F2977 [IDT]
High Linearity Broadband SP2T 30MHz to 6GHz;型号: | F2977 |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | High Linearity Broadband SP2T 30MHz to 6GHz |
文件: | 总18页 (文件大小:3112K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Linearity Broadband SP2T
30MHz to 6GHz
F2977
Datasheet
Description
Features
The F2977 is a 50ꢀ singleꢁpole doubleꢁthrow (SP2T) reflective RF
switch featuring high linearity and wide bandwidth. This device is
optimized from 30MHz to 6GHz to support a multitude of wireless
RF applications. The F2977 uses a single positive supply voltage
of either +3.3V or +5.0V and is compatible with either 1.8V or 3.3V
control logic.
ꢀ
Low insertion loss:
ꢀ 0.38dB at 2.4GHz
ꢀ 0.45dB at 6GHz
ꢀ
ꢀ
High Isolation:
ꢀ 39dB at 2.4GHz
High Linearity:
ꢀ IIP2 +125dBm at 2.4GHz
ꢀ IIP3 +77dBm at 2.4GHz
P0.1dB compression of +40dBm at 2.4GHz
Second Harmonic: ꢁ95dBc at 900MHz
Third Harmonic: ꢁ90dBc at 900MHz
Supply voltage: +2.7V to +5.25V
1.8V and 3.3V compatible control logic
Competitive Advantage
The F2977 provides extremely low insertion loss across the entire
bandwidth while providing superb distortion performance.
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Low insertion loss
High isolation
Low distortion
Fast switching
No external matching required
ꢁ40°C to +105°C operating temperature range
2mm x 2mm, 12ꢁpin VFQFPꢁN package
Typical Applications
Block Diagram
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Cellular BTS
Figure 1. Block Diagram
Cellular BTS small cell
Transmit / Receive switching
Post PA switching
General purpose
RFC
RF1
RF2
EN
VCTL
© 2017 Integrated Device Technology, Inc.
1
Rev O May 19, 2017
F2977 Datasheet
Pin Assignments
Figure 2. Pin Assignments for 2mm x 2mm x 0.5mm 12ꢀpin VFQFPꢀN, NEG12 – Top View
RF2
GND
GND
12
11
10
GND
1
VCC
9
RFC
GND
2
3
EN
F2977
8
7
VCTL
EP
4
5
6
RF1
GND
GND
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1
2
3
4
5
6
7
GND
RFC
GND
GND
RF1
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Logic control pin.
GND
VCTL
Active HIGH enable pin. If LOW, neither RF1 nor RF2 are connected to RFC. Pin is internally pulled up to
2.5V through a 500kꢂ resistor.
8
9
EN
Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as
possible to pin.
VCC
10
11
12
GND
RF2
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
GND
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
EP
© 2017 Integrated Device Technology, Inc.
2
Rev O May 19, 2017
F2977 Datasheet
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Table 2.
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC to GND
VCTL, EN
VCC
ꢁ0.3
+5.5
V
Lower of
(VCC + 0.3, 3.9)
VLOGIC
VRF
ꢁ0.3
ꢁ0.3
V
V
RF1, RF2, RFC
+0.3
Maximum Input CW
Power, 50ꢂ, TEP = 25°C,
30MHz ≤ fRF ≤ 200MHz
200MHz < fRF ≤ 6000MHz
30MHz ≤ fRF ≤ 200MHz
200MHz < fRF ≤ 6000MHz
PABSCW1
33
dBm
dBm
V
CC = 5.25V (any port,
PABSCW2
PABSPK1
PABSPK2
34
38
39
insertion loss state) [a]
Maximum Peak Power,
50ꢂ, TEP = 25°C,
V
CC = 5.25V (any port,
insertion loss state) [a, b]
Maximum Junction Temperature
Storage Temperature Range
TJMAX
TST
+140
+150
+260
°C
°C
°C
ꢁ65
Lead Temperature (soldering, 10s)
TLEAD
Electrostatic Discharge – HBM
(JEDEC/ESDA JSꢁ001ꢁ2012)
2500
(Class 2)
VESDHBM
VESDCDM
V
V
Electrostatic Discharge – CDM
(JEDEC 22ꢁC101F)
1000
(Class C3)
a. TEP = Temperature of the exposed paddle.
b. 5% duty cycle of a 4.6ms period.
© 2017 Integrated Device Technology, Inc.
3
Rev O May 19, 2017
F2977 Datasheet
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Symbol
Condition
Minimum
Typical
Maximum
Units
Supply Voltage
VCC
TEP
fRF
2.7
ꢁ40
3.3
5.25
+105
6
V
Operating Temperature Range
RF Frequency Range
Exposed Paddle
°C
0.030
GHz
Insertion Loss State
ZS = ZL = 50ꢂ
Maximum Operating Input Power
Port Impedance (RFC, RF1, RF2)
PMAX
ZRF
See Figure 3
dBm
ꢂ
Insertion Loss State
50
Figure 3. Maximum Operating RF Input Power (ZS = ZL = 50ꢁ)
© 2017 Integrated Device Technology, Inc.
4
Rev O May 19, 2017
F2977 Datasheet
General Specifications
Table 4.
General Specifications
See F2977 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, EN = HIGH, single tone signal
applied at RF1 or RF2 and measured at RFC, unless otherwise noted.
Parameter
Symbol
Condition
VCTL, EN pins
Minimum
Typical
Maximum
Units
Lower of
(VCC, 3.6)
Logic Input HIGH Threshold
VIH
1.17 [b]
V
Logic Input LOW Threshold
Logic Current
VIL
VCTL, EN pins
ꢁ0.3
-10 [a]
0.6
+10
150
35
V
IIH, IIL
VCTL, EN pins (each pin)
Normal Operation
Standby (EN = LOW)
ꢃA
80
20
DC Current (VCC)
Switching Rate
ICC
ꢃA
SWRATE
25
kHz
No Change
in RF Path
1.0
1.6
From Standby
State, 50% EN
to 90% RF
Startup Time
TSTRTUP
ꢃs
Change in
RF Path
Peak transient during
switching. ZS = ZL = 50ꢂ.
Measured with 20ns rise time,
0V to 3.3V (3.3V to 0V)
Maximum Video FeedꢁThrough,
RFC Port
VIDFT
12
mVpꢁp
ꢃs
control pulse applied to VCTL.
Switching Time [c]
SWTIME
50% VCTL to 90% or 10% RF
1.5
3
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Measured at fRF = 1GHz.
© 2017 Integrated Device Technology, Inc.
5
Rev O May 19, 2017
F2977 Datasheet
Electrical Characteristics
Table 5.
Electrical Characteristics
See F2977 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, ZS = ZL = 50ꢂ, EN = HIGH, single
tone signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are deꢁembedded, unless otherwise noted.
Parameter
Symbol
Condition
Minimum
Typical
Maximum
Units
30MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz [c]
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
30MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
30MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
30MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 2GHz
2GHz < fRF ≤ 3GHz
3GHz < fRF ≤ 6GHz
0.33
0.36
0.40
0.45
48
0.53 [b]
0.56 [a]
Insertion Loss
(RFC to RF1, RF2)
IL
dB
43
36
31
42
Isolation
(RFC to RF1, RF2)
ISO1
ISO2
RL
dB
dB
dB
37
27
40
33
29
45
38
Isolation
(RF1 to RF2, RF2 to RF1)
34
26
28
26
Return Loss (RFC, RF1, RF2)
(Insertion loss states)
26
25
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Minimum or maximum specification guaranteed by test at 2GHz and by design characterization over the whole
frequency range.
© 2017 Integrated Device Technology, Inc.
6
Rev O May 19, 2017
F2977 Datasheet
Electrical Characteristics
Table 6.
Electrical Characteristics
See F2977 Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, ZS = ZL = 50ꢂ, EN = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are deꢁembedded, unless otherwise noted.
Parameter
Symbol
Condition
fRF = 30MHz
Minimum
Typical
Maximum
Units
40
40
40
Input 0.1dB Compression [c]
P0.1dB
fRF = 2.4GHz
fRF = 6.0GHz
dBm
fRF = 2.4GHz
PIN = +24dBm/tone
100MHz spacing
Input IP3
(RF1, RF2 to RFC)
IIP3
IIP2
77
dBm
dBm
f1 = 700MHz
f2 = 1.7GHz
PIN = +24dBm/tone
Measure 2.4GHz product
125
Input IP2
(RF1, RF2 to RFC)
f1 = 2.4GHz
f2 = 3.5GHz
PIN = +24dBm/tone
Measure 5.9GHz product
120
fIN = 900MHz, PIN = +35dBm
fIN = 1.8GHz, PIN = +33dBm
fIN = 900MHz, PIN = +35dBm
fIN = 1.8GHz, PIN = +33dBm
ꢁ95
ꢁ86
ꢁ90
ꢁ89
ꢁ85 [b]
ꢁ76
Second Harmonic
(RF1, RF2 to RFC)
H2
H3
dBc
dBc
ꢁ75
Third Harmonic
(RF1, RF2 to RFC)
ꢁ74
fOUT ≥ 5MHz
All unused ports terminated
PSPUR1
PSPUR2
ꢁ133
ꢁ120
Spurious Output
(No RF Applied)
dBm
fOUT < 5MHz
All unused ports terminated
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum RF operating input
power levels.
© 2017 Integrated Device Technology, Inc.
7
Rev O May 19, 2017
F2977 Datasheet
Thermal Characteristics
Table 7.
Package Thermal Characteristics
Parameter
Symbol
Value
Units
Junction to Ambient Thermal Resistance
θJA
102
°C/W
Junction to Case Thermal Resistance
(Case is defined as the exposed paddle)
θJC_BOT
56
°C/W
Moisture Sensitivity Rating (Per JꢁSTDꢁ020)
MSL 1
Typical Operating Conditions (TOCs)
Unless otherwise noted:
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
VCC = +3.3V
TEP = 25°C
EN = HIGH
ZS = ZL = 50ꢂ
All temperatures are referenced to the exposed paddle
Evaluation Kit traces and connector losses are deꢁembedded
© 2017 Integrated Device Technology, Inc.
8
Rev O May 19, 2017
F2977 Datasheet
Typical Performance Characteristics [1]
Figure 4. RF1 to RFC Insertion Loss
Figure 5. RF2 to RFC Insertion Loss
0.0
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
Figure 6. RF1 to RFC Isolation [RF2 On State]
Figure 7. RF2 to RFC Isolation [RF1 On State]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
Figure 8. RF1 to RF2 Isolation [RF1 On State]
Figure 9. RF2 to RF1 Isolation [RF2 On State]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-20
-30
-40
-50
-60
-70
-80
-90
-10
-20
-30
-40
-50
-60
-70
-80
-90
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
© 2017 Integrated Device Technology, Inc.
9
Rev O May 19, 2017
F2977 Datasheet
Typical Performance Characteristics [2]
Figure 10. RFC Return Loss [RF1 On State]
Figure 11. RFC Return Loss [RF2 On State]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
Figure 12. RF1 Return Loss [RF1 On State]
Figure 13. RF2 Return Loss [RF2 On State]
0
0
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-40 C / 2.7 V
25 C / 2.7 V
105 C / 2.7 V
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Frequency (GHz)
Frequency (GHz)
Figure 14. Switching Time
Figure 15. Switching Time
[Isolation to Insertion Loss State]
[Insertion Loss to Isolation State]
© 2017 Integrated Device Technology, Inc.
10
Rev O May 19, 2017
F2977 Datasheet
Control Mode
Table 8.
Switch Control Truth Table
VCTL (pin 7)
EN (pin 8)
HIGH
Switch State
RFC to RF1 Insertion Loss State
RFC to RF2 Insertion Loss State
Standby
LOW
HIGH
HIGH
Don’t Care
LOW
Application Information
Power Supplies
A common VCC power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to
minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail.
Supply voltage change or transients should have a slew rate smaller than 1V / 20ꢃs. In addition, all control pins should remain at 0V (+/ꢁ 0.3V)
while the supply voltage ramps up or while it returns to zero.
Control Pin Interface
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit
at the input of each control pin is recommended. This applies to control pins 7 and 8 as shown below.
Figure 16. Control Pin Interface Schematic
12
11
5
10
GND
1
VCC
9
5k
Ω
RFC
GND
2
3
EN
8
7
2 pF
2 pF
EP
4
6
5kΩ
VCTL
© 2017 Integrated Device Technology, Inc.
11
Rev O May 19, 2017
F2977 Datasheet
Evaluation Kit Picture
Figure 17. Top View
Figure 18. Bottom View
© 2017 Integrated Device Technology, Inc.
12
Rev O May 19, 2017
F2977 Datasheet
Evaluation Kit / Applications Circuit
Figure 19. Electrical Schematic
© 2017 Integrated Device Technology, Inc.
13
Rev O May 19, 2017
F2977 Datasheet
Table 9.
Bill of Material (BOM)
Part Reference
C1 – C7
QTY
Description
Manufacturer Part #
Manufacturer
0
3
5
1
Not Installed (0402)
R1 – R3
J1 – J5
J6
0ꢀ 1/10W, Resistor (0402)
SMA Edge Mount
ERJꢁ2GE0R00X
142ꢁ0761ꢁ881
68602ꢁ210HLF
Panasonic
Cinch Connectivity
Amphenol FCI
Conn Header 10 Pos 0.100” Str 15 Au
TP1, TP2, TP3, TP4,
TP5
0
Not Installed Test Point Loop
U1
1
1
SP2T Switch 2mm x 2mm 12ꢁpin TQFN
Printed Circuit Board
F2977NEGK
IDT
IDT
F2972 50ꢀ PCB
Evaluation Kit (EVKit) Operation
External Supply Setup
Set up a VCC power supply in the voltage range of +2.7V to +5.25V with the power supply output disabled.
Connect the disabled VCC supply connection to J6 pin 3 and GND to J6 pin 1, 2, 4, 6, 8, 9, or 10.
Logic Control Setup
With the logic control lines disabled, set the HIGH and LOW logic levels to satisfy the levels stated in the electrical specifications table.
Connect the disabled logic control lines to J6 EN / LS (pin 5) and VCTL (pin 7).
See Table 8 for the logic truth table.
Turn On Procedure
Setup the supplies and EVKit as noted in the External Supply Setup and Logic Control Setup sections above.
Enable the VCC supply.
Enable the logic control signals.
Set the logic setting to achieve the desired Table 8 configuration. Note that external control logic should not be applied without VCC being
present.
Turn Off Procedure
Set the logic control pins to a logic LOW.
Disable the VCC supply.
© 2017 Integrated Device Technology, Inc.
14
Rev O May 19, 2017
F2977 Datasheet
Package Drawings
Figure 20. Package Outline Drawing NEG12 PSCꢀ4642
© 2017 Integrated Device Technology, Inc.
15
Rev O May 19, 2017
F2977 Datasheet
Recommended Land Pattern
Figure 21. Recommended Land Pattern NEG12 PSCꢀ4642
© 2017 Integrated Device Technology, Inc.
16
Rev O May 19, 2017
F2977 Datasheet
Marking Diagram
Line 1 ꢁ 2977 = Abbreviated part number.
Line 2 ꢁ Y = Year code.
Line 2 ꢁ W = Work week code.
2977
YW**
Line 2 ꢁ ** = Sequential alpha for lot traceability.
Ordering Information
Orderable Part Number
Package
MSL Rating
Shipping Packaging
Temperature
F2977NEGK
F2977NEGK8
F2977EVBI
2mm x 2mm x 0.5mm 12ꢁVFQFPꢁN
2mm x 2mm x 0.5mm 12ꢁVFQFPꢁN
Evaluation Board
MSL1
MSL1
Cut Reel
ꢁ40°C to +105°C
ꢁ40°C to +105°C
Tape and Reel
© 2017 Integrated Device Technology, Inc.
17
Rev O May 19, 2017
F2977 Datasheet
Revision History
Revision
Revision Date
Description of Change
Rev O
2017ꢁMayꢁ19
Initial Release
Corporate Headquarters
Sales
Tech Support
www.IDT.com/go/support
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
1ꢁ800ꢁ345ꢁ7015 or 408ꢁ284ꢁ8200
Fax: 408ꢁ284ꢁ2775
www.IDT.com/go/sales
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,
without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability
of IDT's products for any particular purpose, an implied warranty of merchantability, or nonꢁinfringement of the intellectual property rights of others. This document is presented only as a guide and does not
convey any license under intellectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2017 Integrated Device Technology, Inc.
18
Rev O May 19, 2017
相关型号:
©2020 ICPDF网 联系我们和版权申明