Single Pulse  
V
= 0V  
10ms  
100  
GS  
A
A
1000  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1
10  
V
, Drain-to-Source Voltage (V)  
V
, Source-to-Drain Voltage (V)  
DS  
SD  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
www.irf.com  
5
AUIRLR3410  
20  
15  
10  
5
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
5.0V  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
0
25  
50  
75  
100  
125  
150  
175  
°
T , Case Temperature ( C)  
C
10%  
V
GS  
Fig 9. Maximum Drain Current Vs.  
t
t
r
t
t
f
d(on)  
d(off)  
Case Temperature  
Fig 10b. Switching Time Waveforms  
10  
D = 0.50  
0.20  
1
0.10  
0.05  
P
2
DM  
0.1  
0.02  
0.01  
SINGLE PULSE  
(THERMAL RESPONSE)  
t
1
t
2
Notes:  
1. Duty factor D =  
t / t  
1
2. Peak T =P  
x Z  
+ T  
C
J
DM  
thJC  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRLR3410  
350  
300  
250  
200  
150  
100  
50  
I
D
TOP  
3.7A  
6.4A  
BOTTOM 9.0A  
15V  
DRIVER  
+
L
V
DS  
D.U.T  
R
G
V
DD  
-
I
A
AS  
10V  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
= 25V  
50  
DD  
0
A
175  
25  
75  
100  
125  
150  
Starting T , Junction Temperature (°C)  
V
(BR)DSS  
J
t
p
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
I
AS  
Current Regulator  
Same Type as D.U.T.  
Fig 12b. Unclamped Inductive Waveforms  
50KΩ  
.2µF  
12V  
.3µF  
Q
G
+
5.0 V  
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13a. Basic Gate Charge Waveform  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRLR3410  
Peak Diode Recovery dv/dt Test Circuit  
+
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
D.U.T  
ƒ
-
+
‚
-
„
-
+

RG  
dv/dt controlled by RG  
+
-
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
VDD  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
V
=10V  
*
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 14. For N-Channel HEXFETS  
8
www.irf.com  
AUIRLR3410  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak Part Marking Information  
Part Number  
AUIRLR3410  
Date Code  
Y= Year  
WW= Work Week  
A= Automotive  
IR Logo  
YWWA  
XX or XX  
Lot Code  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
9
AUIRLR3410  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRLR3410  
Ordering Information  
Base part  
Package Type  
Standard Pack  
Form  
Complete Part Number  
Quantity  
75  
2000  
3000  
3000  
AUIRLR3410  
Dpak  
Tube  
AUIRLR3410  
AUIRLR3410TR  
AUIRLR3410TRL  
AUIRLR3410TRR  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
www.irf.com  
11  
AUIRLR3410  
IMPORTANT NOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries  
(IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to  
its products and services at any time and to discontinue any product or services without notice. Part numbers  
designated with the “AU” prefix follow automotive industry and / or customer specific requirements with regards  
to product discontinuance and process change notification. All products are sold subject to IR’s terms and  
conditions of sale supplied at the time of order acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with IR’s standard warranty. Testing and other quality control techniques are used to the extent IR  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
IR assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using IR components. To minimize the risks with customer products and  
applications, customers should provide adequate design and operating safeguards.  
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alterations is an unfair and deceptive business practice. IR is not responsible or liable  
for such altered documentation. Information of third parties may be subject to additional restrictions.  
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that  
product or service voids all express and any implied warranties for the associated IR product or service and is  
an unfair and deceptive business practice. IR is not responsible or liable for any such statements.  
IR products are not designed, intended, or authorized for use as components in systems intended for surgical  
implantintothebody,orinotherapplicationsintendedtosupportorsustainlife,orinanyotherapplicationinwhich  
the failure of the IR product could create a situation where personal injury or death may occur. Should Buyer  
purchaseoruseIRproductsforanysuchunintendedorunauthorizedapplication, Buyershallindemnifyandhold  
International Rectifier and its officers, employees, subsidiaries, affiliates, and distributors harmless against all  
claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any  
claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges  
that IR was negligent regarding the design or manufacture of the product.  
IR products are neither designed nor intended for use in military/aerospace applications or environments unless  
the IR products are specifically designated by IR as military-grade or “enhanced plastic.” Only products  
designated by IR as military-grade meet military specifications. Buyers acknowledge and agree that any such  
use of IR products which IR has not designated as military-grade is solely at the Buyer’s risk, and that they are  
solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless the  
specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number  
including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated products  
in automotive applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
233 Kansas St., El Segundo, California 90245  
Tel: (310) 252-7105  
12  
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