SCAN18540T [NSC]

Inverting Line Driver with TRI-STATE Outputs; 与三态输出反相线路驱动器
SCAN18540T
型号: SCAN18540T
厂家: National Semiconductor    National Semiconductor
描述:

Inverting Line Driver with TRI-STATE Outputs
与三态输出反相线路驱动器

驱动器
文件: 总14页 (文件大小:155K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 1998  
SCAN18540T  
Inverting Line Driver with TRI-STATE® Outputs  
General Description  
Features  
n IEEE 1149.1 (JTAG) compliant  
n Dual output enable signals per byte  
The SCAN18540T is a high speed, low-power line driver fea-  
turing separate data inputs organized into dual 9-bit bytes  
with byte-oriented paired output enable control signals. This  
device is compliant with IEEE 1149.1 Standard Test Access  
Port and Boundary Scan Architecture with the incorporation  
of the defined boundary-scan test logic and test access port  
consisting of Test Data Input (TDI), Test Data Out (TDO),  
Test Mode Select (TMS), and Test Clock (TCK).  
n TRI-STATE outputs for bus-oriented applications  
n 9-bit data busses for parity applications  
n Reduced-swing outputs source 24 mA/sink 48 mA (Mil)  
n Guaranteed to drive 50transmission line to TTL input  
levels of 0.8V and 2.0V  
n TTL compatible inputs  
n 25 mil pitch Cerpack packaging  
n Includes CLAMP and HIGHZ instructions  
n Standard Microcircuit Drawing (SMD) 5962-9312701  
Connection Diagram  
Pin Names  
Description  
AOE1, AOE2  
TRI-STATE Output Enable Input pins,  
A side  
BOE1, BOE2  
TRI-STATE Output Enable Input pins,  
B side  
AO(0–8)  
BO(0–8)  
Output pins, A side  
Output pins, B side  
DS100323-1  
Pin Names  
AI(0–8)  
BI(0–8)  
Description  
Input pins, A side  
Input pins, B side  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 1998 National Semiconductor Corporation  
DS100323  
www.national.com  
Truth Tables  
Inputs  
AOE2  
AO (0–8)  
AOE1  
AI (0–8)  
L
H
X
L
L
X
H
L
H
X
X
L
L
Z
Z
H
Inputs  
BO (0–8)  
BOE1  
BOE2  
BI (0–8)  
L
H
X
L
L
X
H
L
H
X
X
L
L
Z
Z
H
=
=
=
=
H
X
L
HIGH Voltage Level  
Immaterial  
LOW Voltage Level  
High Impedance  
Z
Block Diagrams  
Byte-A  
DS100323-2  
Tap Controller  
DS100323-3  
www.national.com  
2
Block Diagrams (Continued)  
Byte-B  
DS100323-4  
Note: BSR stands for Boundary Scan Register  
3
www.national.com  
Description of BOUNDARY-SCAN Circuitry  
The scan cells used in the BOUNDARY-SCAN register are  
one of the following two types depending upon their location.  
Scan cell TYPE1 is intended to solely observe system data,  
while TYPE2 has the additional ability to control system  
data. (See IEEE Standard 1149.1 Figure 10–11 for a further  
description of scan cell TYPE1 and Figure 10–12 for a fur-  
ther description of scan cell TYPE2.)  
clude the IEEE 1149.1 optional identification register. There-  
fore, this unique captured value can be used as a “pseudo  
ID” code to confirm that the correct device is placed in the  
appropriate location in the boundary scan chain.  
Instruction Register Scan Chain Definition  
Scan cell TYPE1 is located on each system input pin while  
scan cell TYPE2 is located at each system output pin as well  
as at each of the two internal active-high output enable sig-  
nals. AOE controls the activity of the A-outputs while BOE  
controls the activity of the B-outputs. Each will activate their  
respective outputs by loading a logic high.  
DS100323-10  
MSB LSB  
The BYPASS register is a single bit shift register stage iden-  
tical to scan cell TYPE1. It captures a fixed logic low.  
Instruction Code  
Instruction  
EXTEST  
00000000  
10000001  
10000010  
00000011  
All Others  
Bypass Register Scan Chain Definition  
Logic 0  
SAMPLE/PRELOAD  
CLAMP  
HIGH-Z  
BYPASS  
DS100323-9  
The INSTRUCTION register is an 8-bit register which cap-  
tures the default value of 01001101. The two least significant  
bits of this captured value (01) are required by IEEE Std  
1149.1. The upper six bits are unique to the SCAN18540T  
device. SCAN CMOS Test Access Logic devices do not in-  
www.national.com  
4
Description of BOUNDARY-SCAN Circuitry (Continued)  
Scan Cell TYPE1  
DS100323-7  
Scan Cell TYPE2  
DS100323-8  
5
www.national.com  
Description of BOUNDARY-SCAN Circuitry (Continued)  
BOUNDARY-SCAN Register  
Scan Chain Definition (42 Bits in Length)  
DS100323-23  
www.national.com  
6
Description of BOUNDARY-SCAN Circuitry (Continued)  
BOUNDARY-SCAN Register Definition Index  
Bit No.  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
Pin Name  
AOE1  
AOE2  
AOE  
BOE1  
BOE2  
BOE  
AI0  
Pin No.  
Pin Type  
Input  
Scan Cell Type  
TYPE1  
3
54  
Input  
TYPE1  
TYPE2  
TYPE1  
TYPE1  
TYPE2  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE1  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
TYPE2  
Internal  
Input  
Control  
Signals  
26  
31  
Input  
Internal  
Input  
55  
53  
52  
50  
49  
47  
46  
44  
43  
42  
41  
39  
38  
36  
35  
33  
32  
30  
2
AI1  
Input  
AI2  
Input  
AI3  
Input  
AI4  
Input  
A–in  
AI5  
Input  
AI6  
Input  
AI7  
Input  
AI8  
Input  
BI0  
Input  
BI1  
Input  
BI2  
Input  
BI3  
Input  
BI4  
Input  
B–in  
BI5  
Input  
BI6  
Input  
BI7  
Input  
BI8  
Input  
AO0  
AO1  
AO2  
AO3  
AO4  
AO5  
AO6  
AO7  
AO8  
BO0  
BO1  
BO2  
BO3  
BO4  
BO5  
BO6  
BO7  
BO8  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
Output  
4
5
7
8
A–out  
10  
11  
13  
14  
15  
16  
18  
19  
21  
22  
24  
25  
27  
8
7
6
5
4
B–in  
3
2
1
0
7
www.national.com  
Absolute Maximum Ratings (Note 1)  
ESD (Min)  
2000V  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Recommended Operating  
Conditions  
Supply Voltage (VCC  
)
−0.5V to +7.0V  
Supply Voltage (VCC  
)
DC Input Diode Current (IIK  
)
SCAN Products  
4.5V to 5.5V  
0V to VCC  
0V to VCC  
=
VI −0.5V  
−20 mA  
+20 mA  
Input Voltage (VI)  
=
VI VCC +0.5V  
DC Output Diode Current (IOK  
Output Voltage (VO  
)
)
Operating Temperature (TA)  
Military  
=
VO −0.5V  
−20 mA  
+20 mA  
−55˚C to +125˚C  
125 mV/ns  
=
VO VCC +0.5V  
Minimum Input Edge Rate dV/dt  
VIN from 0.8V to 2.0V  
DC Output Voltage (VO  
)
−0.5V to VCC +0.5V  
±
DC Output Source/Sink Current (IO  
DC VCC or Ground Current  
Per Output Pin  
)
70 mA  
@
VCC 4.5V, 5.5V  
Note 1: Absolute maximum ratings are those values beyond which damage  
to the device may occur. The databook specifications should be met, without  
exception, to ensure that the system design is reliable over its power supply,  
temperature, and output/input loading variables. National does not recom-  
mend operation of SCAN circuits outside databook specifications.  
±
70 mA  
Junction Temperature  
Cerpack  
+175˚C  
Storage Temperature  
−65˚C to +150˚C  
DC Electrical Characteristics  
Symbol  
Parameter  
VCC  
Military  
Units  
Conditions  
(V)  
=
TA −55˚C to +125˚C  
Guaranteed Limits  
=
VIH  
VIL  
Minimum High  
Input Voltage  
Maximum Low  
Input Voltage  
Minimum High  
Output Voltage  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
5.5  
2.0  
2.0  
V
V
V
V
V
VOUT 0.1V  
or VCC −0.1V  
=
0.8  
VOUT 0.1V  
0.8  
or VCC −0.1V  
=
IOUT −50 µA  
VOH  
3.15  
4.15  
2.4  
=
VIN VIL or VIH  
=
IOH −24 mA  
2.4  
=
IOUT 50 µA  
VOL  
Maximum Low  
Output Voltage  
0.1  
0.1  
=
VIN VIL or VIH  
0.55  
0.55  
=
IOL 48 mA  
=
±
IIN  
Maximum Input  
Leakage Current  
Maximum Input  
Leakage  
1.0  
µA  
VI VCC, GND  
=
VI VCC  
IIN  
5.5  
5.5  
5.5  
3.7  
µA  
µA  
µA  
=
VI GND  
TDI,  
TMS  
−385  
−160  
=
VI GND  
Minimum Input  
Leakage  
=
VOLD 0.8V Max  
IOLD  
IOHD  
Minimum Dynamic  
63  
mA  
mA  
=
Output Current  
(Note 2)  
−27  
VOHD 2.0V Min  
=
±
IOZ  
IOS  
ICC  
Maximum Output  
Leakage Current  
Output Short  
5.5  
5.5  
5.5  
5.5  
10.0  
−100  
168  
µA  
VI (OE) VIL, VIH  
=
VO 0V  
mA Min  
µA  
Circuit Current  
=
VO Open  
Maximum Quiescent  
Supply Current  
=
TDI, TMS VCC  
=
VO Open  
930  
µA  
=
TDI, TMS GND  
www.national.com  
8
DC Electrical Characteristics (Continued)  
Symbol  
Parameter  
VCC  
(V)  
Military  
Units  
Conditions  
=
TA −55˚C to +125˚C  
Guaranteed Limits  
2.0  
=
VI VCC–2.1V  
ICCt  
Maximum ICC Per  
Input  
5.5  
5.5  
mA  
mA  
=
VI VCC–2.1V  
2.15  
TDI/TMS Pin, Test  
One with the  
other Floating  
Note 2: Maximum test duration 2.0 ms, one output loaded at a time.  
Note 3: All outputs loaded; thresholds associated with output under test.  
Noise Specifications  
Symbol  
Parameter  
VCC  
(V)  
Military  
Units  
=
TA −55˚C to +125˚C  
Guaranteed Limits  
0.8  
VOLP  
Maximum High  
Output Noise  
(Notes 4, 5)  
5.0  
5.0  
V
V
VOLV  
Minimum Low  
Output Noise  
(Notes 4, 5)  
-0.8  
Note 4: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched LOW and one output held LOW.  
Note 5: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched HIGH and one output held HIGH.  
AC Electrical Characteristics  
Normal Operation  
Symbol  
Parameter  
VCC  
(V)  
(Note 7)  
Military  
Units  
=
TA −55˚C  
to +125˚C  
=
CL 50 pF  
Min  
2.5  
2.5  
1.5  
1.5  
2.0  
2.0  
Max  
10.5  
11.0  
11.2  
11.2  
14.0  
12.0  
tPLH  
tPHL  
tPLZ  
tPHZ  
tPZL  
tPZH  
,
Propagation Delay  
Data to Q  
5.0  
5.0  
5.0  
ns  
ns  
ns  
,
Disable Time  
,
Enable Time  
AC Electrical Characteristics  
Scan Test Operation  
Symbol  
Parameter  
VCC  
(V)  
(Note 7)  
Military  
Units  
=
TA −55˚C to  
+125˚C  
=
CL 50 pF  
Min  
3.5  
3.5  
2.5  
2.5  
Max  
15.8  
15.8  
12.8  
12.8  
tPLH  
tPHL  
tPLZ  
tPHZ  
,
Propagation Delay  
TCK to TDO  
5.0  
5.0  
ns  
ns  
,
Disable Time  
TCK to TDO  
9
www.national.com  
AC Electrical Characteristics (Continued)  
Scan Test Operation  
Symbol  
Parameter  
VCC  
(V)  
(Note 7)  
Military  
Units  
=
TA −55˚C to  
+125˚C  
=
CL 50 pF  
Min  
3.0  
3.0  
Max  
16.7  
16.7  
tPZL  
tPZH  
tPLH  
tPHL  
,
Enable Time  
5.0  
5.0  
ns  
ns  
TCK to TDO  
,
Propagation Delay  
TCK to Data Out  
During Update-  
-DR State  
5.0  
5.0  
21.7  
21.7  
tPLH  
,
,
Propagation Delay  
TCK to Data Out  
During Update-  
IR State  
tPHL  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
21.2  
21.2  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tPLH  
tPHL  
Propagation Delay  
TCK to Data Out  
During Test Logic  
Reset State  
5.5  
5.5  
23.0  
23.0  
tPLZ  
,
Propagation Delay  
TCK to Data Out  
During Update-  
DR State  
tPHZ  
4.0  
4.0  
19.6  
19.6  
tPLZ  
,
Propagation Delay  
TCK to Data Out  
During Update-  
IR State  
tPHZ  
5.0  
5.0  
22.4  
22.4  
tPLZ  
,
Propagation Delay  
TCK to Data Out  
During Test Logic  
Reset State  
tPHZ  
5.0  
5.0  
23.3  
23.3  
tPZL  
,
Propagation Delay  
TCK to Data Out  
During Update-  
DR State  
tPZH  
5.0  
5.0  
22.6  
22.6  
5.0  
5.0  
tPZL  
,
Propagation Delay  
TCK to Data Out  
During Update-  
IR State  
tPZH  
6.5  
6.5  
26.2  
26.2  
tPZL  
,
Propagation Delay  
TCK to Data Out  
During Test Logic  
Reset State  
tPZH  
5.0  
7.0  
7.0  
27.4  
27.4  
Note 6: All Propagation Delays involving TCK are measured from the falling edge of TCK.  
www.national.com  
10  
AC Operating Requirements  
Scan Test Operation  
Symbol  
Parameter  
VCC  
(V)  
(Note 7)  
Military  
TA −55˚C to +125˚C  
Units  
=
=
CL 50 pF  
Guaranteed Minimum  
tS  
tH  
tS  
Setup Time, H or L  
Data to TCK (Note 8)  
Hold Time, H or L  
TCK to Data (Note 8)  
Setup Time, H or L  
AOEn, BOEn  
5.0  
5.0  
3.0  
ns  
ns  
5.5  
3.0  
4.5  
3.0  
5.0  
5.0  
5.0  
ns  
ns  
ns  
to TCK (Note 10)  
Hold Time, H or L  
TCK to AOEn,  
tH  
tS  
tH  
BOEn (Note 10)  
Setup Time, H or L  
Internal AOE, BOE,  
to TCK (Note 9)  
Hold Time, H or L  
TCK to Internal  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
3.0  
8.0  
2.0  
4.0  
4.5  
ns  
ns  
ns  
ns  
ns  
AOE, BOE (Note 9)  
Setup Time, H or L  
TMS to TCK  
tS  
tH  
tS  
tH  
tW  
Hold Time, H or L  
TCK to TMS  
Setup Time, H or L  
TDI to TCK  
Hold Time, H or L  
TCK to TDI  
Pulse Width TCK  
H
12.0  
5.0  
25  
ns  
MHz  
ns  
L
fmax  
TPU  
TDN  
Maximum TCK  
Clock Frequency  
Wait Time,  
5.0  
5.0  
0.0  
100  
100  
Power Up to TCK  
Power Down Delay  
ms  
±
Note 7: Voltage Range 5.0 is 5.0V 0.5V.  
All Input Timing Delays involving TCK are measured from the rising edge of TCK.  
Note 8: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17, 18-26, and 27-35.  
Note 9: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only.  
Note 10: Timing pertains to BSR 37, 38, 40 and 41.  
11  
www.national.com  
Capacitance  
Symbol  
CIN  
Parameter  
Input Pin Capacitance  
Output Pin Capacitance  
Power Dissipation  
Capacitance  
Typ  
4.0  
Units  
pF  
Conditions  
=
VCC 5.0V  
=
VCC 5.0V  
COUT  
CPD  
13.0  
34.0  
pF  
=
VCC 5.0V  
pF  
www.national.com  
12  
13  
Physical Dimensions inches (millimeters) unless otherwise noted  
56-Lead Ceramic Flatpak (F)  
NS Package Number WA56A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-  
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-  
CONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or sys-  
tems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, and whose fail-  
ure to perform when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
National Semiconductor  
Corporation  
Americas  
Tel: 1-800-272-9959  
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Email: support@nsc.com  
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Response Group  
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Fax: 65-2504466  
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Tel: 81-3-5620-6175  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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