SCAN18374TSSC [FAIRCHILD]

D-Type Flip-Flop with 3-STATE Outputs; D型触发器具有​​三态输出
SCAN18374TSSC
型号: SCAN18374TSSC
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

D-Type Flip-Flop with 3-STATE Outputs
D型触发器具有​​三态输出

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管
文件: 总12页 (文件大小:101K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
October 1991  
Revised May 2000  
SCAN18374T  
D-Type Flip-Flop with 3-STATE Outputs  
General Description  
Features  
The SCAN18374T is a high speed, low-power D-type flip-  
flop featuring separate D-type inputs organized into dual 9-  
bit bytes with byte-oriented clock and output enable control  
signals. This device is compliant with IEEE 1149.1 Stan-  
dard Test Access Port and BOUNDARY-SCAN Architec-  
ture with the incorporation of the defined BOUNDARY-  
SCAN test logic and test access port consisting of Test  
Data Input (TDI), Test Data Out (TDO), Test Mode Select  
(TMS), and Test Clock (TCK).  
IEEE 1149.1 (JTAG) Compliant  
Buffered positive edge-triggered clock  
3-STATE outputs for bus-oriented applications  
9-bit data busses for parity applications  
Reduced-swing outputs source 32 mA/sink 64 mA  
Guaranteed to drive 50transmission line to TTL input  
levels of 0.8V and 2.0V  
TTL compatible inputs  
25 mil pitch SSOP (Shrink Small Outline Package)  
Includes CLAMP and HIGHZ instructions  
Member of Fairchild’s SCAN Products  
Ordering Code:  
Order Number Package Number  
Package Description  
SCAN18374TSSC  
MS56A  
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Connection Diagram  
Pin Descriptions  
Pin Names  
AI(08), BI(08)  
ACP, BCP  
Description  
Data Inputs  
Clock Pulse Inputs  
AOE1, BOE1  
AO(08), BO(08)  
3-STATE Output Enable Inputs  
3-STATE Outputs  
Truth Tables  
Inputs  
AO(0–8)  
ACP  
AOE1  
AI(0–8)  
X
H
L
L
X
L
Z
L
H
H
Inputs  
BOE1  
BO(0–8)  
BCP  
BI(0–8)  
X
H
L
L
X
L
Z
L
H
H
H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Immaterial  
Z = High Impedance  
= L-to-H Transition  
© 2000 Fairchild Semiconductor Corporation  
DS010963  
www.fairchildsemi.com  
Functional Description  
The SCAN18374 consists of two sets of nine edge-trig-  
gered flip-flops with individual D-type inputs and 3-STATE  
true outputs. The buffered clock and buffered Output  
Enable pins are common to all flip-flops. Each set of the  
nine flip-flops will store the state of their individual D inputs  
that meet the setup and hold time requirements on the  
LOW-to-HIGH Clock (ACP or BCP) transition. With the  
Output Enable (AOE1 or BOE1) LOW, the contents of the  
nine flip-flops are available at the outputs. When the Output  
Enable is HIGH, the outputs go to the high impedance  
state. Operation of the Output Enable input does not affect  
the state of the flip-flops.  
Logic Diagram  
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
Block Diagrams  
Byte-A  
Note: BSR stands for Boundary Scan Register  
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2
Block Diagrams (Continued)  
Tap Controller  
Byte-B  
Note: BSR stands for Boundary Scan Register  
3
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Description of Boundary-Scan Circuitry  
The scan cells used in the BOUNDARY-SCAN register are  
one of the following two types depending upon their loca-  
tion. Scan cell TYPE1 is intended to solely observe system  
data, while TYPE2 has the additional ability to control sys-  
tem data.  
The two least significant bits of this captured value (01) are  
required by IEEE Std 1149.1. The upper six bits are unique  
to the SCAN18374T device. SCAN CMOS Test Access  
Logic devices do not include the IEEE 1149.1 optional  
identification register. Therefore, this unique captured  
value can be used as a pseudo IDcode to confirm that  
the correct device is placed in the appropriate location in  
the boundary scan chain.  
Scan cell TYPE1 is located on each system input pin while  
scan cell TYPE2 is located at each system output pin as  
well as at each of the two internal active-high output enable  
signals. AOE controls the activity of the A-outputs while  
BOE controls the activity of the B-outputs. Each will acti-  
vate their respective outputs by loading a logic high.  
Instruction Register Scan Chain Definition  
The BYPASS register is a single bit shift register stage  
identical to scan cell TYPE1. It captures a fixed logic low.  
Bypass Register Scan Chain Definition  
Logic 0  
MSB LSB  
Instruction Code  
00000000  
Instruction  
EXTEST  
10000001  
SAMPLE/PRELOAD  
CLAMP  
10000010  
The INSTRUCTION register is an eight-bit register which  
captures the value 00111101.  
00000011  
HIGHZ  
All Others  
BYPASS  
Scan Cell TYPE1  
Scan Cell TYPE2  
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4
Description of Boundary-Scan Circuitry (Continued)  
Boundary-Scan Register  
Scan Chain Definition (42 Bits in Length)  
5
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Description of Boundary-Scan Circuitry (Continued)  
Boundary-Scan Register Definition Index  
Bit No.  
Pin Name  
Pin No.  
Pin Type  
Scan Cell Type  
Control  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
AOE1  
ACP  
AOE  
BOE1  
BCP  
BOE  
AI0  
3
Input  
Input  
TYPE1  
TYPE1  
TYPE2  
TYPE1  
TYPE1  
TYPE2  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
Signals  
54  
Internal  
Input  
26  
31  
Input  
Internal  
Input  
55  
53  
52  
50  
49  
47  
46  
44  
43  
42  
41  
39  
38  
36  
35  
33  
32  
30  
2
Ain  
AI1  
Input  
AI2  
Input  
AI3  
Input  
AI4  
Input  
AI5  
Input  
AI6  
Input  
AI7  
Input  
AI8  
Input  
BI0  
Input  
Bin  
Aout  
Bout  
BI1  
Input  
BI2  
Input  
BI3  
Input  
BI4  
Input  
BI5  
Input  
BI6  
Input  
BI7  
Input  
BI8  
Input  
AO0  
AO1  
AO2  
AO3  
AO4  
AO5  
AO6  
AO7  
AO8  
BO0  
BO1  
BO2  
BO3  
BO4  
BO5  
BO6  
BO7  
BO8  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
4
5
7
8
10  
11  
13  
14  
15  
16  
18  
19  
21  
22  
24  
25  
27  
8
7
6
5
4
3
2
1
0
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6
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions  
Supply Voltage (VCC  
)
0.5V to +7.0V  
DC Input Diode Current (IIK  
VI = −0.5V  
)
Supply Voltage (VCC  
)
20 mA  
+20 mA  
SCAN Products  
4.5V to 5.5V  
0V to VCC  
VI = VCC +0.5V  
Input Voltage (VI)  
Output Voltage (VO)  
DC Output Diode Current (IOK  
)
0V to VCC  
V
V
O = −0.5V  
20 mA  
+20 mA  
Operating Temperature (TA)  
Minimum Input Edge Rate V/t  
VIN from 0.8V to 2.0V  
40°C to +85°C  
125 mV/ns  
O = VCC +0.5V  
DC Output Voltage (VO)  
0.5V to VCC +0.5V  
±70 mA  
DC Output Source/Sink Current (IO)  
DC VCC or Ground Current  
Per Output Pin  
V
CC @ 4.5V, 5.5V  
Note 1: Absolute maximum ratings are those values beyond which damage  
to the device may occur. The databook specifications should be met, with-  
out exception, to ensure that the system design is reliable over its power  
supply, temperature, and output/input loading variables. Fairchild does not  
recommend operation of SCAN circuits outside databook specifications.  
±70 mA  
Junction Temperature  
SSOP  
+140°C  
65°C to +150°C  
2000V  
Storage Temperature  
ESD (Min)  
DC Electrical Characteristics  
VCC  
T
A = +25°C  
TA = −40°C to +85°C  
Symbol  
VIH  
Parameter  
Units  
V
Conditions  
(V)  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
Typ  
1.5  
1.5  
1.5  
1.5  
Guaranteed Limits  
Minimum HIGH  
2.0  
2.0  
2.0  
0.8  
0.8  
V
OUT = 0.1V  
or VCC 0.1V  
OUT = 0.1V  
or VCC 0.1V  
Input Voltage  
Maximum LOW  
Input Voltage  
Minimum HIGH  
Output Voltage  
(Note 2)  
2.0  
0.8  
0.8  
VIL  
V
V
VOH  
3.15  
4.15  
2.4  
3.15  
4.15  
2.4  
V
IOUT = −50 µA  
V
IN = VIL or VIH  
OH = −32 mA  
VIN = VIL or VIH  
V
2.4  
2.4  
I
2.4  
V
2.4  
I
OH = −24 mA  
VOL  
Maximum LOW  
Output Voltage  
(Note 2)  
0.1  
0.1  
0.1  
V
I
OUT = 50 µA  
0.1  
0.55  
0.55  
0.55  
0.55  
0.55  
0.55  
V
IN = VIL or VIH  
OL = 64 mA  
IN = VIL or VIH  
OL = 48 mA  
V
I
V
V
I
IIN  
Maximum Input  
Leakage Current  
Maximum Input  
Leakage  
5.5  
5.5  
±0.1  
±1.0  
µA  
VI = VCC, GND  
IIN  
2.8  
385  
160  
94  
3.6  
385  
160  
94  
µA  
µA  
VI = VCC  
VI = GND  
VI = GND  
TDI, TMS  
Minimum Input Leakage  
Minimum Dynamic  
Output Current (Note 3)  
Maximum Output  
Leakage Current  
Output Short  
5.5  
5.5  
µA  
IOLD  
IOHD  
IOZ  
mA  
mA  
V
OLD = 0.8V Max  
OHD = 2.0V Min  
40  
40  
V
5.5  
5.5  
±0.5  
±5.0  
µA  
VI (OE) = VIL, VIH  
IOS  
100  
100  
mA  
VO = 0V  
Circuit Current  
(min)  
ICC  
Maximum Quiescent  
Supply Current  
V
O = Open  
5.5  
5.5  
16.0  
750  
88  
µA  
µA  
TDI, TMS = VCC  
O = Open  
V
820  
TDI, TMS = GND  
7
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DC Electrical Characteristics (Continued)  
VCC  
T
A = +25°C  
TA = −40°C to +85°C  
Symbol  
ICCt  
Parameter  
Units  
Conditions  
(V)  
Typ  
Guaranteed Limits  
Maximum ICC  
Per Input  
5.5  
2.0  
2.0  
mA  
VI = VCC 2.1V  
VI = VCC 2.1V  
5.5  
2.15  
2.15  
mA  
TDI/TMS Pin, Test One  
with the Other Floating  
Note 2: All outputs loaded; thresholds associated with output under test.  
Note 3: Maximum test duration 2.0 ms, one output loaded at a time.  
Noise Specifications  
VCC  
T
A = +25°C  
T
A = −40°C to +85°C  
Symbol  
VOLP  
Parameter  
Units  
(V)  
Typ  
Guaranteed Limits  
Maximum HIGH Output Noise  
5.0  
1.0  
1.5  
V
V
V
V
V
V
(Note 5)(Note 6)  
VOLV  
VOHP  
VOHV  
Minimum LOW Output Noise  
(Note 5)(Note 6)  
5.0  
5.0  
5.0  
5.5  
5.5  
0.6  
1.2  
OH+1.5  
OH1.8  
2.0  
Maximum Overshoot  
V
OH+1.0  
OH1.0  
1.6  
V
V
(Note 4)(Note 6)  
Minimum VCC Droop  
V
(Note 4)(Note 6)  
VIHD  
Minimum HIGH Dynamic Input Voltage Level  
(Note 4)(Note 7)  
2.0  
0.8  
VILD  
Maximum LOW Dynamic Input Voltage Level  
(Note 4)(Note 7)  
1.4  
0.8  
Note 4: Worst case package.  
Note 5: Maximum number of outputs that can switch simultaneously is n. (n 1) outputs are switched LOW and one output held LOW.  
Note 6: Maximum number of outputs that can switch simultaneously is n. (n 1) outputs are switched HIGH and one output held HIGH.  
Note 7: Maximum number of data inputs (n) switching. (n 1) input switching 0V to 3V. Input under test switching 3V to threshold (VILD).  
AC Electrical Characteristics  
VCC  
T
A = +25°C  
T
A = −40°C to +85°C  
L = 50 pF  
Max  
Symbol  
Parameter  
C
L = 50 pF  
C
Units  
(V)  
(Note 8)  
5.0  
Min  
2.5  
2.5  
1.5  
1.5  
2.0  
2.0  
Typ  
Max  
9.5  
Min  
tPLH  
tPHL  
tPLZ  
tPHZ  
tPZL  
tPZH  
,
Propagation Delay  
2.5  
2.5  
1.5  
1.5  
2.0  
2.0  
10.5  
11.5  
9.5  
ns  
ns  
ns  
CP to Q  
10.3  
9.0  
,
Disable Time  
5.0  
5.0  
9.0  
10.0  
12.0  
9.5  
,
Enable Time  
10.9  
8.9  
Note 8: Voltage Range 5.0 is 5.0V ± 0.5V.  
AC Operating Requirements  
Normal Operation  
VCC  
(V)  
T
A = +25°C  
T
A = −40°C to +85°C  
L = 50 pF  
Guaranteed Minimum  
Symbol  
Parameter  
C
L = 50 pF  
C
Units  
(Note 9)  
tS  
Setup Time, H or L  
Data to CP  
5.0  
3.0  
3.0  
1.5  
ns  
ns  
tH  
Hold Time, H or L  
CP to Data  
5.0  
1.5  
tW  
CP Pulse Width  
5.0  
5.0  
5.0  
5.0  
90  
ns  
fMAX  
Maximum ACP/BCP Clock Frequency  
100  
MHz  
Note 9: Voltage Range 5.0 is 5.0V ± 0.5V.  
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8
AC Electrical Characteristics  
Scan Test Operation  
VCC  
T
A = +25°C  
T
A = −40°C to +85°C  
L = 50 pF  
Max  
Symbol  
Parameter  
C
L = 50 pF  
C
Units  
(V)  
(Note 10)  
5.0  
Min  
3.5  
3.5  
2.5  
2.5  
3.0  
3.0  
5.0  
5.0  
Typ  
Max  
13.2  
13.2  
11.5  
11.5  
14.5  
14.5  
18.0  
18.0  
Min  
tPLH  
tPHL  
tPLZ  
tPHZ  
tPZL  
tPZH  
tPLH  
tPHL  
,
Propagation Delay  
3.5  
3.5  
2.5  
2.5  
3.0  
3.0  
5.0  
5.0  
14.5  
14.5  
11.9  
11.9  
15.8  
15.8  
19.8  
19.8  
ns  
ns  
ns  
TCK to TDO  
,
Disable Time  
5.0  
5.0  
5.0  
TCK to TDO  
,
Enable Time  
TCK to TDO  
,
Propagation Delay  
TCK to Data Out  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
During Update-DR State  
Propagation Delay  
TCK to Data Out  
tPLH  
,
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
18.6  
18.6  
5.0  
5.0  
20.2  
20.2  
tPHL  
During Update-IR State  
Propagation Delay  
TCK to Data Out  
tPLH  
,
5.5  
5.5  
19.9  
19.9  
5.5  
5.5  
21.5  
21.5  
tPHL  
During Test Logic Reset State  
Propagation Delay  
TCK to Data Out  
tPLZ  
,
4.0  
4.0  
16.4  
16.4  
4.0  
4.0  
18.2  
18.2  
tPHZ  
During Update-DR State  
Propagation Delay  
TCK to Data Out  
tPLZ  
,
5.0  
5.0  
19.5  
19.5  
5.0  
5.0  
20.8  
20.8  
tPHZ  
During Update-IR State  
Propagation Delay  
TCK to Data Out  
tPLZ  
,
5.0  
5.0  
19.9  
19.9  
5.0  
5.0  
21.5  
21.5  
tPHZ  
During Test Logic Reset State  
Propagation Delay  
TCK to Data Out  
tPZL  
,
5.0  
5.0  
18.9  
18.9  
5.0  
5.0  
20.9  
20.9  
tPZH  
During Update-DR State  
Propagation Delay  
TCK to Data Out  
tPZL  
,
6.5  
6.5  
22.4  
22.4  
6.5  
6.5  
24.2  
24.2  
tPZH  
During Update-IR State  
Propagation Delay  
TCK to Data Out  
tPZL  
,
7.0  
7.0  
23.8  
23.8  
7.0  
7.0  
25.7  
25.7  
tPZH  
During Test Logic Reset State  
Note 10: Voltage Range 5.0 is 5.0V ± 0.5V.  
Note: All Propagation Delays involving TCK are measured from the falling edge of TCK.  
9
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AC Operating Requirements  
Scan Test Operation  
VCC  
T
A = +25°C  
L = 50 pF  
Guaranteed Minimum  
T
A = −40°C to +85°C  
Symbol  
Parameter  
C
CL = 50 pF  
Units  
(V)  
(Note 11)  
tS  
Setup Time, H or L  
Data to TCK (Note 12)  
Hold Time, H or L  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
3.0  
3.0  
4.5  
3.0  
4.5  
3.0  
3.0  
3.0  
3.5  
8.0  
2.0  
4.0  
4.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tH  
tS  
tH  
tS  
tH  
tS  
tH  
tS  
tH  
tS  
tH  
tW  
4.5  
3.0  
4.5  
3.0  
3.0  
3.0  
3.5  
8.0  
2.0  
4.0  
4.5  
TCK to Data (Note 12)  
Setup Time, H or L  
AOE1, BOE1 to TCK (Note 13)  
Hold Time, H or L  
TCK to AOE1, BOE1 (Note 13)  
Setup Time, H or L  
Internal AOE, BOE to TCK (Note 14)  
Hold Time, H or L  
TCK to Internal AOE, BOE (Note 14)  
Setup Time  
ACP, BCP (Note 15) to TCK  
Hold Time  
TCK to ACP, BCP (Note 15)  
Setup Time, H or L  
TMS to TCK  
Hold Time, H or L  
TCK to TMS  
Setup Time, H or L  
TDI to TCK  
Hold Time, H or L  
5.0  
5.0  
TCK to TDI  
Pulse Width TCK  
H
L
15.0  
5.0  
15.0  
5.0  
ns  
fMAX  
Maximum TCK  
5.0  
25  
25  
MHz  
Clock Frequency  
Tpu  
Tdn  
Wait Time, Power Up to TCK  
Power Down Delay  
5.0  
0.0  
100  
100  
100  
100  
ns  
ms  
Note 11: Voltage Range 5.0 is 5.0V ± 0.5V.  
Note 12: This delay represents the timing relationship between the data Input and TCK at the associated scan cells numbered 08, 917, 1826 and 2735.  
Note 13: Timing pertains to BSR 38 and 41 only.  
Note 14: This delay represents the timing relationship between AOE, BOE and TCK at scan cells 36 and 39 only.  
Note 15: Timing pertains to BSR 37 and 40 only.  
Note: All Input Timing Delays involving TCK are measured from the rising edge of TCK.  
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10  
Extended AC Electrical Characteristics  
T
A = +25°C  
CC = 5.0V  
L = 50 pF  
V
T
A = −40°C to +85°C  
CC = 5.0V ± 0.5V  
L = 250 pF  
(Note 17)  
C
V
Symbol  
Parameter  
Units  
18 Outputs  
C
Switching  
(Note 16)  
Typ  
Min  
3.0  
3.0  
2.5  
Max  
11.5  
12.5  
10.5  
2.5  
Min  
Max  
tPLH  
tPHL  
,
Propagation Delay  
Data to Output  
4.0  
4.0  
13.5  
16.5  
ns  
ns  
ns  
ns  
ns  
tPZH  
tPZL  
tPHZ  
tPLZ  
,
,
Output Enable Time  
(Note 18)  
Output Disable Time  
2.0  
2.0  
10.5  
10.5  
1.0  
(Note 19)  
tOSHL  
Pin to Pin Skew  
HL Data to Output  
Pin to Pin Skew  
LH Data to Output  
0.5  
0.5  
1.0  
1.0  
(Note 20)  
tOSLH  
1.0  
(Note 20)  
Note 16: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-  
HIGH, HIGH-to-LOW, etc.).  
Note 17: This specification is guaranteed but not tested. The limits represent propagation delays with 250 pF load capacitors in place of the 50 pF load  
capacitors in the standard AC load. This specification pertains to single output switching only.  
Note 18: 3-STATE delays are load dominated and have been excluded from the datasheet.  
Note 19: The Output Disable Time is dominated by the RC network (500, 250 pF) on the output and has been excluded from the datasheet.  
Note 20: Skew is defined as the absolute value of the difference between the actual propagation delays for any two separate outputs of the same device.  
The specification applies to any outputs switching HIGH-to-LOW (tOSHL), LOW-to-HIGH (tOSLH), or any combination switching LOW-to-HIGH and/or HIGH-  
to-LOW.  
Capacitance  
Symbol  
CIN  
Parameter  
Input Pin Capacitance  
Typ  
4.0  
Units  
pF  
Conditions  
VCC = 5.0V  
VCC = 5.0V  
VCC = 5.0V  
COUT  
CPD  
Output Pin Capacitance  
13.0  
34.0  
pF  
Power Dissipation Capacitance  
pF  
11  
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide  
Package Number MS56A  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
12  

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