QED633 [FAIRCHILD]
Infrared LED, 5mm, 1-Element, 940nm, PLASTIC PACKAGE-2;![QED633](http://pdffile.icpdf.com/pdf2/p00308/img/icpdf/QED633_1853565_icpdf.jpg)
型号: | QED633 |
厂家: | ![]() |
描述: | Infrared LED, 5mm, 1-Element, 940nm, PLASTIC PACKAGE-2 光电 半导体 |
文件: | 总4页 (文件大小:86K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QED633
QED634
PACKAGE DIMENSIONS
0.195 (4.95)
REFERENCE
SURFACE
0.305 (7.75)
0.040 (1.02)
NOM
0.800 (20.3)
MIN
0.050 (1.25)
CATHODE
0.100 (2.54)
NOM
0.240 (6.10)
0.215 (5.45)
0.020 (0.51)
SQ. (2X)
SCHEMATIC
NOTES:
ANODE
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of .010 (.25) on all nonꢀnominal dimensions
unless otherwise specified.
CATHODE
DESCRIPTION
The QED634 is a 940 nm GaAs / AlGaAs LED encapsulated in a clear untinted, plastic Tꢀ1 3/4 package.
FEATURES
• ꢀ= 940 nm
• Chip material =GaAs with AlGaAs window
• Package type: T-1 3/4 (5mm lens diameter)
• Matched Photosensor: QSD122/123/124
• Wide Emission Angle, 55°
• High Output Power
• Package material and color: Clear, untinted, plastic
• Ideal for remote control applications
2001 Fairchild Semiconductor Corporation
DS300207
6/8/01
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www.fairchildsemi.com
PLASTIC INFRARED
LIGHT EMITTING DIODE
QED633
QED634
(T = 25°C unless otherwise specified)
ABSOLUTE MAXIMUM RATINGS
A
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)(2,3,4)
Soldering Temperature (Flow)(2,3)
Continuous Forward Current
Reverse Voltage
Symbol
TOPR
TSTG
TSOLꢀI
TSOLꢀF
IF
Rating
ꢀ40 to +100
ꢀ40 to +100
240 for 5 sec
260 for 10 sec
100
Unit
°C
°C
°C
°C
mA
V
VR
5
Power Dissipation(1)
PD
200
mW
A
Peak Forward Current
IFP
1.5
1. Derate power dissipation linearly 2.67 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16” (1.6mm) minimum from housing.
5. Pulse conditions; tp = 100 µs, T = 10 ms.
(TA =25°C)
ELECTRICAL / OPTICAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
IF = 20 mA
DEVICE
ALL
SYMBOL
ꢀPE
MIN
—
50
—
—
—
—
—
15
20
—
—
—
TYP
MAX
—
UNITS
Peak Emission Wavelength
Spectral Bandwidth
Temp. Coefficient of ꢀPE
Emission Angle
940
—
nm
IF = 20 mA
ALL
—
nm
—
IF = 100 mA
ALL
TCꢀ
0.2
55
nm/K
Deg.
V
IF = 100 mA
ALL
2ꢁ1/
—
2
Forward Voltage
IF = 100 mA, tp = 20 ms
IF = 100 mA
ALL
VF
—
1.6
—
Temp. Coefficient of VF
Reverse Current
ALL
TCV
IR
ꢀ1.5
—
mV/K
µA
VR = 5 V
ALL
10
—
QED633
QED634
ALL
25
Radiant Intensity
IF = 100 mA, tp = 20 ms
IE
mW/sr
25
—
Temp. Coefficient of IE
Rise Time
IF = 20 mA
TCI
tr
ꢀ0.6
1000
1000
—
%/K
ns
ALL
—
IF = 100 mA
Fall Time
ALL
tf
—
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QED633
QED634
TYPICAL PERFORMANCE CURVES TBD
Fig. 1 Normalized Radiant Intensity vs. Forward Current
Fig. 2 Forward Voltage Vs. Ambient Temperature
10
2.0
1.5
1.0
0.5
0.0
I
= 50mA
I =100mA
F
F
Normalized to:
I
= 100 mA
1
0.1
F
T
A
= 25˚C
t
= 100 µs
pw
I
=10mA
I =20mA
F
F
0.01
I
t
Pulsed
F
= 100 µs
pw
Duty Cycle = 0.1%
-40
-20
0
20
40
60
80
100
1
10
100
1000 1500
I
- FORWARD CURRENT (mA)
T
ꢀ AMBIENT TEMPERATURE (˚ C)
A
F
Fig. 3 Normalized Radiant Intensity vs. Wavelength
Fig. 4 Radiation Diagram
90
100
80
1.0
0.8
0.6
0.4
0.2
0
110
70
120
60
130
50
140
150
160
40
30
20
10
0
170
180
800
850
900
950
1000
1050
0.0
0.2
0.4
0.6
0.4
0.2
0.6
0.8
1.0
1.0
0.8
λλ(nm)
Fig. 5 Forward Current vs. Forward Voltage
1000
100
10
T
= 25˚C
A
1
1
2
3
4
V
- FORWARD VOLTAGE (V)
F
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6/8/01
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QED633
QED634
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT
ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT
DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
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DS300207
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