QEE113E3R0 [FAIRCHILD]
Plastic Infrared Light Emitting Diode; 塑料红外发光二极管型号: | QEE113E3R0 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Plastic Infrared Light Emitting Diode |
文件: | 总5页 (文件大小:125K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
August 2008
QEE113
Plastic Infrared Light Emitting Diode
Features
PACKAGE DIMENSIONS
Description
■ λ= 940nm
The QEE113 is a 940nm GaAs LED encapsulated in a
medium wide angle, plastic sidelooker package.
■ Package Type = Sidelooker
■ Chip Material = GaAs
■ Matched Photosensor: QSE113
■ Medium Wide Emission Angle, 50°
■ Package Material: Clear Epoxy
■ High Output Power
■ Gray stripe on the top side
Package Dimensions
0.175 (4.44)
Ø0.065 (1.65)
0.087 (2.22)
0.050 (1.27)
0.200 (5.08)
Ø0.095 (2.41)
0.500 (12.70)
MIN
CATHODE
ANODE
0.020 (0.51) SQ.
(2X)
Schematic
0.100 (2.54)
ANODE
0.030 (0.76)
CATHODE
0.100 (2.54)
NOM
Notes:
1. Dimensions of all drawings are in inches (mm).
2. Tolerance is 0.010 (0.25) on all nonꢀnominal dimensions
unless otherwise specified.
©2002 Fairchild Semiconductor Corporation
QEE113 Rev. 1.0.1
www.fairchildsemi.com
Absolute Maximum Ratings (T = 25°C unless otherwise specified)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Rating
-40 to +100
-40 to +100
240 for 5 sec
260 for 10 sec
50
Units
°C
T
Operating Temperature
Storage Temperature
OPR
T
°C
STG
(2,3,4)
T
Soldering Temperature (Iron)
Soldering Temperature (Flow)
Continuous Forward Current
Reverse Voltage
°C
SOL-I
(2,3)
T
°C
SOL-F
I
mA
V
F
V
P
5
R
(1)
Power Dissipation
100
mW
D
Notes:
1. Derate power dissipation linearly 1.33mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6mm) minimum from housing.
Electrical / Optical Characteristics (T = 25°C)
A
Symbol Parameter
Test Conditions
Min.
Typ.
945
0.3
Max.
Units
λ
Peak Emission Wavelength
Temperature Coefficient
Emission Angle
I = 20mA
nm
nm / °C
°
PE
F
TC
λ
1
2Θ /2
I = 100mA
50
F
V
Forward Voltage
I = 100mA, tp = 20ms
1.5
V
F
F
TC
Temperature Coefficient
Reverse Current
-2
mV / °C
µA
VF
I
V = 5V
10
12
R
R
I
Radiant Intensity
I = 100mA, tp = 20ms
3
7.5
-0.7
800
800
14
mW/sr
% / °C
ns
E
F
TC
Temperature Coefficient
Rise Time
IE
t
I = 100mA
F
r
t
Fall Time
ns
f
C
Junction Capacitance
V = 0V
pF
j
R
©2002 Fairchild Semiconductor Corporation
QEE113 Rev. 1.0.1
www.fairchildsemi.com
2
Typical Performance Curves
Fig. 1 Normalized Intensity vs. Wavelength
Fig. 2 Peak Wavelength vs. Ambient Temperature
1.0
975
970
965
960
955
950
945
940
935
I
= 20mA DC
F
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
700
750
800
850
900
λ (nm)
950
1,000
1,050
80
TA – AMBIENT TEMPERTURE (°C)
90
100
0
10
20
30
40
50
60
70
Fig. 4 Normalized Radient Intensity vs. Ambient Temperature
Fig. 3 Normalized Radiant Intensity vs. Forward Current
10
1.4
Normalized to:
Normalized to:
I
t
= 100mA Pulsed
F
1.2
1.0
0.8
0.6
0.4
0.2
0.0
I
t
= 20mA Pulsed
F
= 20ms
PW
= 20ms
PW
Duty Cycle = 4%
= 25°C
Duty Cycle = 4%
T
A
T
= 25°C
A
1
0.1
10
80
90
100
0
10
20
30
40
50
60
70
100
1000
TA – AMBIENT TEMPERTURE (°C)
IF – FORWARD CURRENT (mA)
Fig. 6 Forward Voltage vs. Ambient Temperature
Fig. 5 Forward Voltage vs. Forward Current
3.5
3.0
2.5
2.0
1.5
1.0
1.55
1.50
1.45
1.40
1.35
1.30
1.25
I
t
Pulsed
F
I
t
= 20mA Pulsed
F
= 20ms
PW
= 20ms
PW
Duty Cycle = 4%
= 25°C
Duty Cycle = 4%
T
A
80
TA – AMBIENT TEMPERTURE (°C)
90
100
0
10
20
30
40
50
60
70
10
100
1000
IF – FORWARD CURRENT (mA)
©2002 Fairchild Semiconductor Corporation
QEE113 Rev. 1.0.1
www.fairchildsemi.com
3
Typical Performance Curves (Continued)
Fig. 8 Coupling Characteristics of QEE113 And QSE113
1.0
0.8
0.6
0.4
0.2
0.0
Fig. 7 Radiation Diagram
Normalized to:
d = 0 inch
90°
100°
80°
110°
70°
I
t
Pulsed
F
120°
= 100µs
60°
pw
Duty Cycle = 0.1%
130°
50°
V
R
= 5V
= 100Ω
= 25°C
CC
L
140°
150°
160°
40°
T
A
30°
20°
170°
10°
180°
1.0
0°
1.0
0.8
0.6
0.4
0.2
0.0
0.2
0.4
0.6
0.8
0
1
2
3
4
5
6
LENS TIP SEPARATION (inches)
©2002 Fairchild Semiconductor Corporation
QEE113 Rev. 1.0.1
www.fairchildsemi.com
4
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
PowerTrench®
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
The Power Franchise®
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
GTO™
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
µSerDes™
Current Transfer Logic™
EcoSPARK®
IntelliMAX™
EfficentMax™
EZSWITCH™ *
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
™
SMART START™
®
SPM®
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
Fairchild®
UHC®
Ultra FRFET™
UniFET™
VCX™
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
OPTOPLANAR®
FAST®
FastvCore™
FlashWriter® *
FPS™
®
VisualMax™
SyncFET™
®
PDP SPM™
Power-SPM™
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
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any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Advance Information
Preliminary
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
First Production
Full Production
Not In Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
No Identification Needed
Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The
datasheet is for reference information only.
Rev. I36
©2002 Fairchild Semiconductor Corporation
QEE113 Rev. 1.0.1
www.fairchildsemi.com
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