F2976 [IDT]
High Linearity Broadband SP2T 5MHz to 10GHz;
| 型号： | F2976 |
| 厂家： | 
INTEGRATED DEVICE TECHNOLOGY |
| 描述： | High Linearity Broadband SP2T 5MHz to 10GHz |
| 文件： | 总24页 (文件大小：3997K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Linearity Broadband SP2T
5MHz to 10GHz
F2976
Datasheet
Description
Features (75ꢀ)
The F2976 is a singleꢀpole doubleꢀthrow (SP2T) reflective RF
switch featuring high linearity and wide bandwidth. This device is
optimized from 5MHz to 1.8GHz to support downstream cable
modem future migration for DOCSIS 3.1 applications, and operates
at up to 10GHz to support a multitude of wireless RF applications.
Superb performance is achieved when used in either 50ꢁ or 75ꢁ
terminating impedance applications.
ꢀ
Low insertion loss:
ꢀ 0.23dB at 204MHz
ꢀ 0.34dB at 1.8GHz
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
High Isolation: 40dB at 1.8GHz
P0.1dB compression of +37dBm at 204MHz
Second Harmonic: ꢀ100dBc at 204MHz
Third Harmonic: ꢀ120dBc at 204MHz
Composite Second Order Distortion > 100dBc
Composite Triple Beat Distortion > 100dBc
The F2976 uses a single positive supply voltage of either +3.3V or
+5.0V and is compatible with either 1.8V or 3.3V control logic.
Competitive Advantage
Features (50ꢀ)
The F2976 provides extremely low insertion loss across the entire
bandwidth while providing superb distortion performance.
ꢀ
Low insertion loss:
ꢀ 0.40dB at 2.4GHz
ꢀ 0.55dB at 8GHz
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Optimized for DOCSIS 3.1 applications up to 1.8GHz
Optimized for WiꢀFi applications up to 5.9GHz
Low insertion loss
High isolation
Fast switching
ꢀ
ꢀ
High Isolation:
ꢀ 34dB at 2.4GHz
High Linearity:
ꢀ IIP2 +125dBm at 2.4GHz
ꢀ IIP3 +77dBm at 2.4GHz
P0.1dB compression of +40dBm at 2.4GHz
Second Harmonic: ꢀ100dBc at 2.4GHz
Third Harmonic: ꢀ110dBc at 2.4GHz
No external matching required
ꢀ
ꢀ
ꢀ
Typical Applications
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Broadband Cable DOCSIS 3.0 / 3.1
Set top box
CATV filter bank switching
WiꢀFi
Cellular BTS
General purpose
Block Diagram
Figure 1. Block Diagram
RFC
General Features
ꢀ
ꢀ
ꢀ
ꢀ
Supply voltage: +2.5V to +5.25V
1.8V and 3.3V compatible control logic
2mm x 2mm, 12ꢀpin TQFN package
ꢀ40°C to +105°C operating temperature range
RF1
RF2
LS
VCTL
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Pin Assignments
Figure 2. Pin Assignments for 2mm x 2mm x 0.5mm 12ꢁpin TQFN, NEG12 – Top View
Vcc
LS
VCTL
12
11
10
GND
1
GND
9
RF2
2
3
RF1
F2976
8
7
GND
GND
EP
4
5
6
RFC
GND
GND
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1
2
GND
RF2
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Logic control pin (see Table 9).
3
GND
GND
RFC
GND
GND
RF1
4
5
6
7
8
9
GND
VCTL
10
Truth Table select pin. Defines VCTL logic for RF switching (see Table 9). Pin is internally pulled up to 2.5V
through a 500kꢁ resistor.
11
12
LS
Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as
possible to pin.
VCC
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
EP
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Table 2.
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC to GND
VCTL, LS
VCC
ꢀ0.3
+5.5
V
Lower of
(VCC + 0.3, 3.9)
VLOGIC
ꢀ0.3
ꢀ0.3
V
V
RF1, RF2, RFC
VRF
+0.3
30
5MHz ≤ fRF ≤ 10MHz
10MHz < fRF ≤ 25MHz
25MHz < fRF ≤ 200MHz
200MHz < fRF ≤ 6000MHz
fRF > 6000MHz
PABSCW1
PABSCW2
PABSCW3
PABSCW4
PABSCW5
PABSPK1
PABSPK2
PABSPK3
PABSPK4
PABSPK5
TJMAX
Maximum Input CW
32
Power, 50ꢁ, TEP = 25°C,
Vcc = 5.25V (any port,
insertion loss state) [a,b]
33
dBm
dBm
34
33
5MHz ≤ fRF ≤ 10MHz
10MHz < fRF ≤ 25MHz
25MHz < fRF ≤ 200MHz
200MHz < fRF ≤ 6000MHz
fRF > 6000MHz
35
Maximum Peak Power,
50ꢁ, TEP = 25°C,
Vcc = 5.25V (any port,
insertion loss state) [a, b, c]
37
38
39
38
Maximum Junction Temperature
Storage Temperature Range
+140
+150
+260
°C
°C
°C
TST
ꢀ65
Lead Temperature (soldering, 10s)
TLEAD
Electrostatic Discharge – HBM
(JEDEC/ESDA JSꢀ001ꢀ2012)
2500
(Class 2)
VESDHBM
VESDCDM
V
V
Electrostatic Discharge – CDM
(JEDEC 22ꢀC101F)
1000
(Class C3)
a. In a 50ꢁ system, dBmV = dBm [50ꢁ] + 47.
In a 75ꢁ system, dBmV = dBm [75ꢁ] + 48.75.
b. TEP = Temperature of the exposed paddle.
c. 5 % duty cycle of a 4.6ms period.
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F2976 Datasheet
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Symbol
Condition
Minimum
Typical
Maximum
Units
Supply Voltage
VCC
TEP
2.5
ꢀ40
3.3
5.25
+105
1.8
V
Operating Temperature Range
Exposed Paddle
°C
75ꢁ
50ꢁ
0.005
0.005
RF Frequency Range
fRF
PMAX
ZRF
GHz
10
Insertion Loss State
ZS = ZL = 50ꢁ
Maximum Operating Input Power
Port Impedance (RFC, RF1, RF2)
See Figure 3 [a] dBm
ꢁ
75ꢁ System
50ꢁ System
75
50
a. In a 50ꢁ system, dBmV = dBm [50ꢁ] + 47. In a 75ꢁ system, dBmV = dBm [75ꢁ] + 48.75.
Figure 3. Maximum Operating RF Input Power (ZS = ZL = 50ꢂ)
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F2976 Datasheet
General Specifications
Table 4.
General Specifications
See F2976 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, LS = HIGH, single tone signal
applied at RF1 or RF2 and measured at RFC, unless otherwise noted.
Parameter
Symbol
Condition
VCTL, LS pins
Minimum
Typical
Maximum
Units
Lower of
( VCC, 3.6 )
Logic Input High Threshold
VIH
1.17 [b]
V
Logic Input Low Threshold
Logic Current
VIL
IIH, IIL
ICC
VCTL, LS pins
ꢀ0.3
-10 [a]
0.6
+10
150
25
V
VCTL, LS pins (each pin)
ꢂA
ꢂA
kHz
DC Current (VCC)
Switching Rate
80
SWRATE
Peak transient during
switching. ZS = ZL = 75ꢁ.
Measured with 20ns rise time,
0V to 3.3V (3.3V to 0V)
Maximum Video FeedꢀThrough,
RFC Port
VIDFT
5
mVpꢀp
ꢂs
control pulse applied to VCTL.
Switching Time [c]
SWTIME
50% VCTL to 90% or 10% RF
1.5
3
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Measured at fRF = 1GHz.
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F2976 Datasheet
Electrical Characteristics
Table 5.
Electrical Characteristics ꢁ 75ꢂ SPECIFICATION
See F2976 75ꢁ Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 75ꢁ, LS = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are deꢀembedded, unless otherwise noted.
Parameter
Symbol
Condition
fRF = 5MHz
Minimum
Typical
Maximum
Units
0.20
0.23
0.32
0.34
77
5MHz < fRF ≤ 204MHz
204MHz < fRF ≤ 1.2GHz
1.2GHz < fRF ≤ 1.8GHz
fRF = 5MHz
0.43 [b]
0.52
Insertion Loss (RFC to RF1, RF2)
IL
dB
0.54
5MHz < fRF ≤ 204MHz
204MHz < fRF ≤ 1.2GHz
1.2GHz < fRF ≤ 1.8GHz
fRF = 5MHz
60
Isolation (All Paths)
ISO1
RL
dB
dB
44
40
35
5MHz < fRF ≤ 204MHz
204MHz < fRF ≤ 1.2GHz
1.2GHz < fRF ≤ 1.8GHz
fIN = 27MHz POUT = 20dBm [c]
fIN = 204MHz POUT = 20dBm
fIN = 800MHz POUT = 20dBm
fIN = 17MHz POUT = 20dBm
fIN = 204MHz POUT = 20dBm
fIN = 800MHz POUT = 20dBm
fRF = 5MHz
30
Return Loss (RFC, RF1, RF2)
(Insertion Loss States)
17
16
ꢀ80
ꢀ100
ꢀ120
ꢀ95
ꢀ120
ꢀ115
37
ꢀ70
ꢀ90
2nd Harmonic
3rd Harmonic
H2
H3
dBc
dBc
ꢀ110
ꢀ80
ꢀ105
ꢀ100
Input 0.1dB Compression Point [d]
(RFC to RF1, RF2)
P0.1dB
fRF = 204MHz
37
dBm
dBc
fRF = 1.8GHz
38
Composite Second Order
Composite Triple Beat
CSO
CTB
>100
>100
41dBmV / channel
137 channels [e]
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. dBmV = dBm [75ꢁ] + 48.75.
d. The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum operating RF input
power levels.
e. Total power = ꢀ7.75 dBm [75ꢁ] + 10*log (137) = +13.62 dBm [75ꢁ].
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Electrical Characteristics
Table 6.
Electrical Characteristics ꢁ 50ꢂ SPECIFICATION
See F2976 50ꢁ Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 50ꢁ, LS = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are deꢀembedded, unless otherwise noted.
Parameter
Symbol
Condition
RF = 5MHz
Minimum
Typical
Maximum
0.45 [b]
0.53
Units
f
0.25
0.33
0.36
0.40
0.45
0.55
0.65
0.80
48
5MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz [c]
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
6GHz < fRF ≤ 8GHz
8GHz < fRF ≤ 9GHz
9GHz < fRF ≤ 10GHz
5MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
6GHz < fRF ≤ 8GHz
8GHz < fRF ≤ 10GHz
5MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
6GHz < fRF ≤ 8GHz
8GHz < fRF ≤ 10GHz
5MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
6GHz < fRF ≤ 8GHz
8GHz < fRF ≤ 9GHz
9GHz < fRF ≤ 10GHz
0.56 [a]
Insertion Loss
(RFC to RF1, RF2)
IL
dB
43
36
31
42
37
Isolation
ISO1
ISO2
dB
dB
(RFC to RF1, RF2)
27
22
18
40
33
29
45
38
34
Isolation
(RF1 to RF2, RF2 to RF1)
26
21
18
28
26
26
Return Loss (RFC, RF1, RF2)
(Insertion loss states)
RL
25
dB
23
18
16
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Minimum or maximum specification guaranteed by test at 2GHz and by design characterization over the whole
frequency range.
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Electrical Characteristics
Table 7.
Electrical Characteristics ꢁ 50ꢂ SPECIFICATION
See F2976 50ꢁ Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 50ꢁ, LS = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are deꢀembedded, unless otherwise noted.
Parameter
Symbol
Condition
fRF = 2.4GHz
Minimum
Typical
40
Maximum
Units
Input 0.1dB Compression [c]
P0.1dB
fRF = 6.0GHz
fRF = 8.0GHz
40
dBm
40
fRF = 2.4GHz
PIN = +24dBm/tone
100MHz spacing
Input IP3
(RF1, RF2 to RFC)
IIP3
IIP2
77
dBm
dBm
f1 = 700MHz
f2 = 1.7GHz
PIN = +24dBm/tone
Measure 2.4GHz product
125
Input IP2
(RF1, RF2 to RFC)
f1 = 2.4GHz
f2 = 3.5GHz
PIN = +24dBm/tone
Measure 5.9GHz product
120
fIN = 2.4GHz, PIN = +24dBm
fIN = 5.9GHz, PIN = +24dBm
fIN = 2.4GHz, PIN = +24dBm
fIN = 5.9GHz, PIN = +24dBm
ꢀ100
ꢀ90
ꢀ90 [b]
ꢀ80
Second Harmonic
(RF1, RF2 to RFC)
H2
H3
dBc
dBc
ꢀ110
ꢀ100
ꢀ95
Third Harmonic
(RF1, RF2 to RFC)
ꢀ85
fOUT ≥ 5MHz
All unused ports terminated
PSPUR1
PSPUR2
ꢀ133
ꢀ120
Spurious Output
(No RF Applied)
dBm
fOUT < 5 MHz
All unused ports terminated
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum RF operating input
power levels.
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Thermal Characteristics
Table 8.
Package Thermal Characteristics
Parameter
Symbol
Value
Units
Junction to Ambient Thermal Resistance
θJA
102
°C/W
Junction to Case Thermal Resistance
(Case is defined as the exposed paddle)
θJC_BOT
56
°C/W
Moisture Sensitivity Rating (Per JꢀSTDꢀ020)
MSL 1
Typical Operating Conditions (TOCs)
Unless otherwise noted:
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
VCC = +3.3V
LS = HIGH
ZL = ZS = 75ꢁ
ZL = ZS = 50ꢁ
All temperatures are referenced to the exposed paddle
Evaluation Kit traces and connector losses are deꢀembedded
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Typical Performance Characteristics ꢁ 75ꢀ Performance
Figure 4. RF1 to RFC Insertion Loss
Figure 5. RF2 to RFC Insertion Loss
0.00
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
-0.45
-0.50
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
-0.45
-0.50
25 C / 5.25 V
105 C / 5.25 V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Frequency (GHz)
Figure 6. RF1 to RFC Isolation [RF2 On State]
Figure 7. RF2 to RFC Isolation [RF1 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Frequency (GHz)
Figure 8. RF1 to RF2 Isolation [RF1 On State]
Figure 9. RF1 to RF2 Isolation [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Frequency (GHz)
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F2976 Datasheet
Typical Performance Characteristics ꢁ 75ꢀ Performance
Figure 10. RFC Return Loss [RF1 On State]
Figure 11. RFC Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-10
-15
-20
-25
-30
-35
-40
-5
-10
-15
-20
-25
-30
-35
-40
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Frequency (GHz)
Figure 12. RF1 Return Loss [RF1 On State]
Figure 13. RF2 Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-10
-15
-20
-25
-30
-35
-40
-5
-10
-15
-20
-25
-30
-35
-40
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Frequency (GHz)
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F2976 Datasheet
Typical Performance Characteristics ꢁ 50ꢀ Performance
Figure 14. RF1 to RFC Insertion Loss
Figure 15. RF2 to RFC Insertion Loss
0.0
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40C / 2.5V
25C / 2.5V
105C / 2.5V
-40C / 3.3V
25C / 3.3V
105C / 3.3V
-40C / 5.25V
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
25C / 5.25V
105C / 5.25V
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
Figure 16. RF1 to RFC Isolation [RF2 On State]
Figure 17. RF2 to RFC Isolation [RF1 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
Figure 18. RF1 to RF2 Isolation [RF1 On State]
Figure 19. RF1 to RF2 Isolation [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
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F2976 Datasheet
Typical Performance Characteristics ꢁ 50ꢀ Performance
Figure 20. RFC Return Loss [RF1 On State]
Figure 21. RFC Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
Figure 22. RF1 Return Loss [RF1 On State]
Figure 23. RF2 Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
Figure 24. Switching Time
Figure 25. Switching Time
[Isolation to Insertion Loss State]
[Insertion Loss to Isolation State]
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F2976 Datasheet
Control Mode
Table 9.
Switch Control Truth Table
VCTL (pin 10)
HIGH
LS (pin 11)
HIGH
Switch State
RFC to RF2 Insertion Loss State
RFC to RF1 Insertion Loss State
RFC to RF1 Insertion Loss State
RFC to RF2 Insertion Loss State
LOW
HIGH
HIGH
LOW
LOW
LOW
Application Information
Power Supplies
A common VCC power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to
minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail.
Supply voltage change or transients should have a slew rate smaller than 1V / 20ꢂs. In addition, all control pins should remain at 0V (+/ꢀ0.3V)
while the supply voltage ramps up or while it returns to zero.
Control Pin Interface
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit
at the input of each control pin is recommended. This applies to control pins 7 and 8 as shown below.
Figure 26. Control Pin Interface Schematic
5k
Ω
LS
2 pF
2 pF
5kΩ
VCTL
12
11
5
10
GND
1
GND
9
RF2
2
3
RF1
8
7
GND
GND
EP
4
6
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Rev O April 19, 2017
F2976 Datasheet
75ꢀ Evaluation Kit Picture
Figure 27. Top View (75ꢀ)
Figure 28. Bottom View (75ꢀ)
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
F2976 Datasheet
50ꢀ Evaluation Kit Picture
Figure 29. Top View (50ꢀ)
Figure 30. Bottom View (50ꢀ)
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
F2976 Datasheet
75ꢀ Evaluation Kit / Applications Circuit
Figure 31. Electrical Schematic (75ꢀ)
Note: The F2976 75ꢃ EVKit reuses the 75ꢃ PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
F2976 Datasheet
50ꢀ Evaluation Kit / Applications Circuit
Figure 32. Electrical Schematic (50ꢀ)
Note: The F2976 50ꢃ EVKit reuses the 50ꢃ PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
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F2976 Datasheet
Table 10. 75ꢀ Bill of Material (BOM)
Part Reference
QTY
Description
Manufacturer Part #
Manufacturer
C1
C2, C4
C3
1
2
1
2
5
1
1
1
0.1ꢂF ±10%, 16V, X7R, Ceramic Capacitor (0402)
100pF ±5% 50V, C0G, Ceramic Capacitor (0402)
0.01ꢂF ±5% 50V, X7R, Ceramic Capacitor (0603)
100ꢃ 1/10W, Resistor (0402)
GRM155R71C104KA88D
GRM1555C1H101JA01D
GRM188R71H103JA01D
ERJꢀ2RKF1000X
222181
Murata
Murata
Murata
R2, R3
J1 – J5
J6
Panasonic
Amphenol RF
Amphenol FCI
IDT
FꢀType Edge Mount
Conn Header Vert 5x1 Pos Gold
68002ꢀ205HLF
U1
SP2T Switch 2mm x 2mm 12ꢀpin TQFN
Printed Circuit Board [a]
F2976NEGK
F2972 75ꢃ PCB
IDT
a. The F2976 75ꢃ EVKit reuses the 75ꢃ PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
Table 11. 50ꢀ Bill of Material (BOM)
Part Reference
QTY
Description
Manufacturer Part #
Manufacturer
C1 – C7
R1– R3
J1 – J5
J6
0
3
5
1
Not Installed (0402)
0ꢃ 1/10 W, Resistor (0402)
SMA Edge Mount
ERJꢀ2GE0R00X
142ꢀ0761ꢀ881
68602ꢀ210HLF
Panasonic
Cinch Connectivity
Amphenol FCI
Conn Header 10 Pos 0.100” Str 15 Au
TP1, TP2, TP3, TP4,
TP5
0
Not Installed Test Point Loop
U1
1
1
SP2T Switch 2mm x 2mm 12ꢀpin TQFN
Printed Circuit Board [a]
F2976NEGK
IDT
IDT
F2972 50ꢃ PCB
a. The F2976 50ꢃ EVKit reuses the 50ꢃ PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
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F2976 Datasheet
Evaluation Kit (EVKit) Operation
External Supply Setup
Set up a VCC power supply in the voltage range of 2.5V to 5.25V with the power supply output disabled.
For the 75ꢃ EVKit, connect the disabled Vcc supply connection to J6 pin 2 and GND to J6 pins 1 or 5.
For the 50ꢃ EVKit, connect the disabled Vcc supply connection to J6 pin 3 and GND to J6 pin 1, 2, 4, 6, 8, 9, or 10.
Logic Control Setup
With the logic control lines disabled set the HIGH and LOW logic levels to satisfy the levels stated in the electrical specifications table.
For the 75ꢃ EVKit, connect the disabled logic control lines to J6 EN (pin 3) and VCTL (pin 4).
For the 50ꢃ EVKit, connect the disabled logic control lines to J6 EN / LS (pin 5) and VCTL (pin 7).
See Table 9 for the logic truth table.
Turn On Procedure
Setup the supplies and EVKit as noted in the External Supply Setup and Logic Control Setup sections above.
Enable the VCC supply.
Enable the logic control signals.
Set the logic settings to achieve the desired Table 9 configuration. Note that external control logic should not be applied without VCC being
present.
Turn Off Procedure
Set the logic control pins to a logic LOW.
Disable the VCC supply.
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Package Drawings
Figure 33. Package Outline Drawing NEG12 PSCꢁ4642
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Rev O April 19, 2017
F2976 Datasheet
Recommended Land Pattern
Figure 34. Recommended Land Pattern NEG12 PSCꢁ4642
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F2976 Datasheet
Marking Diagram
Line 1 ꢀ 2976 = Abbreviated part number.
Line 2 ꢀ Y = Year code.
Line 2 ꢀ W = Work week code.
2976
YW**
Line 2 ꢀ ** = Sequential alpha for lot traceability.
Ordering Information
Orderable Part Number
Package
MSL Rating
Shipping Packaging
Temperature
F2976NEGK
F2976NEGK8
2mm x 2mm x 0.5mm 12ꢀVFQFPꢀN
2mm x 2mm x 0.5mm 12ꢀVFQFPꢀN
75ꢁ Evaluation Board
MSL1
MSL1
Cut Reel
ꢀ40°C to +105°C
ꢀ40°C to +105°C
Tape and Reel
F2976EVBIꢀ75OHM
F2976EVBIꢀ50OHM
50ꢁ Evaluation Board
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
F2976 Datasheet
Revision History
Revision
Revision Date
Description of Change
Rev O
2017ꢀAprꢀ19
Initial Release
Corporate Headquarters
Sales
Tech Support
www.IDT.com/go/support
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
1ꢀ800ꢀ345ꢀ7015 or 408ꢀ284ꢀ8200
Fax: 408ꢀ284ꢀ2775
www.IDT.com/go/sales
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,
without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability
of IDT's products for any particular purpose, an implied warranty of merchantability, or nonꢀinfringement of the intellectual property rights of others. This document is presented only as a guide and does not
convey any license under intellectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2017 Integrated Device Technology, Inc.
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Rev O April 19, 2017
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