MC33289DWR2 [FREESCALE]
Dual High-Side Switch 40 m ohm; 双通道高边开关40兆欧型号: | MC33289DWR2 |
厂家: | Freescale |
描述: | Dual High-Side Switch 40 m ohm |
文件: | 总11页 (文件大小:503K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Document Number: MC33289
Rev. 4.0, 6/2006
Freescale Semiconductor
Advance Information
Dual High-Side Switch 40 mΩ
The 33289 is a Dual High Side Switch (DHSS) dedicated for use
in automotive applications. It is designed to drive typical inductive
loads such as solenoid valves.
33289
This device consists of two independent 40 mΩ RDSON MOSFET
channels plus corresponding control circuitry in a surface mount
package. The 33289 can be interfaced directly to a microcontroller for
input control and monitoring of diagnostic output.
DUAL HIGH-SIDE SWITCH
Each switch offers independent protection and diagnosis during
overcurrent, overvoltage, and undervoltage conditions, as well as an
overtemperature shutdown feature.
A logic low on the Open Load Detect Enable pin (OLDE) minimizes
bias current drain by disabling the open load circuitry current source.
The device also has a very low quiescent current in standby mode.
FEATURES
DW SUFFIX)
98ASB42343B
20-PIN SOICW
• Designed to drive Automotive Inductive loads
• Operating Voltage Range from 6.0 V to 27 V
• Maximum Breakdown Voltage greater than 40 V
• 40 mΩ RDSON at 25°C
• Overtemperature Protection with Hysteresis
• Overcurrent protection
• Under Voltage Shutdown
ORDERING INFORMATION
Temperature
Device
Package
Range (T )
A
• Over Voltage Shutdown
• Open Load Detection in Off-State
• Independent Diagnostic Output
• ESD Protection 2.0 kV
MC33289DW/R2
-40°C to 125°C
20 SOICW
• Standby Current less than 5.0 µA at VBAT below 14 V
V
PWR
5.0 V
33289
VBAT
OUT1
OUT2
ST1
ST2
IN1
MCU
IN2
GND
OLDE
Figure 1. 33289 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
PIN CONNECTIONS
PIN CONNECTIONS
PIN ASSIGNMENT
VBAT
1
VBAT
20
19
18
17
16
15
14
VBAT
2
3
VBAT
OUT1
OUT1
VBAT
OUT2
OUT2
VBAT
VBAT
4
5
VBAT
6
NC
7
NC
IN1
8
13
12
11
IN2
ST1
OLDE
9
ST2
GND
10
Figure 2. 33289 Pin Connections
Table 1. Pin Function Description
Pin Number
Pin Name
Pin Function
Supply Voltage
Definition
VBAT
These are the power supply pins of the device. These pins are directly connected
with the lead frame of the package and are tied to the drain of the switching
MOSFET. These pins can be directly connected to the battery voltage. In addition
to their supply function, these pins participate to the thermal behavior of the
device in conducting the heat from the switching MOSFET to the printed circuit
board.
1, 2, 5, 6, 15, 16,
19, 20
OUTPUT Channel 1 Pins 3 and 4 are the output 1 pins. Pins 17 and 18 are the output 2 pins. They are
3, 4, 18, 17
OUT1
OUT2
directly connected to the source of the power MOSFET. These pins are used by
OUTPUT Channel 2
the control circuitry to sense the device output voltage. The RDSON is 40 mΩ max
per output at 25°C and will increase to a maximum of 75 mΩ at 150°C junction
temperature.
INPUT Channel 1
INPUT Channel 2
These are the device input pins which directly control their associated outputs.
The levels are CMOS compatible. When the input is a logic low, the associated
output MOSFET is in the off state. When input is high, the MOSFET is turned on
and the load is activated.
8, 13
IN1
IN2
When both inputs are low, the device is in standby mode and its supply current is
reduced. Each input pin has an internal active pull down, so that it will not float if
disconnected.
Status for Channel 1 These pins are the channel 1 and channel 2 fault detection flags. Their internal
9, 12
ST1
ST2
structure is an open drain architecture with an internal clamp at 6.0 V. An external
Status for Channel 2
pull up resistor connected to VDD (5.0 V) is needed. This is an active low output.
If the device is in its normal condition the status lines will be high. If open load or
other fault occurs, the associated channel status flag will be pulled low. See
Functional Truth Table.
Open Load Detection This pin is a digital input which enables the open load current diagnostic circuitry.
10
11
OLDE
GND
Enable
When OLDE is a logic low, the open load circuitry is not powered and the device’s
bias current draw is at a minimum. If OLDE is a logic high, the open load circuitry
is functional at the price of a higher bias current draw. OLDE pin has a pull down
resistor.
GROUND
This is the GND pin of the device.
33289
Analog Integrated Circuit Device Data
Freescale Semiconductor
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PIN CONNECTIONS
V
V
V
V
V
VBAT V
V
BAT BAT BAT BAT
BAT
BAT BAT
OUT2
OUT2
Thermal
Sensor
Over
Temp
Charge
Pump
ST2
IN2
CHANNEL 2
OUT1
OUT1
Input
Trigger
IN1
U.V.& O.V.
Lockout
Over
Current
OLDE
Open
Load
ST1
CHANNEL 1
GND
Figure 3. Simplified Internal Block Diagram
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VBAT and VBATC Voltage: Continuous/Pulse
OUT1, OUT2 Voltage with Respect to GND: Continuous/Pulse
OUT1, OUT2 to VBTAP Voltage: Continuous
ST1, ST2 Voltage: Continuous/Pulse
VBAT
VOUT
VOUT
VST
-0.3 to 41
-4.0 to 41
41
V
V
V
-0.3 to 7.0
-0.3 to 7.0
+/-4.0
V
IN1, IN2 Voltage: Continuous
VIN
V
IN1, IN2, ST1, ST2, OLDE Current
IIN
mA
ESD all Pins
Human Body Model (1)
Machine Model (1)
VESD1
VESD2
+/-2000
+/-200
V
V
THERMAL RATINGS
Operating Junction Temperature
Storage Temperature
TJ
-40 to 150
°C
TST
-55 to 150
°C
Thermal Resistance Junction to Ambient (2)
Thermal Resistance Junction to lead: Both Channel on
Thermal Resistance Junction to lead: One Channel on
Thermal Resistance Junction to lead: Logic Die
Notes
RTHJA
RTHJL1
RTHJL2
RTHJL3
70
15
15
30
°C/W
°C/W
°C/W
°C/W
1. EDS1 testing is performed in accordance with the Human Body Model (Czap = 100 pF, Rzap = 1500 Ω) EDS2 testing is performed in
accordance with the Machine Model (Czap = 100 pF, Rzap = 0 Ω)
2. With minimum PCB dimensions.
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Analog Integrated Circuit Device Data
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ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
POWER INPUT
Operating Voltage
VBAT
IBAT1
6.0
VOV
16
V
Supply Current: Both Channels On
= 13.5 V; OLDE High
mA
V
6.0
5.0
BAT
Supply Current: One Channel On
= 13.5 V; OLDE High
IBAT2
mA
µA
V
10
5.0
30
BAT
Supply Current: Both Channels Off
= 12.6 V; OLDE Low, TJ < 125°C
IBAT3
V
BAT
Supply Current: Any State
= 13.5 V
IBAT_MAX
mA
µA
V
BAT
Output Off state leakage current per channel
= 13.5 V; IN1, 2, OLDE low, Both output grounded,
IDSS
V
0.1
5.0
BAT
TJ < 125°C
Drain-Source On Resistance
RDSON1
RDSON2
VCLAMP
mΩ
mΩ
V
VBAT > 10 V, TAMB = 25°C
40
75
Drain-Source On Resistance
VBAT > 10 V, TAMB = 150°C
Negative Inductive Clamp Voltage
IOUT = 1 A
-4.0
-1.0
INPUT CHARACTERISTICS
High Input Voltage (IN1, IN2)
High Input Voltage (OLDE)
V
3.25
3.5
V
V
IH
V
OLDEH
Low Input Voltage (IN1, IN2, OLDE)
Logic Input Hysteresis IN1, IN2
V
1.5
0.8
V
IL
V
0.4
3.0
0.6
V
HYST
Logic Input Current
VIN = 1.5 V
I
µA
IN
Logic Input Current
VIN = 3.25 V
I
µA
V
IN
32.5
7.0
80
Logic Input Clamp Voltage
At IIN = 1 mA
VCLMP
5.5
Input Capacitance IN1, IN2
CIN
pF
RIN = 47 kΩ @ 100 kHz
STATUS CHARACTERISTICS
Status Voltage
VST
V
IST = 1 mA; Output in fault
0.5
10
Status Leakage Current
VST = 5 V
ISTLK
µA
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ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
Status Pin Capacitance
VST = 5 V
CST
pF
80
OVERLOAD PROTECTION CHARACTERISTICS
Overcurrent latchoff threshold
VBAT = 13.5 V
IOCT
A
4.0
9.0
Thermal Shutdown
T
150
165
175
10
°C
°C
V
SHUT
THYST
VOV
Thermal Shutdown Hysteresis
Overvoltage Shutdown Threshold
Both IN1, IN2 logic high
27
0.1
38
2.0
6.0
1.0
Overvoltage Shutdown Hysteresis
Both IN1, IN2 logic high
VOVHYST
V
V
V
Undervoltage Shutdown Threshold
Both IN1, IN2 logic high
VUV
4.75
0.3
Undervoltage Shutdown Hysteresis
Both IN1, IN2 logic high
VUVHYST
0.6
OPEN CIRCUIT DETECTION CHARACTERISTICS
Open Load Detect Current
VOUT = 3.5 V, OLDE = 4.0 V
IOL
µA
200
290
400
Open Load Threshold Voltage
Openload threshold voltage
VOL
1.5
1.5
2.4
2.5
3.5
3.5
V
V
VINOL
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Analog Integrated Circuit Device Data
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ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 7.0 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Description
Symbol
Min
Typ
Max
Unit
OVERLOAD PROTECTION CHARACTERISTICS
Overcurrent latchoff delay
TOCTDLY
µs
From OverCurrent Treshold achieved to Output
Voltage = 10% VBAT
30
50
Overcurrent latchoff status delay
TOCTSTDLY
µs
From Output Voltage = 10% VBAT to Status Flag <1 V
OPEN CIRCUIT DETECTION CHARACTERISTICS
Open Load to Status Low Delay Time
From IN = 1.5 to Status Flag <1.5 V
TOLSTDT
µs
µs
100
50
Open Load Detect BlankingTime
TOLDBT
From IN = 1.5 to Openload
circuitry enable
3.0
10
SWITCHING CHARACTERISTICS (3)
Turn-on Slew Rate
SRPOUT1
V/µs
V/µs
From 10% to VBAT -3.0 V
1.0
0.1
20
Turn-on Slew Rate
SRPOUT2
From VBAT -3.0 V to 90%
3.0
Turn-off Slew Rate
From 90% to 10%
SRNOUT
V/µs
µs
1.0
1.0
20
15
Turn-on Delay Time
tDON
From VIN/2 to 10% VBAT
2.5
5.0
Turn-off Delay Time
tDOFF
µs
From VIN/2 to 90% VBAT
1.0
15
Notes
3. 8 V<VBAT <18 V, RLOAD = 7 Ω
33289
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
Battery
VBAT VBAT VBAT VBAT
VBAT VBAT VBAT VBAT
OUT2
OUT2
Load 2
Thermal
Sensor
5.0 V
Over
Status pull-up
resistors
Temp
Charge
Pump
ST2
IN2
10 KΩ
10 KΩ
CHANNEL 2
OUT1
OUT1
Input
Trigger
IN1
U.V.& O.V.
Lockout
Over
Current
LOAD
MCU
OLDE
Open
Load
ST1
CHANNEL 1
GND
Figure 4. MC33289 Typical Application
Table 5. Functional Truth Table
Conditions
IN1
IN2
OUT1
OUT2
ST1
ST2
Normal Operating Conditions
L
H
L
L
L
L
H
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
Overtemperature Channel 1
H
X
H
X
H
H
L
X
L
X
L
L
L
H
L
H
L
L
Overtemperature Channel 2
Overtemperature Channel 1/Channel 2
Open Load Channel 1
Open Load Channel 2
L
X
L
H
X
X
H
L
H
L
X
H
Overcurrent Channel 1
Overcurrent Channel 2
H
X
X
H
L
X
L
L
H
L
X
H
Undervoltage Condition
X
X
X
X
L
L
L
L
H
H
H
H
Overvoltage Condition
L = ‘Low level’; H = ‘High level’; X = ‘don’t care
33289
Analog Integrated Circuit Device Data
Freescale Semiconductor
8
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below
DW SUFFIX
20-PIN
PLASTIC PACKAGE
98ASB42343B
ISSUE J
33289
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
• Implemented Revision History page
• Converted to Freescale format
6/2006
4.0
• Updated to the prevailing form and style
33289
Analog Integrated Circuit Device Data
Freescale Semiconductor
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MC33289
Rev. 4.0
6/2006
相关型号:
MC33291DW/R2
1A BUF OR INV BASED PRPHL DRVR, PDSO24, 7.50 X 15.40 MM, 1.27 PITCH, LEAD FREE, MS-013AD, SOIC-24
NXP
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