FODM453R2_技术文档

July 2010

FODM452, FODM453

5-Pin Mini Flat Package High Speed Transistor

Optocoupler

Features

Description

■ Compact 5-pin mini flat package

■ High speed-1 MBit/s

The FODM452 and FODM453 optocouplers consist of

an AlGaAs LED optically coupled to a high speed photo-

detector transistor. The devices are housed in a compact

5-pin mini flat package for optimum mounting density.

The FODM453 features a high CMR rating for optimum

■ Superior CMR-15kV/µs at V

= 1500V (FODM453)

CM

■ Performance guaranteed over temperature (0–70°C)

■ U.L. recognized (File # E90700)

common mode transient immunity.

■ VDE0884 recognized (File # 136480)

– Ordering option V, e.g., FODM452V

Related Resources

■ 260°C reflow capability for Pb-free assembly

■ www.fairchildsemi.com/products/opto/

Applications

■ Line receivers

■ www.fairchildsemi.com/pf/FO/FODM611.html

■ www.fairchildsemi.com/pf/FO/FODM8061.html

■ www.fairchildsemi.com/pf/FO/FODM8071.html

■ Pulse transformer replacement

■ Output interface to CMOS-LSTTL-TTL

■ Wide bandwidth analog coupling

Functional Schematic

Truth Table

V_CC

ANODE

1

6

5

LED

Off

Output

High

V_O

On

Low

CATHODE

GND

3

4

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

Pin Definitions

Number

Name

ANODE

CATHODE

GND

Function Description

1

3

4

5

6

Anode

Cathode

Output Ground

Output Voltage

Output Supply Voltage

V

O

V

CC

Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin)

As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the

safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.

Symbol

Parameter

Installation Classiﬁcations per DIN VDE 0110/1.89 Table 1

For rated main voltage < 150Vrms

For rated main voltage < 300Vrms

Climatic Classiﬁcation

Min.

Typ.

Max.

Unit

I-IV

I-III

40/85/21

2

Pollution Degree (DIN VDE 0110/1.89)

Comparative Tracking Index

CTI

175

V

Input to Output Test Voltage, Method b,

1060

PR

VIORM x 1.875 = V , 100% Production Test with

PR

t

= 1 sec, Partial Discharge < 5 pC

m

V

Input to Output Test Voltage, Method a,

VIORM x 1.5 = V , Type and Sample Test with

848

PR

t

= 60 sec, Partial Discharge < 5 pC

m

V

Max Working Insulation Voltage

Highest Allowable Over Voltage

External Creepage

565

4000

5.0

V

IORM

peak

V

IOTM

peak

mm

°C

External Clearance

5.0

Insulation thickness

0.5

T

Safety Limit Values, Maximum Values allowed in the event

of a failure, Case Temperature

150

Case

9

R

Insulation Resistance at T , V = 500V

10

Ω

IO

S

IO

FODM452, FODM453 Rev. 1.0.5

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2

Absolute Maximum Ratings ^{(T = 25°C unless otherwise noted)}

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Value

Units

°C

T

Storage Temperature

Operating Temperature

-40 to +125

-40 to +85

STG

T

°C

OPR

EMITTER

I (avg)

DC/Average Forward Input Current

25

50

1.0

5

mA

A

F

I (pk)

Peak Forward Input Current (50% duty cycle, 1ms P.W.)

Peak Transient Input Current (≤1µs P.W., 300pps)

Reverse Input Voltage

F

I (trans)

F

V

P

V

R

D

Input Power Dissipation

45

mW

(No derating required over speciﬁed operating temp range)

DETECTOR

I

(avg)

(pk)

Average Output Current

Peak Output Current

Supply Voltage

8

mA

V

O

I

16

O

V

-0.5 to 30

-0.5 to 20

100

CC

V

Output Voltage

V

O

P

Output Power Dissipation

mW

D

(No derating required over speciﬁed operating temp range)

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

3

Electrical Characteristics ^(T= 0 to 70°C unless otherwise specified)

A

Individual Component Characteristics

Symbol

EMITTER

Parameter

Test Conditions

Min. Typ.* Max. Unit

V

Input Forward Voltage

I = 16mA, T = 25°C

1.60

1.7

1.8

V

F

A

I = 16mA

F

B

Input Reverse Breakdown Voltage

I

= 10µA

5.0

V

VR

R

∆V /∆T

Temperature Coefﬁcient of

Forward Voltage

I = 16mA

-1.8

mV/°C

F

A

F

DETECTOR

I

Logic High Output Current

I = 0mA, V = V = 5.5V, T =25°C

.001

0.5

1

µA

OH

F

O

CC

A

I = 0 mA, V = V = 15V, T =25°C

F

O

CC

A

I = 0mA, V = V = 15V

50

200

1

F

O

CC

I

Logic Low Supply Current

Logic high supply current

I = 16mA, V = Open, V = 15V

100

µA

CCL

F

O

CC

I

I = 0 mA, V = Open, V = 15V,

0.05

CCH

F

O

CC

T = 25°C

A

I = 0mA, V = Open, V = 15V

2

F

O

CC

Transfer Characteristics

Symbol

COUPLED

CTR

Parameter

Test Conditions

Min. Typ.* Max Unit

(1)

Current Transfer Ratio

I = 16mA, V = 4.5V

T = 25°C V =0.4V

20

15

50

%

V

F

CC

A

OL

V

=0.5V

OL

V

Logic LOW Output

Voltage

I = 16mA, I = 3mA, V = 4.5V, T =2 5°C

0.4

0.5

OL

F

O

CC

A

I = 16mA, I = 2.4mA, V = 4.5 V

F

O

CC

Switching Characteristics (V = 5V)

CC

Symbol

Parameter

Test Conditions

Device Min. Typ.* Max. Unit

(2)

T

Propagation Delay

Time to Logic LOW

R = 1.9kΩ, I = 16mA, T = 25°C (Fig. 9)

0.40

0.8

1.0

0.8

1.0

µs

PHL

PLH

L

F

A

(2)

R = 1.9kΩ, I = 16mA (Fig. 9)

L

F

(2)

Propagation Delay

Time to Logic HIGH

R = 1.9kΩ, I = 16mA, T = 25°C (Fig. 9)

0.35

µs

L

F

A

(2)

R = 1.9kΩ, I = 16mA (Fig. 9)

µs

L

F

|CM |

Common Mode

Transient Immunity

at Logic HIGH

I = 0mA, V

= 10V , R = 1.9kΩ,

FODM452

FODM453

5

15

40

KV/µs

H

F

CM

P-P

L

(3)

T = 25°C (Fig. 10)

A

I = 0mA, V

= 1500V , R = 1.9kΩ

15

KV/µs

MHz

F

CM

(3)

P-P

L

T = 25°C (Fig. 10)

A

|CM |

Common Mode

Transient Immunity

at Logic LOW

I = 16mA, V

= 10V , R = 1.9kΩ,

FODM452

FODM453

5

15

40

3

L

F

CM

P-P

L

(3)

T = 25°C (Fig. 10)

A

I = 16mA, V

= 1500V , R = 1.9kΩ,

15

F

CM

P-P

L

(3)

T = 25°C (Fig. 10)

A

BW

Bandwidth

R = 100Ω

L

Isolation Characteristics

Symbol Characteristics

Test Conditions

Min. Typ.* Max. Unit

(4)

V

Withstand Insulation Test Voltage

Capacitance (Input to Output)

RH ≤ 50%, T = 25°C, t = 1 min.

3750

V

RMS

ISO

A

(4)

C

f = 1MHz

0.2

pF

I-O

*All Typicals at T = 25°C

A

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

4

Notes:

1. Current Transfer Ratio is deﬁned as a ratio of output collector current, I , to the forward LED input current, I ,

O

F

times 100%.

2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.

3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the

cm

leading edge of the common mode pulse signal V , to assure that the output will remain in a logic high state

CM

(i.e., V > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dV /dt

O

cm

on the trailing edge of the common mode pulse signal, V , to assure that the output will remain in a logic low

CM

state (i.e., V < 0.8V).

O

4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted

together.

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

5

Typical Performance Curves

Fig. 1 Input Forward Current vs Forward Voltage

Fig. 2 Normalized Current Transfer Ratio vs. Input Current

100

10

1.20

1.15

1.10

1.05

1.00

0.95

0.90

V

= 0.4V

O

T

= 25°C

A

= 5V

CC

T

= 25°C

A

Normalized to I_F= 16mA

1

0.1

0.01

0.001

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1

10

V_F– FORWARD CURRENT (mA)

I

– INPUT CURRENT (mA)

F

Fig. 3 Normalized Current Transfer Ratio

vs. Ambient Temperature

Fig. 4 Logic High Output Current

vs. Ambient Temperature

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

I_F= 16mA

V

I

= V = 5V

CC

= 0V

O

F

V

= 0.4V

O

= 5V

CC

Normalized to T = 25°C

A

10

1

0.1

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

T

– TEMPERATURE (°C)

T

A

– AMBIENT TEMPERATURE

A

Fig. 5 DC and Pulsed Transfer Characteristics

Fig. 6 Propagation Delay vs. Load Resistance

10

14

12

T

V

= 25°C

A

T

V

= 25°C

= 5V

A

CC

= 5V

CC

I

F

I

F

= 16mA

= 10mA

I

F

= 40mA

10

8

35mA

30mA

t

PLH

25mA

20mA

1

6

4

15mA

t

PHL

10mA

5mA

2

0

0.1

0

2

4

6

8

10

12

14

16

1

2

3

4

5

6

7

8

9 10

V

O

– OUTPUT VOLTAGE (V)

R

– LOAD RESISTANCE (kΩ)

L

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

6

Typical Performance Curves (Continued)

Fig. 8 Frequency Response

Fig. 7 Propagation Delay vs. Ambient Temperature

1400

5

0

I

V

T

= 16mA

= 5V

I

V

R

= 16mA

= 5V

F

CC

F

CC

= 25°C

= 1.9kΩ

1200

1000

800

A

L

R

= 220Ω

L

R

= 100Ω

L

-5

600

R

= 470Ω

L

t

PHL

400

-10

-15

t

PLH

R

= 1kΩ

L

200

0

-40

-20

0

20

40

60

80

100

0.01

0.1

1

10

T

– AMBIENT TEMPERATURE (°C)

f – FREQUENCY (MHz)

A

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

7

Pulse

Generator

tr = 5ns

Z_O= 50

10% D.C.

I/f< 100µs

Noise

Shield

I_F

+

V_CC

+5 V

V_O

1

3

Ω

6

5

4

R_L

V_O

0.1 µF

C

L = 1.5 µF

I_FMonitor

GND

R_m

I_F

0

5 V

V_O

1.5 V

V_OL

T_PHL

T_PLH

Fig. 9 Switching Time Test Circuit

I_F

Noise

Shield

+

V_CC

+5 V

1

3

6

5

4

R_L

A

V_O

0.1 µF

B

V_FF

GND

-

V_CM

-

+

Pulse Gen

V_CM10 V

0 V

90% 90%

10%

t_r

10%

t_f

V_O

5 V

Switch at A : I_F= 0 mA

V_O

V_OL

Switch at A : I_F= 16 mA

Fig. 10 Common Mode Immunity Test Circuit

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

8

Package Dimensions

Notes:

1. No standard applies to this package.

2. All dimensions are in millimeters.

3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion.

4. Drawings filesname and revision: MKT-MFP05A.

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

9

Footprint Drawing for PCB Layout

0.61

1.27 1.27 1.27

Device

‘A’

Device

5.05

7.95

’

‘B

Pin1

1.45

2.54

End Stacking Configuration

Unutilized Solder Pad

Dimensions in millimeters

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

10

Tape and Reel Dimensions

P

2

D₀

P

0

t

K₀

E

A₀

W

W₁

B₀

F

d

D₁

P

2.54 Pitch

Description

Symbol

Dimensions (mm)

12.00 +0.30/-0.10

0.30 ±0.05

Tape Width

W

t

Tape Thickness

Sprocket Hole Pitch

Sprocket Hole Diameter

Sprocket Hole Location

Pocket Location

P₀

D₀

E

4.00 ±0.10

1.50 +0.10/-0.0

1.75 ±0.10

F

5.50 ±0.10

P₂

P

2.00 ±0.10

Pocket Pitch

8.00 ±0.10

Pocket Dimension

A₀

B₀

K₀

D₁

W₁

d

4.40 ±0.10

7.30 ±0.10

2.30 ±0.10

Pocket Hole Diameter

Cover Tape Width

1.50 Min.

9.20

Cover Tape Thickness

0.065 ±0.010

Max. Component Rotation or Tilt

Devices Per Reel

10° Max.

2500

Reel Diameter

330mm (13")

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

11

Ordering Information

Order Entry Identiﬁer

(example)

Option

R2

Description

FODM452R2

FODM452V

Tape and Reel (2500 per reel)

V

IEC60747-5-2

R2V

FODM452R2V

IEC60747-5-2, Tape and Reel (2500 per reel)

Marking Information

1

2

M452

6

V X YY M

5

3

4

Deﬁnitions

1

Fairchild logo

Device number

2

IEC60747-5-2 mark (Note: Only appears on parts ordered

with VDE option – See order entry table)

3

4

5

6

One digit year code, e.g., ‘7’

Two digit work week ranging from ‘01’ to ‘53’

Assembly package code

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

12

Reﬂow Proﬁle

Max. Ramp-up Rate = 3°C/S

Max. Ramp-down Rate = 6°C/S

T

P

260

240

220

200

180

160

140

120

100

80

t

P

T

L

Tsmax

t

L

Preheat Area

Tsmin

t

s

60

40

20

0

120

Time 25°C to Peak

240

360

Time (seconds)

Proﬁle Freature

Pb-Free Assembly Proﬁle

150°C

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

200°C

Time (t ) from (Tsmin to Tsmax)

60–120 seconds

3°C/second max.

217°C

S

Ramp-up Rate (t to t )

L

P

Liquidous Temperature (T )

L

Time (t ) Maintained Above (T )

60–150 seconds

260°C +0°C / –5°C

30 seconds

L

Peak Body Package Temperature

Time (t ) within 5°C of 260°C

P

Ramp-down Rate (T to T )

6°C/second max.

8 minutes max.

P

L

Time 25°C to Peak Temperature

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

13

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not

intended to be an exhaustive list of all such trademarks.

®

*

AccuPower™

Auto-SPM™

F-PFS™

Power-SPM™

PowerTrench^®

PowerXS™

FRFET^®

The Power Franchise^®

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Global Power Resource^SM

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

Programmable Active Droop™

QFET^®

QS™

TinyBoost™

TinyBuck™

Quiet Series™

RapidConfigure™

™

TinyCalc™

Current Transfer Logic™

DEUXPEED^®

Dual Cool™

TinyLogic^®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

TriFault Detect™

TRUECURRENT™*

" SerDes™

Saving our world, 1mW/W/kW at a time™

SignalWise™

SmartMax™

EcoSPARK^®

n

EfficientMax™

ESBC™

MicroPak™

SMART START™

®

SPM^®

MicroPak2™

MillerDrive™

MotionMax™

Motion-SPM™

OptoHiT™

Fairchild^®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS^®

Fairchild Semiconductor^®

FACT Quiet Series™

FACT^®

OPTOLOGIC^®

UHC^®

FAST^®

OPTOPLANAR^®

Ultra FRFET™

UniFET™

VCX™

FastvCore™

®

SyncFET™

Sync-Lock™

FETBench™

FlashWriter^®

*

PDP SPM™

VisualMax™

XS™

FPS™

* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a)

are intended for surgical implant into the body or (b) support or

sustain life, and (c) whose failure to perform when properly used in

accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their

parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed

applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the

proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild

Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors

are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical

and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.

Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global

problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet

Product Status

Definition

Identification

Datasheet contains the design specifications for product development. Specifications may change

in any manner without notice.

Advance Information

Preliminary

Formative / In Design

First Production

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make

changes at any time without notice to improve the design.

No Identification Needed Full Production

Obsolete Not In Production

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I49

FODM452, FODM453 Rev. 1.0.5

www.fairchildsemi.com

14


型号：	FODM453R2
厂家：	FAIRCHILD SEMICONDUCTOR
描述：	5-Pin Mini Flat Package High Speed Transistor Optocoupler 5引脚微型扁平封装高速晶体管光耦晶体光电晶体管输出元件局域网
文件：	总14页 (文件大小：366K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FODM453R2 [FAIRCHILD]

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