MC33290 [MOTOROLA]
ISO SERIAL LINK INTERFACE; ISO串行接口
| 型号： | MC33290 |
| 厂家： | 
MOTOROLA |
| 描述： | ISO SERIAL LINK INTERFACE |
| 文件： | 总4页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Order this document by MC33290/D
The MC33290 is a serial link bus interface device designed to provide
bi–directional half–duplex communication interfacing in automotive
diagnostic applications. It is designed to interface between the vehicle’s
on–board microcontroller and systems off–board the vehicle via the special
ISO K line. The MC33290 is designed to meet the “Diagnostic Systems
ISO9141” specification. The device’s K line bus driver’s output is fully
protected against bus shorts and over temperature conditions.
ISO SERIAL LINK
INTERFACE
SEMICONDUCTOR
TECHNICAL DATA
The MC33290 derives it’s robustness to temperature and voltage
extremes from being built on a SMARTMOS process, incorporating CMOS
logic, bipolar/MOS analog circuitry, and DMOS power FETs. Though the
MC33290 was principally designed for automotive applications, it is suited for
other serial communication applications. It is parametrically specified over an
ambient temperature range of –40°C ≤ T ≤ 125°C and 8.0 V ≤ V
supply. The economical 8 pin DIP and SO–8 surface mount plastic packages
make the MC33290 very cost effective.
≤ 18 V
A
Bat
• Designed to Operate Over Wide Supply Voltage of 8.0 to 18 V
• Ambient Operating Temperature of –40°C to 125°C
• Interfaces Directly to Standard CMOS Microprocessors
• ISO K Line Pin Protected Against Shorts to Ground
• Thermal Shutdown with Hysteresis
8
1
P SUFFIX
PLASTIC PACKAGE
CASE 626
• Maximum Transmission Speeds in Excess of 50 k Baud
• ISO K Line Pin Capable of High Currents
• ISO K Line can be Driven with up to 10 nF of Parasitic Capacitance
• 8.0 kV ESD Protection Attainable with Few Additional Components
8
1
• Standby Mode: No V
Current Drain with V
at 5.0 V
DD
at 5.0 V
Bat
• Low Current Drain during Operation with V
D SUFFIX
PLASTIC PACKAGE
CASE 751
DD
(SO–8)
Typical Application Schematic
Service Scan Tool
or
End of Production Line
Programming
or
+V
On–Board Diagnostic Link
Bat
45 V(2)
PIN CONNECTIONS
D(1)
+V
DD
System Checking
V
Tx
Rx
V
500
Ω(2)
1
2
3
4
8
7
6
5
MC33290
BB
510
Ω
N/C
V
MCU
BB
5.0 V
1
10 nF(3)
Gnd
ISO
(K Line I/O)
DD
V
V
DD
CC
7
CEN
TxD
RxD
ISO
K Line
1.0 nF
5.0 nF(3)
(Top View)
D
CEN
Rx
ISO
Gnd
x
8
6
4
3
SCIRxD
27 V(3)
SCITxD
Tx
5
ORDERING INFORMATION
Operating
Components Necessary for: Reverse Battery (1), Overvoltage Transient (2), and
8.0 kV ESD Protection (3) in a metal module case.
Temperature Range
Device
Package
MC33290D
MC33290P
SO–8
DIP–8
T
A
= –40° to +125°C
This device contains 85 active transistors.
This document contains information on a new product. Specifications and information herein
Motorola, Inc. 1997
Rev 0
are subject to change without notice.
MC33290
Figure 1. Simplified Block Diagram
V
BB
1
Rx
6
ISO
4
R
Hys
Master
Bias
CEN
8
40 V
V
DD
Thermal
Shutdown
Gnd
3
7
Tx
5
MAXIMUM RATINGS (All voltages are with respect to ground, unless otherwise noted.)
Rating
DC Supply Voltage
Symbol
Value
–0.3 to 7.0
45
Unit
V
V
V
V
DD
DD
Load Dump Peak Voltage
V
V
BB
BB(LD)
ISO Pin Load Dump Peak Voltage
ISO Short Circuit Current Limit
V
40
V
ISO
I
1.0
A
ISO(LIM)
ESD Voltage (Note 1)
V
Human Body Model (Note 2)
Machine Model (Note 3)
V
ESD1
V
ESD2
2000
200
ISO Clamp Energy (Note 4)
Storage Temperature
E
10
–55 to +150
–40 to +125
–40 to +150
0.8
mJ
°C
clamp
T
stg
Operating Case Temperature
Operating Junction Temperature
T
C
°C
T
J
°C
Power Dissipation (T = 25°C)
P
D
W
A
Soldering Temperature (for 10 seconds)
Thermal Resistance (Junction–to–Ambient)
T
260
°C
solder
R
150
°C/W
θJA
NOTES: 1. ESD data available upon request.
2. Testing in accordance with Human Body Model (C
= 100 pF, R
Zap
= 1500 Ω).
= 0Ω).
Zap
= 100 pF, R
3. Testing in accordance with Machine Model (C
Zap
Zap
4. Non–repetitive clamping capability at 25°C.
ELECTRICAL CHARACTERISTICS (Characteristics noted under conditions of 4.75 V ≤ V
≤ 5.25 V, 8.0 V ≤ V
,
DD
BB
HSIP ≤ 18.0 V, –40°C ≤ T ≤ 125°C, unless otherwise noted.)
C
Characteristic
Symbol
Min
Typ
Max
Unit
POWER AND CONTROL
V
Sleep State Current (HSIM = HSIP, LSIM = LSIP = 0 V,
I
–
–
–
–
–
–
–
–
0.1
1.0
50
mA
mA
µA
mA
V
DD
VRSM = VRSP = 0 V, Tx = 0.8 V , CEN = 0.3 V
DD(SS)
)
DD
DD
V
DD
Quiescent Operating Current (HSIM = HSIP – 0.3 V, LSIM = 0 V,
I
DD(Q)
LSIP = 0.3 V, VRSM = 0 V, VRSP = –0.5 V, Tx = 0.2 V , CEN = 0.7 V
)
DD DD
V
BB
Sleep State Current (V
BB
= 16 V, HSIM = HSIP, LSIM = LSIP = 0 V,
I
BB(SS)
VRSM = VRSP = 0 V, Tx = 0.8 V , CEN = 0.3 V
)
DD
DD
V
BB
Quiescent Operating Current (HSIM = HSIP – 0.3 V, LSIM = 0 V,
I
1.0
BB(Q)
LSIP = 0.3 V, VRSM = 0 V, VRSP = –0.5 V, Tx = 0.2 V , CEN = 0.7 V
)
DD
DD
Chip Enable
Input High Voltage Threshold (Note 1)
Input Low Voltage Threshold (Note 2)
V
V
0.7 V
–
–
–
–
IH(CEN)
IL(CEN)
DD
0.3 V
DD
NOTES: 1. When I
transitions to >100 µA.
transitions to <100 µA.
BB
BB
2. When I
2
MOTOROLA ANALOG IC DEVICE DATA
MC33290
ELECTRICAL CHARACTERISTICS (continued) (Characteristics noted under conditions of 4.75 V ≤ V
≤ 5.25 V, 8.0 V ≤ V
,
BB
DD
HSIP ≤ 18.0 V, –40°C ≤ T ≤ 125°C, unless otherwise noted.)
C
Characteristic
Symbol
Min
Typ
Max
Unit
POWER AND CONTROL
Chip Enable Pull–Down Current (Note 3)
I
2.0
–
–
40
µA
V
PD(CEN)
Tx Input Low Voltage Threshold (R
= 510 Ω) (Note 4)
= 510 Ω) (Note 5)
V
)
–
–
–
–
0.3 x V
–
ISO
LTP(Tx
DD
Tx Input High Voltage Threshold (R
Tx Pull–Up Current (Note 6)
V
0.7 x V
–40
–
V
ISO
UTP(Tx)
DD
I
–2.0
0.2 V
µA
V
PU(Tx)
Rx Output Low Voltage Threshold (R
Rx Sinking 1.0 mA)
= 510 Ω, Tx = 0.2 V
,
V
L(Rx)
ISO
DD
DD
Rx Output High Voltage Threshold (R
Rx Sourcing 250 µA)
= 510 Ω, Tx = 0.8 V
,
V
0.8 V
–
–
–
V
ISO
DD
H(Rx)
DD
Thermal Shutdown (Note 7)
T
150
170
°C
LIM
NOTES 3. Enable pin has an internal current pull–down equivalent to greater than 50 kΩ.
4. Measured by ramping Tx down from 0.7 V
5. Measured by ramping Tx up from 0.3 V
to 0.3 V
and noting Tx value at which ISO falls below 0.2 V
.
DD
to 0.7 V
DD
and noting the value at which ISO rises above 0.9 V
BB
.
DD
DD
BB
6. Tx pin has internal current pull–up equivalent to greater than 50 kΩ. Pull–Up current measure with Tx pin at 0.7 V
.
DD
7. Thermal Shutdown performance (T
) is guaranteed by design but not production tested.
LIM
ELECTRICAL CHARACTERISTICS (Characteristics noted under conditions of 4.75 V ≤ V
≤ 5.25 V, 8.0 V ≤ V , HSIP ≤ 18.0 V,
BB
DD
–40°C ≤ T ≤ 125°C, unless otherwise noted.)
C
Characteristic
Symbol
Min
Typ
Max
Unit
ISO I/O
Input Low Voltage Threshold (R
= 0 Ω, Tx = 0.8 V ) (Note 1)
DD
V
–
–
–
–
–
0.4 x V
–
V
V
ISO
LTP(ISO)
BB
BB
Input High Voltage Threshold (R
Input Hysteresis (Note 3)
= 0 Ω, Tx = 0.8 V ) (Note 2)
DD
V
0.8 x V
ISO
UTP(ISO)
BB
V
I
0.01 x V
–5.0
0.1 x V
–90
V
Hys(ISO)
BB
Internal Pull–Up Current (Note 4)
(R = ∞ Ω, Tx = 0.8 V , V
µA
PU(ISO)
= 0.5 V
)
ISO
DD ISO
BB
= 0 Ω, Tx = 0.4 V , V
Short Circuit Current Limit (Note 5) (R
= V )
BB
I
50
–
–
–
–
1000
0.125 x V
–
mA
V
ISO
DD ISO
SC(ISO)
Output Low Voltage Threshold (R
= 510 Ω, Tx = 0.2 V
)
V
–
0.95 x V
–
ISO
DD
L(ISO)
BB
Output High Voltage Threshold (R
= ∞ Ω, Tx = 0.8 V
DD
)
V
V
ISO
H(ISO)
BB
Fall Time (Note 6) (R
ISO
= 510 Ω to V , C
= 10 nF to Ground)
t
2.0
µs
µs
BB ISO
fall(ISO)
t
PD(ISO)
ISO Propagation Delay (Note 7)
High to Low; (R
Low to High; (R
= 510 Ω, C
= 510 Ω, C
= 500 pF) (Note 8)
= 500 pF) (Note 9)
–
–
–
–
2.0
2.0
ISO
ISO
ISO
ISO
NOTES: 1. ISO ramped from 0.8 V
2. ISO ramped from 0.4 V
3. Input Hysteresis, V
to 0.4 V , Monitor Rx, Value of ISO voltage at which Rx transitions to 0.3 V
BB
to 0.8 V , Monitor Rx, Value of ISO voltage at which Rx transitions to 0.7 V
BB
.
DD
BB
BB
.
DD
= V
– V
.
LTP(ISO)
Hys(ISO)
UTP(ISO)
4. ISO Pull–Up has >100 kΩ internal pull–up to V
.
BB
5. ISO has internal current limit.
6. Time required ISO voltage to transition from 0.8 V
to 0.2 V
.
BB
BB
7. Changes in the value of C
ISO
affect the rise and fall time but have minimal effect on Propagation Delay.
8. Step Tx voltage from 0.2 V
to 0.8 V ; Time measured from V
DD
to 0.2 V ; Time measured from V
DD
until V
until V
reaches 0.3 V
reaches 0.7 V
.
BB
.
BB
DD
DD
UTP(ISO)
LTP(ISO)
ISO
9. Step Tx voltage from 0.8 V
ISO
3
MOTOROLA ANALOG IC DEVICE DATA
MC33290
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
ISSUE R
D
A
NOTES:
(SO–8)
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
8
1
5
4
C
M
M
0.25
B
H
E
B
MILLIMETERS
e
DIM
A
A1
B
C
D
MIN
1.35
0.10
0.35
0.18
4.80
3.80
MAX
1.75
0.25
0.49
0.25
5.00
4.00
h X 45
A
C
SEATING
PLANE
E
e
0.10
1.27 BSC
A1
H
h
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
B
L
M
S
S
0.25
C
B
A
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
8
5
NOTES:
–B–
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
1
4
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
MILLIMETERS
INCHES
–A–
NOTE 2
DIM
A
B
C
D
F
MIN
9.40
6.10
3.94
0.38
1.02
MAX
10.16
6.60
4.45
0.51
1.78
MIN
MAX
0.400
0.260
0.175
0.020
0.070
0.370
0.240
0.155
0.015
0.040
L
C
G
H
J
K
L
2.54 BSC
0.100 BSC
0.76
0.20
2.92
1.27
0.30
3.43
0.030
0.008
0.115
0.300 BSC
–––
0.050
0.012
0.135
J
–T–
SEATING
PLANE
N
7.62 BSC
M
M
N
–––
0.76
10
1.01
10
0.040
D
K
0.030
G
H
M
M
M
0.13 (0.005)
T
A
B
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
Opportunity/Affirmative Action Employer.
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
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INTERNET: http://www.mot.com/SPS/
MC33290/D
◊
相关型号：
MC33291DW/R2
1A BUF OR INV BASED PRPHL DRVR, PDSO24, 7.50 X 15.40 MM, 1.27 PITCH, LEAD FREE, MS-013AD, SOIC-24
NXP
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