QED522 [FAIRCHILD]
PLASTIC INFRARED LIGHT EMITTING DIODE; 塑料红外发光二极管
| 型号： | QED522 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | PLASTIC INFRARED LIGHT EMITTING DIODE |
| 文件： | 总4页 (文件大小：385K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PLASTIC INFRARED
LIGHT EMITTING DIODE
QED522 QED523
PACKAGE DIMENSIONS
0.190 (4.83)
0.178 (4.52)
REFERENCE
SURFACE
0.220 (5.59)
0.030 (0.76)
NOM
0.800 (20.3)
MIN
0.050 (1.27)
CATHODE
0.100 (2.54)
NOM
Ø 0.215 (5.46)
NOM
SCHEMATIC
45°
0.020 (0.51)
SQ. (2X)
ANODE
R 0.022 (0.56)
CATHODE
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of .010 (.25) on all nonꢀnominal dimensions ꢁnless
otherwise specified.
DESCRIPTION
The QED522/523 is an 880 nm AlGaAs LED encapsulated in a clear, peach tinted, plastic TO-46 package.
FEATURES
•
•
•
•
•
•
•
λ= 880 nm
Chip material = AlGaAs
Package type: Plastic TO-46
Matched Photosensor: QSD722/723/724
Narrow Emission Angle, 20°
High Output Power
Package material and color: clear, peach tinted, plastic
© 2002 Fairchild Semiconductor Corporation
Page 1 of 4
6/13/02
PLASTIC INFRARED
LIGHT EMITTING DIODE
QED522 QED523
ABSOLUTE MAXIMUM RATINGS (T = 25°C ꢁnless otherwise specified)
A
Parameter
Symbol
Rating
ꢀ40 to + 100
ꢀ40 to + 100
240 for 5 sec
260 for 10 sec
100
Unit
°C
T
Operating Temperatꢁre
Storage Temperatꢁre
OPR
T
°C
STG
(2,3,4)
(2,3)
T
°C
Soldering Temperatꢁre (Iron)
SOLꢀI
T
°C
Soldering Temperatꢁre (Flow)
Continꢁoꢁs Forward Cꢁrrent
Reverse Voltage
SOLꢀF
I
mA
V
F
V
5
R
(1)
P
200
mW
Power Dissipation
D
NOTES:
1. Derate power dissipation linearly 2.67 mW/°C above 25°C.
2. RMA flꢁx is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6 mm) minimꢁm from hoꢁsing
.
ELECTRICAL / OPTICAL CHARACTERISTICS (T =25°C)
A
Parameter
Test Conditions
Symbol
Min
—
Typ
880
20
Max
—
Units
I = 100 mA
λ
PE
Peak Emission Wavelength
Emission Angle
nm
Deg.
V
F
I = 100 mA
2Θ1/2
—
—
F
I = 100 mA, tp = 20 ms
V
Forward Voltage
Reverse Cꢁrrent
Radiant Intensity QEC522
Radiant Intensity QEC523
Rise Time
—
—
1.8
10
80
—
F
F
V = 5 V
I
—
—
µA
R
R
I = 100 mA, tp = 20 ms
I
20
40
—
—
mW/sr
mW/sr
ns
F
E
I = 100 mA, tp = 20 ms
I
—
F
E
t
800
800
—
r
I = 100 mA
F
t
Fall Time
—
—
ns
f
© 2002 Fairchild Semicondꢁctor Corporation
Page 2 of 4
6/13/02
PLASTIC INFRARED
LIGHT EMITTING DIODE
QED522 QED523
Fig. 1 Normalized Radiant Intensity vs. Forward Current
Fig. 2 Forward Voltage vs. Ambient Temperature
10
2.0
I
= 50 mA
Normalized to:
F
I
t
= 100 mA Pꢁlsed
F
= 100 µs
pw
I
I
= 100 mA
= 10 mA
F
F
Dꢁty Cycle = 0.1 %
= 25°C
1
0.1
1.5
1.0
0.5
0.0
T
A
I
= 20 mA
F
0.01
0.001
Normalized to:
I
t
Pꢁlsed
F
= 100 µs
pw
Dꢁty Cycle = 0.1 %
1
10
100
1000
ꢀ40
ꢀ20
0
20
40
60
80
100
I
F
ꢀ FORWARD CURRENT (mA)
T
A
ꢀ AMBIENT TEMPERATURE (°C)
Fig. 3 Normalized Radiant Intensity vs. Wavelength
1.0
Fig. 4 Radiation Diagram
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
90
100
80
110
70
120
60
130
50
140
40
150
160
170
30
20
10
0
180
0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.0
0.8
0.6
0.4
775
800
825
850
875
900
925
950
λ(nm)
© 2002 Fairchild Semicondꢁctor Corporation
Page 3 of 4
6/13/02
PLASTIC INFRARED
LIGHT EMITTING DIODE
QED522 QED523
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As ꢁsed herein:
1. Life sꢁpport devices or systems are devices or systems
which, (a) are intended for sꢁrgical implant into the body, or
(b) sꢁpport or sꢁstain life, and (c) whose failꢁre to perform
when properly ꢁsed in accordance with instrꢁctions for ꢁse
provided in the labeling, can be reasonably expected to
resꢁlt in a significant injꢁry of the ꢁser.
2. A critical component in any component of a life sꢁpport
device or system whose failꢁre to perform can be
reasonably expected to caꢁse the failꢁre of the life sꢁpport
device or system, or to affect its safety or effectiveness.
© 2002 Fairchild Semicondꢁctor Corporation
Page 4 of 4
6/13/02
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